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    • 3. 发明授权
    • Open loop pressure control for injection molding
    • 开模压力控制用于注塑
    • US07559762B2
    • 2009-07-14
    • US11763901
    • 2007-06-15
    • Neil DewarVijay KudchadkarPeter Klobucar
    • Neil DewarVijay KudchadkarPeter Klobucar
    • B29C45/23
    • B29C45/28B29C45/2703B29C45/2806B29C45/30B29C2045/2886B29C2045/2889B29C2045/304B29C2045/306
    • An injection molding system is disclosed having a self-regulating valve for balancing melt flow. The self-regulating valve includes a control rod configured to balance the melt flow rate through a hot runner system. The self-regulating valve reacts to an injection or melt pressure within the hot runner system and a pre-set force provided by an external force device. The self-regulating valve is an open-loop system as it requires neither a measurement of pressure by a sensor nor feedback from a processor in order to regulate the melt flow. The self-regulating valve mechanically reacts to changes in melt pressure on control surfaces thereof by “bobbing” upwards/downwards to decrease/increase the melt flow accordingly. The self-regulating valve compensates for conditions that affect melt pressure, such as an increase/decrease in melt viscosity, changes in melt temperature, and/or mold cavity size without the use of a processing device.
    • 公开了一种具有用于平衡熔体流动的自调节阀的注塑系统。 自调节阀包括配置成平衡通过热流道系统的熔体流动速率的控制杆。 自调节阀对热流道系统内的注入或熔化压力以及由外力装置提供的预设力作出反应。 自调节阀是开环系统,因为它既不需要传感器的压力测量也不需要来自处理器的反馈来调节熔体流动。 自调节阀通过向上/向下“上浮”来相应地降低/增加熔体流动来机械地对其控制表面上的熔体压力的变化作出反应。 自调节阀补偿影响熔体压力的条件,例如熔体粘度的增加/减小,熔体温度的变化和/或模腔尺寸,而不使用处理装置。
    • 6. 发明授权
    • Open loop pressure control for injection molding
    • 开模压力控制用于注塑
    • US07766647B2
    • 2010-08-03
    • US12499211
    • 2009-07-08
    • Neil DewarVijay KudchadkarPeter Klobucar
    • Neil DewarVijay KudchadkarPeter Klobucar
    • B29C45/23
    • B29C45/28B29C45/2703B29C45/2806B29C45/30B29C2045/2886B29C2045/2889B29C2045/304B29C2045/306
    • An injection molding system is disclosed having a self-regulating valve for balancing melt flow. The self-regulating valve includes a control rod configured to balance the melt flow rate through a hot runner system. The self-regulating valve reacts to an injection or melt pressure within the hot runner system and a pre-set force provided by an external force device. The self-regulating valve is an open-loop system as it requires neither a measurement of pressure by a sensor nor feedback from a processor in order to regulate the melt flow. The self-regulating valve mechanically reacts to changes in melt pressure on control surfaces thereof by “bobbing” upwards/downwards to decrease/increase the melt flow accordingly. The self-regulating valve compensates for conditions that affect melt pressure, such as an increase/decrease in melt viscosity, changes in melt temperature, and/or mold cavity size without the use of a processing device.
    • 公开了一种具有用于平衡熔体流动的自调节阀的注塑系统。 自调节阀包括配置成平衡通过热流道系统的熔体流动速率的控制杆。 自调节阀对热流道系统内的注入或熔化压力以及由外力装置提供的预设力作出反应。 自调节阀是开环系统,因为它既不需要传感器的压力测量也不需要来自处理器的反馈来调节熔体流动。 自调节阀通过向上/向下“上浮”来相应地降低/增加熔体流动来机械地对其控制表面上的熔体压力的变化作出反应。 自调节阀补偿影响熔体压力的条件,例如熔体粘度的增加/减小,熔体温度的变化和/或模腔尺寸,而不使用处理装置。
    • 7. 发明申请
    • Open Loop Pressure Control for Injection Molding
    • 注塑成型开环压力控制
    • US20090274787A1
    • 2009-11-05
    • US12499211
    • 2009-07-08
    • Neil DewarVijay KudchadkarPeter Klobucar
    • Neil DewarVijay KudchadkarPeter Klobucar
    • B29C45/77
    • B29C45/28B29C45/2703B29C45/2806B29C45/30B29C2045/2886B29C2045/2889B29C2045/304B29C2045/306
    • An injection molding system is disclosed having a self-regulating valve for balancing melt flow. The self-regulating valve includes a control rod configured to balance the melt flow rate through a hot runner system. The self-regulating valve reacts to an injection or melt pressure within the hot runner system and a pre-set force provided by an external force device. The self-regulating valve is an open-loop system as it requires neither a measurement of pressure by a sensor nor feedback from a processor in order to regulate the melt flow. The self-regulating valve mechanically reacts to changes in melt pressure on control surfaces thereof by “bobbing” upwards/downwards to decrease/increase the melt flow accordingly. The self-regulating valve compensates for conditions that affect melt pressure, such as an increase/decrease in melt viscosity, changes in melt temperature, and/or mold cavity size without the use of a processing device.
    • 公开了一种具有用于平衡熔体流动的自调节阀的注塑系统。 自调节阀包括配置成平衡通过热流道系统的熔体流动速率的控制杆。 自调节阀对热流道系统内的注入或熔化压力以及由外力装置提供的预设力作出反应。 自调节阀是开环系统,因为它既不需要传感器的压力测量也不需要来自处理器的反馈来调节熔体流动。 自调节阀通过向上/向下“上浮”来相应地降低/增加熔体流动来机械地对其控制表面上的熔体压力的变化作出反应。 自调节阀补偿影响熔体压力的条件,例如熔体粘度的增加/减小,熔体温度的变化和/或模腔尺寸,而不使用处理装置。
    • 10. 发明申请
    • Open Loop Pressure Control For Injection Molding
    • 开环压力控制注塑成型
    • US20070292557A1
    • 2007-12-20
    • US11763901
    • 2007-06-15
    • Neil DewarVijay KudchadkarPeter Klobucar
    • Neil DewarVijay KudchadkarPeter Klobucar
    • B29C45/00
    • B29C45/28B29C45/2703B29C45/2806B29C45/30B29C2045/2886B29C2045/2889B29C2045/304B29C2045/306
    • An injection molding system is disclosed having a self-regulating valve for balancing melt flow. The self-regulating valve includes a control rod configured to balance the melt flow rate through a hot runner system. The self-regulating valve reacts to an injection or melt pressure within the hot runner system and a pre-set force provided by an external force device. The self-regulating valve is an open-loop system as it requires neither a measurement of pressure by a sensor nor feedback from a processor in order to regulate the melt flow. The self-regulating valve mechanically reacts to changes in melt pressure on control surfaces thereof by “bobbing” upwards/downwards to decrease/increase the melt flow accordingly. The self-regulating valve compensates for conditions that affect melt pressure, such as an increase/decrease in melt viscosity, changes in melt temperature, and/or mold cavity size without the use of a processing device.
    • 公开了一种具有用于平衡熔体流动的自调节阀的注塑系统。 自调节阀包括配置成平衡通过热流道系统的熔体流动速率的控制杆。 自调节阀对热流道系统内的注入或熔化压力以及由外力装置提供的预设力作出反应。 自调节阀是开环系统,因为它既不需要传感器的压力测量也不需要来自处理器的反馈来调节熔体流动。 自调节阀通过向上/向下“上浮”来相应地降低/增加熔体流动来机械地对其控制表面上的熔体压力的变化作出反应。 自调节阀补偿影响熔体压力的条件,例如熔体粘度的增加/减小,熔体温度的变化和/或模腔尺寸,而不使用处理装置。