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    • 5. 发明申请
    • REELABLE OLED CURTAIN
    • 可折叠OLED幕
    • WO2009136305A1
    • 2009-11-12
    • PCT/IB2009/051687
    • 2009-04-24
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.VAN DE WEIJER, PeterLIFKA, HerbertTANASE, CristinaVERSCHUREN, Coen, A.
    • VAN DE WEIJER, PeterLIFKA, HerbertTANASE, CristinaVERSCHUREN, Coen, A.
    • H01L51/52
    • H01L51/5253H01L51/448H01L2251/5338H01L2251/5361
    • This invention relates to an organic light-emitting or light-absorbing device (20), comprising a light unit (30), a first flexible protection layer (35), and a second flexible protection layer (25). The light unit comprises a flexible bottom layer (24) having at least one first barrier layer (27). A bottom electrode (22) is provided on the flexible bottom layer, and an organic layer stack (21) is deposited on top of the bottom electrode. Furthermore, the organic layer stack is designed to emit or absorb light. The light unit has a top electrode (23) arranged on top of the organic layer stack and at least one second barrier (28) layer provided on top of the top electrode. The first flexible protection layer and the second flexible protection layer are arranged to encase the light unit, such that a large-area support structure is provided for the device. The large-area support structure provides a reelable organic light-emitting or light- absorbing device. The invention applies to flexibility and a method of adjusting this flexibility to the specific demands of specific large-area applications, such as space partition devices and roller blinds.
    • 本发明涉及一种有机发光或光吸收装置(20),其包括光单元(30),第一柔性保护层(35)和第二柔性保护层(25)。 光单元包括具有至少一个第一阻挡层(27)的柔性底层(24)。 底部电极(22)设置在柔性底层上,并且有机层叠层(21)沉积在底部电极的顶部上。 此外,有机层堆叠被设计成发射或吸收光。 光单元具有设置在有机层堆叠的顶部上的顶部电极(23)和设置在顶部电极的顶部上的至少一个第二屏障(28)层。 第一柔性保护层和第二柔性保护层被布置成包围光单元,使得为该装置提供大面积的支撑结构。 大面积支撑结构提供了可卷绕的有机发光或吸光装置。 本发明适用于灵活性以及根据特定大面积应用(如空间分隔装置和卷帘)的具体要求调整这种灵活性的方法。
    • 10. 发明申请
    • ENCAPSULATION FOR AN ELECTRONIC THIN FILM DEVICE
    • 电子薄膜装置的封装
    • WO2008142645A1
    • 2008-11-27
    • PCT/IB2008/051987
    • 2008-05-21
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.TNO NEDERLANDSE ORGANISATIE VOOR TOEGEPAST WETENSCHAPPELIJK ONDERZOEKHACK, Martinus, J., J.BERNARDS, Thomas, N., M.VAN DE WEIJER, Peter
    • HACK, Martinus, J., J.BERNARDS, Thomas, N., M.VAN DE WEIJER, Peter
    • H01L51/52
    • H01L51/5256
    • The present invention relates to an encapsulation for an electronic thin film device, comprising a first barrier layer (108), a second barrier layer (112), and a first planarization layer (110') for reducing the formation of pinholes in a subsequent barrier layer, said first planarization layer (110') arranged between the first barrier layer (108) and the second barrier layer (112), wherein the first planarization layer (110') is composed of a first plurality of planarization segment (114) having areas formed between each other, and the encapsulation further comprises a second planarization layer (116) arranged between the second barrier layer (112) and a third barrier layer (120), wherein the second planarization layer (116) is composed of a second plurality of planarization segments (118) arranged to extend over the areas between the first plurality of planarization segments (114), thereby further reducing the number of pinholes providing passageways through the encapsulation. According to the invention, by arranging the barrier layers and the planarization layers in a horizontal multi-layer encapsulation stack, where planarization segments in each of the layers are essentially decoupled from each other and in practice non-interconnecting with each other, it is possible to limit the lateral transportation of water and oxygen through the planarization layer. Instead, if water/oxygen enters the top barrier layer, and eventually a planarization segment, it is contained in the "sphere" of a planarization segment, having a minimized possibility of entering a pinhole in a subsequent barrier layer. The present invention also relates to corresponding method for the formation of an encapsulation for an electronic thin film device.
    • 本发明涉及一种用于电子薄膜器件的封装,其包括第一阻挡层(108),第二阻挡层(112)和用于减少随后屏障中针孔形成的第一平坦化层(110') 层,所述第一平坦化层(110')布置在所述第一阻挡层(108)和所述第二阻挡层(112)之间,其中所述第一平坦化层(110')由第一多个平坦化段(114) 所述封装还包括布置在所述第二阻挡层(112)和第三阻挡层(120)之间的第二平坦化层(116),其中所述第二平坦化层(116)由第二多层 布置成在第一多个平坦化段(114)之间的区域上延伸的平坦化段(118),从而进一步减少提供通过封装的通路的针孔的数量。 根据本发明,通过在水平多层封装堆叠中布置势垒层和平坦化层,其中每个层中的平坦化部分基本上彼此分离并且实际上彼此不互连,这是可能的 以限制通过平坦化层的水和氧的横向运输。 相反,如果水/氧进入顶部阻挡层,并且最终进入平坦化段,则其被包含在平坦化段的“球体”中,具有在随后的阻挡层中进入针孔的最小可能性。 本发明还涉及用于形成电子薄膜器件封装的相应方法。