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1. 发明授权

US08151351B1 Apparatus, method and computer program product for detection of a security breach in a network 有权
标题翻译：用于检测网络中安全漏洞的装置，方法和计算机程序产品
公开(公告)号：US08151351B1
公开(公告)日：2012-04-03
申请号：US13013294
申请日：2011-01-25
申请人： Peter Loc , Tyson Leistiko , Hedley Rainnie
发明人： Peter Loc , Tyson Leistiko , Hedley Rainnie
IPC分类号： H04L29/06
CPC分类号： H04L63/1416 , H04L63/0428 , H04W12/12
摘要： A method for detecting a security breach in a network comprises at one of a plurality of transceivers each having a different media access control address, receiving a signal from an access point, the signal representing one or more packets of data, determining a source media access control address for each of the packets, and alerting the access point when the source media access control address of one of the packets is the media access control address of the transceiver.
摘要翻译：用于检测网络中的安全漏洞的方法包括：多个收发器之一，每个收发器具有不同的媒体访问控制地址，从接入点接收信号，表示一个或多个数据分组的信号，确定源媒体访问每个分组的控制地址，并且当其中一个分组的源媒体访问控制地址是收发器的媒体访问控制地址时，提示接入点。

2. 发明授权

US07586199B1 Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types 有权
标题翻译：用于多种封装类型的组态和集成电路的结构，架构，系统，方法，算法和软件
公开(公告)号：US07586199B1
公开(公告)日：2009-09-08
申请号：US11372865
申请日：2006-03-09
申请人： Tyson Leistiko , Huahung Kao
发明人： Tyson Leistiko , Huahung Kao
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/05 , H01L23/5222 , H01L24/13 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/0401 , H01L2224/04042 , H01L2224/05011 , H01L2224/05015 , H01L2224/05022 , H01L2224/05124 , H01L2224/05138 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05562 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/13007 , H01L2224/13028 , H01L2224/13111 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad. The present invention advantageously provides reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer level for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.
摘要翻译：结构，架构，系统，集成电路，用于配置用于多种封装类型的集成电路和/或选择用于集成电路的多种封装类型之一的集成电路，方法和软件。该结构通常包括凸块焊盘，被配置为独立地电连接到凸块焊盘的多个接合焊盘以及多个导电迹线，每个导电迹线适于电连接到焊盘的焊盘之一。该软件通常被配置为放置和路由这种结构的组件。配置的方法通常包括从最上层的金属层形成凸块焊盘，接合焊盘和导电迹线以及在其上形成绝缘层的步骤。选择的方法通常包括最上面的金属层形成步骤，并且形成（i）至少一个接合焊盘的引线接合，或（ii）凸起金属，其被配置为电连接至少一个接合焊盘到碰撞垫。本发明有利地通过使得一个装置能够在晶片级制造多个不同的包装选项来有利地降低制造成本并减少库存管理问题，从而使制造过程中稍后可进行包装决定。

3. 发明授权

US08605633B1 Frame/packet-based calibration for wireless transceivers 有权
标题翻译：无线收发器的帧/分组校准
公开(公告)号：US08605633B1
公开(公告)日：2013-12-10
申请号：US12907837
申请日：2010-10-19
申请人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
发明人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
IPC分类号： H04B7/00 , H04B7/216
CPC分类号： H04W56/003 , H04B1/40 , H04B17/21
摘要： A transceiver including a transceiver component with a first and second inputs and an output. The transceiver is configured to (i) receive an input signal having packets via the first input and (ii) generate output signals at the output based on the input signal. The transceiver further includes a first comparator configured to compare the output signals and generate a first comparison signal; a register configured to store the first comparison signal; a calibration circuit is configured to generate a current signal based on the first comparison signal to adjust a current in the transceiver component; and a signal generator is configured to generate a reference signal based on the current signal. The transceiver component is configured to (i) based on the current signal, adjust a performance parameter of the transceiver at times synchronized with the packets and (ii) generate the output signals based on the current signal and the reference signal.
摘要翻译：收发器，包括具有第一和第二输入和输出的收发器组件。收发器被配置为（i）经由第一输入接收具有分组的输入信号，以及（ii）基于输入信号在输出端生成输出信号。收发器还包括第一比较器，其被配置为比较输出信号并产生第一比较信号; 配置为存储第一比较信号的寄存器; 校准电路被配置为基于第一比较信号产生电流信号以调整收发器部件中的电流; 并且信号发生器被配置为基于当前信号产生参考信号。收发器组件被配置为（i）基于当前信号，在与分组同步的时间调整收发器的性能参数，以及（ii）基于当前信号和参考信号生成输出信号。

4. 发明授权

US07817998B1 Frame/packet-based calibration for wireless transceivers 有权
标题翻译：无线收发器的帧/分组校准
公开(公告)号：US07817998B1
公开(公告)日：2010-10-19
申请号：US11322019
申请日：2005-12-29
申请人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
发明人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
IPC分类号： H04M7/20
CPC分类号： H04W56/003 , H04B1/40 , H04B17/21
摘要： A packet-based wireless transceiver that transmits and receives data packets comprises a receiver including a mixer that converts signal frequencies and a baseband circuit that communicates with the mixer and that includes an amplifier. A receiver voltage offset calibration circuit adjusts a receiver voltage offset at the baseband circuit at times synchronized with the data packets and includes a calibration signal generator that outputs calibration signals to first and second inputs of the baseband circuit and a calibration adjustment circuit that communicates with the calibration signal generator and that adjusts the calibration signal to reduce the voltage offset based on an output of the amplifier.
摘要翻译：发送和接收数据分组的基于分组的无线收发器包括接收机，该接收机包括转换信号频率的混频器和与混频器通信并包括放大器的基带电路。接收机电压偏移校准电路在与数据分组同步的同时调整基带电路的接收机电压偏移，并且包括将校准信号输出到基带电路的第一和第二输入的校准信号发生器以及与基带电路通信的校准调节电路校准信号发生器，并且根据放大器的输出调整校准信号以减小电压偏移。

5. 发明授权

US07006824B1 Frame/packet-based calibration for wireless transceivers 有权
标题翻译：无线收发器的帧/分组校准
公开(公告)号：US07006824B1
公开(公告)日：2006-02-28
申请号：US10238475
申请日：2002-09-10
申请人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
发明人： Lawrence Tse , King Chun Tsai , George Chien , Tyson Leistiko
IPC分类号： H04B1/44 , H04B7/00 , H04Q7/20
CPC分类号： H04W56/003 , H04B1/40 , H04B17/21
摘要： A packet-based wireless transceiver that transmits and receives data packets includes a transceiver component having an adjustable performance parameter. A calibration circuit adjusts the performance parameter of the transceiver component at times synchronized with the data packets. A calibration signal generator generates calibration signals based on the performance parameter and outputs the calibration signals to the transceiver component. A comparator receives the outputs of the transceiver component and generates a difference signal. A calibration adjustment circuit communicates with the calibration signal generator and the comparator and adjusts the performance parameter to reduce the difference signal. Alternately, a reference signal generator generates a reference signal. A comparator receives the reference signal and a second signal from the transceiver component and generates a difference signal. A calibration adjustment circuit adjusts the performance parameter of the transceiver to reduce the difference signal.
摘要翻译：发送和接收数据分组的基于分组的无线收发器包括具有可调整性能参数的收发机组件。校准电路在与数据包同步的同时调整收发器组件的性能参数。校准信号发生器根据性能参数生成校准信号，并将校准信号输出到收发器组件。比较器接收收发器部件的输出并产生差分信号。校准调节电路与校准信号发生器和比较器通信，并调整性能参数以减小差分信号。或者，参考信号发生器产生参考信号。比较器从收发器部件接收参考信号和第二信号，并产生差分信号。校准调整电路调整收发器的性能参数以减小差分信号。

6. 发明授权

US08455347B1 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types 有权
标题翻译：用于为多种封装类型配置集成电路的结构，架构，系统，方法，算法和软件
公开(公告)号：US08455347B1
公开(公告)日：2013-06-04
申请号：US13154180
申请日：2011-06-06
申请人： Tyson Leistiko , Huahung Kao
发明人： Tyson Leistiko , Huahung Kao
IPC分类号： H01L21/4763
CPC分类号： H01L24/05 , H01L23/5222 , H01L24/13 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/0401 , H01L2224/04042 , H01L2224/05011 , H01L2224/05015 , H01L2224/05022 , H01L2224/05124 , H01L2224/05138 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05562 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/13007 , H01L2224/13028 , H01L2224/13111 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad. The present invention advantageously provides reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer level for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.
摘要翻译：结构，架构，系统，集成电路，用于配置用于多种封装类型的集成电路和/或选择用于集成电路的多种封装类型之一的集成电路，方法和软件。该结构通常包括凸块焊盘，被配置为独立地电连接到凸块焊盘的多个接合焊盘以及多个导电迹线，每个导电迹线适于电连接到焊盘的焊盘之一。该软件通常被配置为放置和路由这种结构的组件。配置的方法通常包括从最上层的金属层形成凸块焊盘，接合焊盘和导电迹线以及在其上形成绝缘层的步骤。选择的方法通常包括最上面的金属层形成步骤，并且形成（i）至少一个接合焊盘的引线接合，或（ii）凸起金属，其被配置为电连接至少一个接合焊盘到碰撞垫。本发明有利地通过使得一个装置能够在晶片级上制造多个不同的包装选项来有利地降低制造成本和减少库存管理问题，从而使制造过程中稍后可进行包装决定。

7. 发明授权

US08405220B1 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types 有权
标题翻译：用于为多种封装类型配置集成电路的结构，架构，系统，方法，算法和软件
公开(公告)号：US08405220B1
公开(公告)日：2013-03-26
申请号：US11867615
申请日：2007-10-04
申请人： Wayne Loeb , Tyson Leistiko , Huahung Kao
发明人： Wayne Loeb , Tyson Leistiko , Huahung Kao
IPC分类号： H01L23/48
CPC分类号： H01L23/4952 , H01L23/49816 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/0401 , H01L2224/04042 , H01L2224/05011 , H01L2224/05015 , H01L2224/05022 , H01L2224/05124 , H01L2224/05138 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05551 , H01L2224/05554 , H01L2224/05555 , H01L2224/05557 , H01L2224/05558 , H01L2224/05562 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/13007 , H01L2224/13028 , H01L2224/13111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014
摘要： Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises forming the uppermost metal layer, and forming either a wire bond to at least one of the bond pads, or a ball bond or solder ball to electrically connect the bump pad section. Embodiments of the present invention may advantageously provide reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer fab for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.
摘要翻译：结构，架构，系统，集成电路，用于配置用于多种封装类型的集成电路和/或选择用于集成电路的多种封装类型之一的集成电路，方法和软件。该结构通常包括具有多个电气断开的凸块焊盘部分的凸块焊盘，多个焊接接头，每个接合焊盘都被配置为电连接到一个凸块焊盘部分，以及多个导电迹线，每个导电迹线适于电连接接合焊盘到一个凸块焊盘部分。该软件通常被配置为放置和路由这种结构的组件。配置的方法通常包括从最上层的金属层形成凸块焊盘，接合焊盘和导电迹线以及在其上形成绝缘层的步骤。选择的方法通常包括形成最上面的金属层，并且形成与至少一个接合焊盘或焊球或焊球的引线接合以电连接凸块焊盘部分。本发明的实施例可有利地提供降低的制造成本和减少的库存管理问题，使得能够在用于多个不同包装选项的晶圆厂中制造一个装置，从而使得能够在制造过程的稍后时间进行封装决定。

8. 发明授权

US07956474B1 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types 有权
标题翻译：用于为多种封装类型配置集成电路的结构，架构，系统，方法，算法和软件
公开(公告)号：US07956474B1
公开(公告)日：2011-06-07
申请号：US12542619
申请日：2009-08-17
申请人： Tyson Leistiko , Huahung Kao
发明人： Tyson Leistiko , Huahung Kao
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/05 , H01L23/5222 , H01L24/13 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/0401 , H01L2224/04042 , H01L2224/05011 , H01L2224/05015 , H01L2224/05022 , H01L2224/05124 , H01L2224/05138 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05562 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/13007 , H01L2224/13028 , H01L2224/13111 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad. The present invention advantageously provides reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer level for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.
摘要翻译：结构，架构，系统，集成电路，用于配置用于多种封装类型的集成电路和/或选择用于集成电路的多种封装类型之一的集成电路，方法和软件。该结构通常包括凸块焊盘，被配置为独立地电连接到凸块焊盘的多个接合焊盘以及多个导电迹线，每个导电迹线适于电连接到焊盘的焊盘之一。该软件通常被配置为放置和路由这种结构的组件。配置的方法通常包括从最上层的金属层形成凸块焊盘，接合焊盘和导电迹线以及在其上形成绝缘层的步骤。选择的方法通常包括最上面的金属层形成步骤，并且形成（i）至少一个接合焊盘的引线接合，或（ii）凸起金属，其被配置为电连接至少一个接合焊盘到碰撞垫。本发明有利地通过使得一个装置能够在晶片级上制造多个不同的包装选项来有利地降低制造成本和减少库存管理问题，从而使制造过程中稍后可进行包装决定。

9. 发明授权

US07877805B1 Apparatus, method and computer program product for detection of a security breach in a network 有权
标题翻译：用于检测网络中安全漏洞的装置，方法和计算机程序产品
公开(公告)号：US07877805B1
公开(公告)日：2011-01-25
申请号：US11818104
申请日：2007-06-13
申请人： Peter Loc , Tyson Leistiko , Hedley Rainnie
发明人： Peter Loc , Tyson Leistiko , Hedley Rainnie
IPC分类号： G06F21/00
CPC分类号： H04L63/1416 , H04L63/0428 , H04W12/12
摘要： A method for detecting a security breach in a network comprises at one of a plurality of transceivers each having a different media access control address, receiving a signal from an access point, the signal representing one or more packets of data, determining a source media access control address for each of the packets, and alerting the access point when the source media access control address of one of the packets is the media access control address of the transceiver.
摘要翻译：用于检测网络中的安全漏洞的方法包括：多个收发器之一，每个收发器具有不同的媒体访问控制地址，从接入点接收信号，表示一个或多个数据分组的信号，确定源媒体访问每个分组的控制地址，并且当其中一个分组的源媒体访问控制地址是收发器的媒体访问控制地址时，提示接入点。

10. 发明授权

US07293289B1 Apparatus, method and computer program product for detection of a security breach in a network 有权
标题翻译：用于检测网络中安全漏洞的装置，方法和计算机程序产品
公开(公告)号：US07293289B1
公开(公告)日：2007-11-06
申请号：US10242135
申请日：2002-09-10
申请人： Peter Loc , Tyson Leistiko , Hedley Rainnie
发明人： Peter Loc , Tyson Leistiko , Hedley Rainnie
IPC分类号： G08B23/00
CPC分类号： H04L63/1416 , H04L63/0428 , H04W12/12
摘要： A method, apparatus, and computer-readable media for detecting a security breach in a network comprising an access point and a plurality of transceivers each having a different media access control address comprises, at one of the transceivers, receiving a signal from the access point, the signal representing one or more packets of data; determining a source media access control address for each of the packets; and transmitting an alert packet to the access point when the source media access control address of one of the packets is the media access control address of the transceiver.
摘要翻译：一种用于检测网络中的安全漏洞的方法，装置和计算机可读介质，包括接入点和每个具有不同媒体访问控制地址的多个收发器，包括在所述收发机之一接收来自所述接入点的信号，表示一个或多个数据包的信号; 确定每个分组的源媒体访问控制地址; 以及当所述分组之一的源媒体访问控制地址是所述收发机的媒体访问控制地址时，向所述接入点发送警报包。

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