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1. 发明申请

US20100022174A1 Grinding tool and method for fabricating the same 审中-公开
标题翻译：研磨工具及其制造方法
公开(公告)号：US20100022174A1
公开(公告)日：2010-01-28
申请号：US12219710
申请日：2008-07-28
申请人： Jui-Lin Chou , Tung-liang Liao , Yung-Chuan Chen
发明人： Jui-Lin Chou , Tung-liang Liao , Yung-Chuan Chen
IPC分类号： B23F21/02 , B24D11/00
CPC分类号： B24D18/0009 , B24D3/002 , B24D11/001
摘要： The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to fit precisely and be retained on the adjustment surface of the mold by a binder; (C) forming an adhesive layer on the non-working surface of the grinding plate; (D) disposing the backplane on a surface of the adhesive layer to retain the backplane over the non-working surface of the grinding plate by the adhesive layer; and (E) removing the binder to separate the mold from the grinding plate. Accordingly, the present invention can significantly improve the precision and lifetime of products, reduce the cost of production, and enhance the machining efficiency.
摘要翻译：磨削工具及其制造方法技术领域本发明涉及一种研磨工具及其制造方法。该方法包括：（A）提供具有工作表面和非工作表面的研磨板，具有调节表面的模具和背板; （B）使研磨板的工作表面精确配合，并通过粘合剂保持在模具的调节表面上; （C）在研磨板的非工作表面上形成粘合剂层; （D）将所述背板设置在所述粘合剂层的表面上，以通过所述粘合剂层将所述背板保持在所述研磨板的非工作表面上; 和（E）去除粘合剂以将模具与研磨板分离。因此，本发明可以显着提高产品的精度和寿命，降低生产成本，提高加工效率。

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