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    • 1. 发明授权
    • Method of forming a lamination film pattern and improved lamination film pattern
    • 形成层压膜图案和改进的层压膜图案的方法
    • US07554207B2
    • 2009-06-30
    • US11295462
    • 2005-12-07
    • Tsuyoshi KatohSyuusaku KidoAkitoshi Maeda
    • Tsuyoshi KatohSyuusaku KidoAkitoshi Maeda
    • H01L29/40
    • G02F1/136286G02F2001/136295H01L27/12H01L27/124
    • In a method of forming an electrically conductive lamination pattern, an insulating film is formed on a surface of a chromium-containing bottom layer, before an aluminum-containing top layer is formed over the insulating film, so that the insulating film separates the aluminum-containing top layer from the chromium-containing bottom layer. A first selective wet etching process is carried out for selectively etching the aluminum-containing top layer with a first etchant. A second selective wet etching process is carried out for selectively etching the chromium-containing bottom layer with a second etchant in the presence the insulating film which suppresses a hetero-metal-contact-potential-difference between the chromium-containing bottom layer and the aluminum-containing top layer during the second selective wet etching process.
    • 在形成导电层叠图案的方法中,在含铬顶层形成在绝缘膜上之前,在含铬底层的表面上形成绝缘膜,使得绝缘膜将铝 - 含有来自含铬底层的顶层。 进行第一选择性湿式蚀刻工艺,以用第一蚀刻剂选择性地蚀刻含铝顶层。 进行第二选择性湿式蚀刻工艺,以在存在绝缘膜的情况下用第二蚀刻剂选择性地蚀刻含铬底层,该绝缘膜抑制含铬底层和铝之间的异质金属接触电位差 在第二选择性湿蚀刻工艺期间。