专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09493870B2 Radio wave-transmitting decorative film and decorative member using same 有权
标题翻译：无线电波传播装饰膜和使用其的装饰构件
公开(公告)号：US09493870B2
公开(公告)日：2016-11-15
申请号：US13256643
申请日：2010-03-15
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： B32B9/04 , C23C14/20 , B32B27/08
CPC分类号： C23C14/20 , B32B7/12 , B32B27/08 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/325 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2250/24 , B32B2255/10 , B32B2255/205 , B32B2307/20 , B32B2307/406 , B32B2307/412 , B32B2307/416 , B32B2307/732 , B32B2451/00
摘要： Disclosed are a low-cost radio wave-transmitting decorative film which has excellent stretch moldability, radio wave transmissibility, and mirror-like metallic gloss that does not easily disappear, and a decorative member employing the radio wave-transmitting decorative film. Specifically disclosed are a decorative film which includes a first polymer film, a second polymer film, and a light-reflecting layer which is arranged between the polymer films and formed by the physical vapor deposition of an alloy of silicon and a metal, and a decorative member in which the decorative film is provided on the surface of a base.
摘要翻译：公开了一种低成本的不易于消失的拉伸成型性，无线电波传播性和镜面状金属光泽的无线电波传播装饰膜，以及采用无线电波透过装饰膜的装饰部件。具体公开了一种装饰膜，其包括第一聚合物膜，第二聚合物膜和光反射层，其布置在聚合物膜之间并通过硅和金属的合金的物理气相沉积形成，并且具有装饰性其中装饰膜设置在基座的表面上的构件。

2. 发明授权

US08416029B2 Transmission noise suppressing structure and wiring circuit board 有权
标题翻译：传输噪声抑制结构和布线电路板
公开(公告)号：US08416029B2
公开(公告)日：2013-04-09
申请号：US12671304
申请日：2008-08-01
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H04B3/28 , H01P3/08
CPC分类号： H01P3/08 , H05K1/0234 , H05K1/167 , H05K2201/09236 , H05K2201/09318 , H05K2201/09336 , H05K2201/09672
摘要： The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.
摘要翻译：本发明提供一种传输噪声抑制结构和布线板，其能够抑制通过电源线传输的传输噪声，稳定电源电压，以及减少通过电源线或接地层传输的信号传输线串扰，而不会受电阻层影响。传输噪声抑制结构包括在同一表面上彼此分开布置的电源线和信号传输线; 与电源线和信号传输线分开设置的接地层; 以及与电源线和接地层分开布置的电阻层。电阻层具有面向电源线的区域（I）和不面向电源线的区域（II）。电阻层和信号传输线彼此分开。

3. 发明授权

US08134084B2 Noise-suppressing wiring-member and printed wiring board 有权
标题翻译：噪声抑制布线构件和印刷线路板
公开(公告)号：US08134084B2
公开(公告)日：2012-03-13
申请号：US11769386
申请日：2007-06-27
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga , Mitsuaki Negishi
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga , Mitsuaki Negishi
IPC分类号： H05K1/11
CPC分类号： H05K1/0234 , H05K1/0298 , H05K1/167 , H05K2201/0191 , H05K2201/0317 , H05K2201/0326 , H05K2201/093 , H05K2201/09309
摘要： The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.
摘要翻译：布线构件本发明涉及一种布线构件，其包括：具有表面粗糙度Rz为2μm以下的光滑表面的铜箔层; 含有金属材料或导电陶瓷的噪声抑制层，其厚度为5〜200nm; 以及设置在铜箔层的光滑表面和噪声抑制层之间的绝缘树脂层，并且还涉及配备有配线构件的印刷线路板。此外，本发明涉及一种噪声抑制结构，包括：第一导电层; 第二导电层; 设置在第一导电层和第二导电层之间的噪声抑制层，噪声抑制层与第一导电层电磁耦合，噪声抑制层包括金属材料或导电陶瓷，噪声抑制层具有5〜300nm的厚度; 设置在所述第一导电层和所述噪声抑制层之间的第一绝缘层; 以及设置在所述第二导电层和所述噪声抑制层之间的第二绝缘层; 其中所述噪声抑制结构具有：所述噪声抑制层和所述第一导电层彼此面对的区域（I）; 以及区域（I）和（II）彼此相邻的区域（II），其中噪声抑制层和第一导电层彼此不相对，但是噪声抑制层和第二导电层彼此面对。

4. 发明申请

US20110308841A1 COVERLAY FILM, METHOD FOR MANUFACTURING COVERLAY FILM, AND FLEXIBLE PRINTED WIRING BOARD 有权
标题翻译：覆盖膜，制造覆膜的方法和柔性印刷线路板
公开(公告)号：US20110308841A1
公开(公告)日：2011-12-22
申请号：US13203855
申请日：2010-03-04
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H05K1/00 , B05D5/12 , C23C16/44 , B32B3/00
CPC分类号： H05K1/0218 , H05K1/0393 , H05K3/281 , H05K2201/0317 , Y10T428/24355
摘要： Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.
摘要翻译：提供：具有电磁波屏蔽功能和优异的柔性的覆盖膜能够减少柔性印刷线路板的厚度，并且消除了将用于屏蔽电磁噪声的层连接到接地电路的接地电路柔性印刷线路板; 其制造方法; 和柔性印刷电路板。使用的是覆盖膜，其包括：在一个表面的至少一部分上形成有粗糙表面（纹理表面）和除粗糙表面之外的未粗化表面（非纹理表面）的基材膜; 以及由导电材料制成的沉积膜，其形成在已经形成粗糙表面的一侧的基材膜的表面上。

5. 发明申请

US20100201459A1 TRANSMISSION NOISE SUPPRESSING STRUCTURE AND WIRING CIRCUIT BOARD 有权
标题翻译：传输噪声抑制结构和接线电路板
公开(公告)号：US20100201459A1
公开(公告)日：2010-08-12
申请号：US12671304
申请日：2008-08-01
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H01P1/20
CPC分类号： H01P3/08 , H05K1/0234 , H05K1/167 , H05K2201/09236 , H05K2201/09318 , H05K2201/09336 , H05K2201/09672
摘要： The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.
摘要翻译：本发明提供一种传输噪声抑制结构和布线板，其能够抑制通过电源线传输的传输噪声，稳定电源电压，以及减少通过电源线或接地层传输的信号传输线串扰，而不会受电阻层影响。传输噪声抑制结构包括在同一表面上彼此分开布置的电源线和信号传输线; 与电源线和信号传输线分开设置的接地层; 以及与电源线和接地层分开布置的电阻层。电阻层具有面向电源线的区域（I）和不面向电源线的区域（II）。电阻层和信号传输线彼此分开。

6. 发明授权

US09187820B2 Radio wave transmitting decorative member 有权
标题翻译：无线电波传输装饰构件
公开(公告)号：US09187820B2
公开(公告)日：2015-11-17
申请号：US12678375
申请日：2008-09-18
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H01Q1/00 , C23C14/20 , B32B15/08
CPC分类号： C23C14/205
摘要： There is provided a radio wave transmitting decorative member which has radio wave transmitting properties as well as mirror-surface like metallic luster, the radio wave transmitting decorative member which hardly loses its metallic luster and which can be produced at a low cost. More specifically, disclosed is a radio wave transmitting decorative member including a substrate, and a light reflecting layer provided on top of the substrate and formed of an alloy composed of either silicon or germanium and a metal, wherein the light reflecting layer is preferably a deposition film formed by a physical vapor deposition of an alloy composed of either silicon or germanium and a metal.
摘要翻译：本发明提供一种无线电波传输装饰构件，其具有无线电波传输性能以及像金属光泽的镜面，无线电波传输装饰构件几乎不会失去其金属光泽并且可以以低成本制造。更具体地，公开了一种无线电波发送装饰构件，其包括基板和设置在基板的顶部上并由由硅或锗组成的合金和金属形成的光反射层，其中光反射层优选为沉积通过物理气相沉积由硅或锗组成的合金和金属形成的膜。

7. 发明授权

US09018533B2 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board 有权
标题翻译：覆盖膜，覆盖膜制造方法和柔性印刷线路板
公开(公告)号：US09018533B2
公开(公告)日：2015-04-28
申请号：US13203855
申请日：2010-03-04
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K3/28
CPC分类号： H05K1/0218 , H05K1/0393 , H05K3/281 , H05K2201/0317 , Y10T428/24355
摘要： Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.
摘要翻译：提供：具有电磁波屏蔽功能和优异的柔性的覆盖膜能够减少柔性印刷线路板的厚度，并且消除了将用于屏蔽电磁噪声的层连接到接地电路的接地电路柔性印刷线路板; 其制造方法; 和柔性印刷电路板。使用的是覆盖膜，其包括：在一个表面的至少一部分上形成有粗糙表面（纹理表面）和除粗糙表面之外的未粗化表面（非纹理表面）的基材膜; 以及由导电材料制成的沉积膜，其形成在已经形成粗糙表面的一侧的基材膜的表面上。

8. 发明授权

US09006581B2 Printed wiring board and method of manufacture thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09006581B2
公开(公告)日：2015-04-14
申请号：US13639640
申请日：2011-04-11
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga , Hiroyuki Yasuda
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga , Hiroyuki Yasuda
IPC分类号： H05K1/03 , H05K1/00 , H05K1/09 , H05K9/00 , H05K1/02
CPC分类号： H05K1/0218 , H05K1/0234 , H05K1/0242 , H05K1/0393 , H05K2201/0133 , H05K2201/0715 , H05K2201/09736
摘要： A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
摘要翻译：一种印刷线路板，包括分别具有在绝缘层的至少一个表面上进行电磁波屏蔽的物体导体的印刷布线构件; 以及电磁波屏蔽构件，其在基膜的至少一个表面上具有由低电阻部分和高电阻部分构成的电磁波屏蔽层。印刷线路构件和电磁波屏蔽构件通过插入绝缘粘合剂层而被接合在一起，并且电磁波屏蔽层的布置分开地和相对地布置，使得物体导体被覆盖。电磁波屏蔽层和物体导体由相同类型的导电材料构成，并且电磁波屏蔽层不在印刷线路板的周向端面处露出。

9. 发明申请

US20080049410A1 NOISE-SUPPRESSING WIRING-MEMBER AND PRINTED WIRING BOARD 有权
标题翻译：噪声抑制接线构件和打印接线板
公开(公告)号：US20080049410A1
公开(公告)日：2008-02-28
申请号：US11769386
申请日：2007-06-27
申请人： Toshiyuki KAWAGUCHI , Kazutoki TAHARA , Tsutomu SAGA , Mitsuaki NEGISHI
发明人： Toshiyuki KAWAGUCHI , Kazutoki TAHARA , Tsutomu SAGA , Mitsuaki NEGISHI
IPC分类号： H05K9/00
CPC分类号： H05K1/0234 , H05K1/0298 , H05K1/167 , H05K2201/0191 , H05K2201/0317 , H05K2201/0326 , H05K2201/093 , H05K2201/09309
摘要： The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.
摘要翻译：布线构件技术领域本发明涉及一种布线构件，其包括：具有表面粗糙度Rz为2μm以下的光滑表面的铜箔层; 含有金属材料或导电陶瓷的噪声抑制层，其厚度为5〜200nm; 以及设置在铜箔层的光滑表面和噪声抑制层之间的绝缘树脂层，并且还涉及配备有配线构件的印刷线路板。此外，本发明涉及一种噪声抑制结构，包括：第一导电层; 第二导电层; 设置在第一导电层和第二导电层之间的噪声抑制层，噪声抑制层与第一导电层电磁耦合，噪声抑制层包括金属材料或导电陶瓷，噪声抑制层具有5〜300nm的厚度; 设置在所述第一导电层和所述噪声抑制层之间的第一绝缘层; 以及设置在所述第二导电层和所述噪声抑制层之间的第二绝缘层; 其中所述噪声抑制结构具有：所述噪声抑制层和所述第一导电层彼此面对的区域（I）; 以及区域（I）和（II）彼此相邻的区域（II），其中噪声抑制层和第一导电层彼此不相对，但是噪声抑制层和第二导电层彼此面对。

10. 发明授权

US08507801B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US08507801B2
公开(公告)日：2013-08-13
申请号：US13059497
申请日：2009-08-18
申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
发明人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
IPC分类号： H05K1/00
CPC分类号： H05K1/0234 , H05K1/0218 , H05K1/167 , H05K3/281 , H05K3/386 , H05K3/4652 , H05K2201/0209 , H05K2201/2036 , Y10T428/24331 , Y10T428/24917 , Y10T428/31678 , Y10T428/31935
摘要： A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.
摘要翻译：通过粘合层将具有形成在覆盖膜体的表面上的电阻层的覆盖层膜粘附到具有形成在基板表面上的导电层的印刷线路板主体而形成印刷布线板。电阻层通过粘合剂层与导电层分离并与之相对。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式