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    • 1. 发明授权
    • Method, apparatus and system for mapping pipeline
    • 用于映射管道的方法,装置和系统
    • US08661909B2
    • 2014-03-04
    • US13219776
    • 2011-08-29
    • Hao-Hua ChuTsung-Te LaiYu-Han ChenPolly Huang
    • Hao-Hua ChuTsung-Te LaiYu-Han ChenPolly Huang
    • G01L7/00
    • G01M3/005F16L55/28F16L55/48F16L2101/30G01M3/2807
    • The present invention provides an apparatus for mapping pipeline for use in a fluid pipeline, comprising: a pressure gauge that measures the pressure of the fluid in the fluid pipeline; a gyroscope that measures the angular velocity of the apparatus for mapping pipeline in the fluid pipeline; a processing module that collects and converts the pressure of the fluid and the angular velocity to a pressure data and an angular velocity data, respectively; and a data output module that outputs the pressure data and the angular velocity data. The present invention also provides a method for mapping pipeline and a system using the same that obtain the spatial layout of the fluid pipeline by analyzing the pressure data and the angular velocity data.
    • 本发明提供一种用于映射用于流体管道的管道的装置,包括:压力计,其测量流体管道中的流体的压力; 陀螺仪,其测量用于在流体管线中映射管线的装置的角速度; 处理模块,其将流体的压力和角速度分别收集并转换成压力数据和角速度数据; 以及输出压力数据和角速度数据的数据输出模块。 本发明还提供了一种用于映射管道的方法和使用该方法的系统,其通过分析压力数据和角速度数据来获得流体管道的空间布局。
    • 2. 发明申请
    • HEATING SYSTEM FOR HEATING SEMICONDUCTOR MATERIAL DISPOSED IN A CRUCIBLE
    • 用于加热可溶性半导体材料的加热系统
    • US20130284715A1
    • 2013-10-31
    • US13619704
    • 2012-09-14
    • Hsin-Hwa HUTsung-Te LAIHung-Chao CHIANG
    • Hsin-Hwa HUTsung-Te LAIHung-Chao CHIANG
    • F27B14/06F27B14/20
    • C30B11/003G05D23/19
    • A heating system includes first and second heating devices, a temperature sensor, a first controller and a second controller. The first and second heating devices are respectively arranged above a crucible and around the crucible for heating semiconductor material in the crucible. The temperature sensor is configured to detect the temperature of the first heating device and to generate a temperature signal. The first controller is configured to control operation of the first heating device so as to adjust the temperature thereof based on the temperature signal. The second controller is coupled to the second heating device and is configured to control operation of the second heating device so as to adjust the temperature thereof, based on an external control signal.
    • 加热系统包括第一和第二加热装置,温度传感器,第一控制器和第二控制器。 第一和第二加热装置分别设置在坩埚的上方和坩埚周围,用于加热坩埚中的半导体材料。 温度传感器被配置为检测第一加热装置的温度并产生温度信号。 第一控制器被配置为控制第一加热装置的操作,以便基于温度信号来调节其温度。 第二控制器耦合到第二加热装置,并且被配置为基于外部控制信号来控制第二加热装置的操作以便调节其温度。