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    • 1. 发明专利
    • Steel frame house
    • 钢框架
    • JP2005171651A
    • 2005-06-30
    • JP2003414331
    • 2003-12-12
    • Tsugio Takahashi次男 高橋
    • TAKAHASHI TSUGIO
    • E04B1/64E04B1/24E04B1/30
    • PROBLEM TO BE SOLVED: To provide a steel frame house which has a simple structure, excels in workability, earthquake resistance and fireproof performance, and prevents internal dew condensation of a hollow steel frame.
      SOLUTION: The steel frame house includes the hollow steel frame (a column 10, a beam 20), the inside of which is filled with one or more materials of a gypsum powder, a stone flour, a cement powder and a baked sand, and is filled with a mixture of a gypsum, a sand and a water, or a mixture of the gypsum and the water. The inside of the hollow steel frame is filled with a cement-based foamed mortar and/or a foamed concrete, or a foamed urethane. The filling work is carried out in a state that a cylindrical member 50 is erected inside the column 10.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种结构简单,操作性,抗震性和耐火性能优异的钢框架房,防止中空钢框架的内部结露。 钢框架房屋包括中空钢框架(柱10,梁20),其内部填充有一种或多种石膏粉,石粉,水泥粉和烘烤的材料 沙子,并填充有石膏,沙子和水的混合物,或石膏和水的混合物。 中空钢框架的内部填充有水泥基发泡砂浆和/或发泡混凝土或泡沫聚氨酯。 填充工作是在柱10内竖立圆柱形构件50的状态下进行的。(C)2005年,JPO&NCIPI
    • 2. 发明专利
    • Steel frame house
    • 钢框架
    • JP2005120757A
    • 2005-05-12
    • JP2003358450
    • 2003-10-17
    • Tsugio Takahashi次男 高橋
    • TAKAHASHI TSUGIO
    • E04B1/30E04C3/29E04C3/293E04C3/32
    • PROBLEM TO BE SOLVED: To provide a steel frame house having a simple structure, excellent construction property, and excellent earthquake and fire resistance and capable of preventing dew condensation inside a hollow steel frame.
      SOLUTION: One kind or two kinds or more of any of gypsum powder/stone dust/cement powder/burnt sand are filled into the inside of the hollow steel frame (a column 10, a beam 20). Gypsum, sand, and water or gypsum and water are mixed together and are filled into the inside of the hollow steel frame. Cement foaming mortar and/or foaming concrete are filled into the inside of the hollow steel frame. Foaming urethane is filled into the inside of the hollow steel frame. Filling work is performed into the inside of the column 10 in the condition that a cylindrical member 50 has been erected.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种结构简单,施工性能优良,耐震和耐火性优异并且能够防止中空钢框架内的结露的钢框架房。 解决方案:将一种或两种以上的任何石膏粉/石粉/水泥粉/烧砂填充到中空钢框架(柱10,梁20)的内部。 将石膏,砂,水或石膏和水混合在一起并填充到中空钢框架的内部。 水泥发泡砂浆和/或发泡混凝土填充到中空钢框架的内部。 发泡聚氨酯填充到中空钢框架的内部。 在竖立有圆柱形构件50的情况下,在塔10的内部进行填充作业。 版权所有(C)2005,JPO&NCIPI
    • 4. 发明专利
    • Steel frame house
    • 钢框架
    • JP2005105648A
    • 2005-04-21
    • JP2003339718
    • 2003-09-30
    • Tsugio Takahashi次男 高橋
    • TAKAHASHI TSUGIO
    • E04B1/30
    • PROBLEM TO BE SOLVED: To provide a steel frame house having a simple structure, superior in workability, and superior in aseismatic and fire resistant performance; and a steel frame structure capable of preventing inside condensation of a hollow steel frame.
      SOLUTION: Any one kind or two ore more kinds of gypsum powder, stone dust, cement powder, and burnt sand, are filled inside the hollow steel frame (a column 10 and a beam 20). Gypsum, sand and water or the gypsum and the water are mixed together, and are filled inside the hollow steel frame. Cement type foaming mortar and/or foaming concrete are filled inside the hollow steel frame. Urethane foam is filled inside the hollow steel frame. Filling work is performed in a state of arranging vertical reinforcements inside the hollow steel frame.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种结构简单,加工性优异,抗震性和耐火性能优异的钢框架房; 以及能够防止中空钢框架内部冷凝的钢框架结构。

      解决方案:中空钢框架(柱10和梁20)内装满任何一种或两种以上的石膏粉,石灰,水泥粉和烧砂。 将石膏,砂和水或石膏和水混合在一起,并填充在中空钢框架的内部。 水泥型发泡砂浆和/或发泡混凝土填充在中空钢框架内。 聚氨酯泡沫填充在中空钢框架内。 在中空钢框架内部设置垂直加强件的状态下进行填充加工。 版权所有(C)2005,JPO&NCIPI

    • 7. 再颁专利
    • Semiconductor memory
    • 半导体存储器
    • USRE38944E1
    • 2006-01-24
    • US09974962
    • 2001-10-12
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • G11C8/00
    • H01L27/10805G11C7/10G11C11/408G11C11/4096G11C11/4097H01L27/105
    • A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion. Above the sub-memory mats is a layer of: main word lines and columns selection signal lines intersecting orthogonally, the main word lines having a pitch that is an integer multiple of the pitch of the sub-word lines, the column selection signal lines having a pitch that is an integer multiple of the pitch of the sub-bit lines; and main common I/O lines to which designated sub-common I/O lines are connected selectively.
    • 具有各自被划分为多个单元或子存储器垫的存储器垫的动态RAM等半导体存储器。 每个子存储器垫包括:存储器阵列,其具有在相交的子字和子位线之间的交叉点处以网格方式位于正交和动态存储器单元的子字线和子位线; 子字线驱动器,包括对应于子字线的单元子字线驱动电路; 感测放大器,包括对应于子位线的单位放大器电路和列选择开关; 以及经由列选择开关选择性地连接指定子位线的子公共I / O线。 子存储垫以格子排列。 子存储垫上面是:主字线和列选择信号线与正交相交的层,主字线具有作为子字线的间距的整数倍的间距,列选择信号线具有 间距,是子位线的间距的整数倍; 以及选择性地连接指定的子公共I / O线的主要公共I / O线。
    • 9. 发明授权
    • Semiconductor memory device using open data line arrangement
    • 半导体存储器件采用开放数据线布置
    • US06400596B2
    • 2002-06-04
    • US09725107
    • 2000-11-29
    • Riichiro TakemuraTomonori SekiguchiKatsutaka KimuraKazuhiko KajigayaTsugio Takahashi
    • Riichiro TakemuraTomonori SekiguchiKatsutaka KimuraKazuhiko KajigayaTsugio Takahashi
    • G11C1100
    • H01L27/10894G11C11/4097H01L27/10897
    • When a phase shift method is used as lithography where sense amplifiers are alternately placed in a one intersecting-point memory capable of implementing a reduction in the area of a DRAM, it was difficult to layout data lines in a boundary region between sense amplifiers and each memory array. Therefore, there is provided a semiconductor device according to the present invention. In the semiconductor device, two data lines continuous within the sub memory arrays or interposed therebetween are connected to the adjacent sense amplifiers as a system for drawing data lines from sub memory arrays (SMA) to sense amplifiers (SA) when the sense amplifiers are alternately placed. Namely, the number of data lines interposed between data lines respectively connected to two adjacent sense amplifiers is set to even numbers (0, 2, 4, . . . ). Owing to the above configuration, a break and a short circuit in a portion where a sense amplifier block and a sub memory array are connected, can be avoided, and a connection layout is facilitated.
    • 当使用相移方法作为光刻技术时,将读出放大器交替放置在能够实现DRAM面积减小的一个交叉点存储器中,难以在读出放大器与每个读出放大器之间的边界区域中布置数据线 内存阵列 因此,提供了根据本发明的半导体器件。 在半导体器件中,在副存储器阵列内或插入其间的两条数据线被连接到相邻的读出放大器,作为用于当读出放大器交替地从子存储器阵列(SMA)到读出放大器(SA)的数据线绘制的系统 放置 即,分别连接到两个相邻读出放大器的数据线之间的数据线的数目被设置为偶数(0,2,4 ...)。 由于上述结构,可以避免在读出放大器块和子存储器阵列连接的部分中的断路和短路,并且便于连接布局。
    • 10. 发明授权
    • Semiconductor memory
    • 半导体存储器
    • US5966341A
    • 1999-10-12
    • US982398
    • 1997-12-02
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • G11C11/401G11C7/10G11C11/407G11C11/408G11C11/409G11C11/4096G11C11/4097H01L21/8242H01L27/105H01L27/108G11C13/00
    • H01L27/10805G11C11/408G11C11/4096G11C11/4097G11C7/10H01L27/105
    • A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion. Above the sub-memory mats is a layer of: main word lines and column selection signal lines intersecting orthogonally, the main word lines having a pitch that is an integer multiple of the pitch of the sub-word lines, the column selection signal lines having a pitch that is an integer multiple of the pitch of the sub-bit lines; and main common I/O lines to which designated sub-common I/O lines are connected selectively.
    • 具有各自被划分为多个单元或子存储器垫的存储器垫的动态RAM等半导体存储器。 每个子存储器垫包括:存储器阵列,其具有在相交的子字和子位线之间的交叉点处以网格方式位于正交和动态存储器单元的子字线和子位线; 子字线驱动器,包括对应于子字线的单元子字线驱动电路; 感测放大器,包括对应于子位线的单位放大器电路和列选择开关; 以及经由列选择开关选择性地连接指定子位线的子公共I / O线。 子存储垫以格子排列。 在子存储器衬垫之上是与主要字线和列选择信号线正交相交的层,主字线具有作为子字线的间距的整数倍的间距,列选择信号线具有 间距,是子位线的间距的整数倍; 以及选择性地连接指定的子公共I / O线的主要公共I / O线。