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1. 发明授权

US07214424B2 Heat-peelable pressure-sensitive adhesive sheet 失效
标题翻译：热剥离性粘合片
公开(公告)号：US07214424B2
公开(公告)日：2007-05-08
申请号：US10123113
申请日：2002-04-17
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2433/00 , C09J2467/006 , H01L2221/68327 , Y10S428/901 , Y10T428/249987 , Y10T428/249991 , Y10T428/249992 , Y10T428/28 , Y10T428/2817 , Y10T428/2852
摘要： A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.
摘要翻译：公开了一种可降低粘合力的热处理引起的污染程度小的可热剥离的粘合片。可热剥离的压敏粘合片包括含有热膨胀性微球并在加热时膨胀的热膨胀层，以及在其至少一侧上形成的不可热膨胀的压敏粘合剂层。可热剥离的粘合片可以达到所需的粘合性能，例如加热前的优异的粘合力，并且还显示加热时粘合力的快速降低。此外，由于用于降低粘合力的处理，显示出小的污染程度的增加。由于这些特征，可热剥离的粘合片实际上可应用于例如制造由较薄的半导体晶片制成的电子部件。

2. 发明授权

US07163597B2 Heat-peelable pressure-sensitive adhesive sheet 有权
标题翻译：热剥离性粘合片
公开(公告)号：US07163597B2
公开(公告)日：2007-01-16
申请号：US10404861
申请日：2003-04-02
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
IPC分类号： B32B37/14 , H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6836 , C09J7/385 , C09J2201/36 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , Y10T156/1082 , Y10T156/1142 , Y10T428/28 , Y10T428/2839 , Y10T428/2848
摘要： A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 μm or less.
摘要翻译：即使在粘附被粘物的面积减小的情况下也能够确保有效的接触面积的热剥离性粘合片，因此能够避免诸如芯片散射或碎裂的粘合破坏。可热剥离的压敏粘合片包括基材和形成在基材的至少一侧的含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂的表面加热前的层的中心线平均粗糙度为0.4μm以下。

3. 发明授权

US07029550B2 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same 失效
标题翻译：能量束固化型热剥离性粘合片及使用其制造切片的方法
公开(公告)号：US07029550B2
公开(公告)日：2006-04-18
申请号：US10399476
申请日：2001-10-17
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B31/28 , C09J7/02
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2205/11 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2924/19041 , Y10T156/1052 , Y10T428/1405 , Y10T428/1476 , Y10T428/1495 , Y10T428/24843 , Y10T428/2486 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2852 , Y10T428/2883
摘要： An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 μm or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.
摘要翻译：能量束可固化的可热释放的压敏粘合片在基材的至少一侧上具有能量束可固化的粘弹性层和包含热膨胀性微球的热可膨胀压敏粘合剂层按此顺序能量束固化型粘弹性层例如由有机粘弹性体和能量束固化性化合物或能量束固化性树脂的组合物构成。能量束固化型粘弹性层的厚度为约5〜300μm，或者不大于热膨胀性微球的最大粒径。根据本发明的能量束固化型热剥离性压敏粘合剂层具有足够的粘合力以承受被粘物的携带步骤，在切割时既不会卷起粘合剂也不会碎裂，并且有利于在切割之后的剥离和收集切割片切割。

4. 发明申请

US20050186419A1 Heat-peelable adhesive sheet 失效
标题翻译：可剥离的粘合片
公开(公告)号：US20050186419A1
公开(公告)日：2005-08-25
申请号：US11108648
申请日：2005-04-19
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B5/18 , C09J7/02 , C09J11/00 , C09J201/00 , H01L21/68 , B65D1/00 , F16L1/00 , B32B1/08 , B29D22/00 , B29D23/00 , B32B7/12 , B32B15/04
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/26 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2400/243 , C09J2421/006 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01L21/6836 , H01L2221/68327 , H01L2221/68331 , H01L2924/19041 , Y10T156/1064 , Y10T156/1082 , Y10T156/1153 , Y10T428/249984 , Y10T428/28 , Y10T428/2839 , Y10T428/2848 , Y10T428/2861
摘要： A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.
摘要翻译：一种可热剥离的粘合片，其包含基材，并且在其至少一侧上形成包含热膨胀性微球的热膨胀层和包含粘合物质的粘合剂层，并且其中基材具有耐热性和拉伸性，用于切割被粘物，以形成并确保所得切割片之间的足够的空间，并且可以经受用于膨胀热膨胀层的热处理。因此，粘合片可以在分离和回收切割件的步骤中提高操作效率和工作效率。

5. 发明授权

US5550198A Polyurethane resin composition 失效
标题翻译：聚氨酯树脂组合物
公开(公告)号：US5550198A
公开(公告)日：1996-08-27
申请号：US356540
申请日：1994-12-15
申请人： Toshiyuki Oshima , Hideo Ishibashi , Hiromasa Minamino , Satoshi Yamamoto , Takaharu Izumo , Mitsuharu Kaneko
发明人： Toshiyuki Oshima , Hideo Ishibashi , Hiromasa Minamino , Satoshi Yamamoto , Takaharu Izumo , Mitsuharu Kaneko
IPC分类号： C08G18/28 , C08G18/50 , C08G18/64 , C08G18/66 , C08L75/02
CPC分类号： C08G18/6685 , C08G18/283 , C08G18/5024 , C08G18/643 , C08G2120/00
摘要： A polyurea resin composition for RIM or coating use Comprises (a) a polyoxyalkylenepolyamine, (b) an aromatic polyamine and/or a xylylenediamine and (c) a polyisocyanate compound with either one or both of components (a) and (b) having been modified by a Michael reaction with a vinyl monomer having an electron attracting group to convert the primary amino group thereof to a secondary amino group. The composition also contains as an internal mold release a polyoxyalkylene glycol mono-C.sub.4 -C.sub.1, alkyl ether and/or as a polyamine component a reaction product between a primary aromatic polyamine and a polyglycidyl ether.
摘要翻译：用于RIM或涂料用途的聚脲树脂组合物包括（a）聚氧亚烷基多胺，（b）芳族多胺和/或苯二甲胺和（c）多元醇化合物与组分（a）和（b）中的一种或两种已经被通过与具有吸电子基团的乙烯基单体的迈克尔反应进行改性，将其伯氨基转化为仲氨基。组合物还含有作为内部脱模剂的聚氧亚烷基二醇单C4-C1，烷基醚和/或作为多胺组分的初级芳族多胺和多缩水甘油醚之间的反应产物。

6. 发明申请

US20070111392A1 Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board 审中-公开
标题翻译：热释放型压敏粘合片，电子部件和电路板热切芯片切片的方法
公开(公告)号：US20070111392A1
公开(公告)日：2007-05-17
申请号：US11650449
申请日：2007-01-08
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , H01L2221/68327 , H01L2924/19041 , Y10T428/28
摘要： A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.
摘要翻译：从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法设置在基材表面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放切片切片。用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。

7. 发明授权

US06998175B2 Heat-peelable pressure-sensitive adhesive sheet 失效
标题翻译：热剥离性粘合片
公开(公告)号：US06998175B2
公开(公告)日：2006-02-14
申请号：US09853787
申请日：2001-05-14
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
IPC分类号： C09J7/02 , B32B27/00
CPC分类号： C09J7/22 , C09J7/38 , C09J2205/11 , Y10S428/922 , Y10T428/14 , Y10T428/28 , Y10T428/2813 , Y10T428/2848 , Y10T428/2852 , Y10T428/2857 , Y10T428/2878 , Y10T428/2891
摘要： A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
摘要翻译：即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保其加热前的粘合性和加热后的剥离性的功能。热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。

8. 发明授权

US06488803B2 Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same 失效
标题翻译：可辐射固化的可热剥离的压敏粘合片及其制造方法
公开(公告)号：US06488803B2
公开(公告)日：2002-12-03
申请号：US09782037
申请日：2001-02-14
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B712
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , H01L2924/19041 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2848 , Y10T428/2852 , Y10T428/2887
摘要： A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.
摘要翻译：公开了一种可辐射固化的可热剥离的压敏粘合片，其具有使被粘物能够承受运输等步骤的粘性，通过该步骤可以进行切割，而不会使粘合剂废料卷起或引起碎裂，并且切割片可以从其容易分离和回收。可辐射固化的可热剥离的压敏粘合片包括基底，并且在其至少一个侧面上形成含有热膨胀性微球体和可辐射固化化合物的压敏粘合剂层。将待切割的工件放置在可辐射固化的可热剥离的压敏粘合片的压敏粘合剂层的表面上，并用辐射照射粘合剂层以固化粘合剂层。在将切割片从粘合片分离并回收之前，将工件切成块，然后将压敏粘合剂层热发泡。因此，可以有效地生产切片，而不会在加工步骤中引起麻烦。

9. 发明授权

US07067030B2 Heat-peelable adhesive sheet 失效
公开(公告)号：US07067030B2
公开(公告)日：2006-06-27
申请号：US10400792
申请日：2003-03-28
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B37/14 , C09J7/00
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/26 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2400/243 , C09J2421/006 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01L21/6836 , H01L2221/68327 , H01L2221/68331 , H01L2924/19041 , Y10T156/1064 , Y10T156/1082 , Y10T156/1153 , Y10T428/249984 , Y10T428/28 , Y10T428/2839 , Y10T428/2848 , Y10T428/2861
摘要： A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

10. 发明授权

US6127874A Skew adjustable IC and a method for designing the same 失效
标题翻译：倾斜可调IC及其设计方法
公开(公告)号：US6127874A
公开(公告)日：2000-10-03
申请号：US939443
申请日：1997-09-29
申请人： Shigemichi Wakabayashi , Toshiyuki Oshima , Osamu Fuji , Shoichi Miyamoto
发明人： Shigemichi Wakabayashi , Toshiyuki Oshima , Osamu Fuji , Shoichi Miyamoto
IPC分类号： H01L21/822 , G06F1/10 , G06F17/50 , H01L21/82 , H01L27/04 , H03K19/096 , H03K19/173 , H03K3/013
CPC分类号： G06F1/10 , G06F17/5045
摘要： The present invention provides a semiconductor IC and a method for designing the same which adjusts the clock skews on a chip without additional delay circuit. A decrease in design time is realized when the semiconductor IC includes hard megacells (whose functions have been confirmed) or standard cell blocks. In the case of a semiconductor IC including hard megacells and a standard cell blocks, each megacell and standard cell block according to the present invention has sub-clock buffers on every row, for example, sub-clock buffers on the row and sub-clock buffers on the row in the megacell. The adjustment needed for accommodating clock skews on a chip is determined by calculating a delay time for the various IC chip blocks. Next, sub-clock buffers are chosen based on a result of a calculation for the delay time. Finally, the wiring design is completed which minimizes clock skew.
摘要翻译：本发明提供一种半导体IC及其设计方法，用于调整芯片上的时钟偏差而不需要额外的延迟电路。当半导体IC包括硬兆字节（其功能已被确认）或标准单元块时，实现了设计时间的减少。在包括硬兆赫和标准单元块的半导体IC的情况下，根据本发明的每个兆位和标准单元块在每行上具有子时钟缓冲器，例如行和子时钟上的子时钟缓冲器在megacell行上的缓冲区。通过计算各种IC芯片块的延迟时间来确定在芯片上适应时钟偏移所需的调整。接下来，基于延迟时间的计算结果来选择子时钟缓冲器。最后，完成了布线设计，使时钟偏移最小化。

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