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1. 发明授权

US4889584A Method of producing conductor circuit boards 失效
标题翻译：制造导体电路板的方法
公开(公告)号：US4889584A
公开(公告)日：1989-12-26
申请号：US332565
申请日：1989-03-31
申请人： Tatsuo Wada , Toshiro Miki , Masamitsu Takenaka
发明人： Tatsuo Wada , Toshiro Miki , Masamitsu Takenaka
IPC分类号： H05K3/20 , H05K3/38 , H05K3/42
CPC分类号： H05K3/205 , H05K2201/09781 , H05K2203/0152 , H05K2203/0307 , H05K2203/0542 , H05K2203/0723 , H05K2203/0726 , H05K3/382 , H05K3/428 , Y10T29/49155 , Y10T29/49165
摘要： A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching. In the case of producing a conductor circuit board with a through hole, a through hole is formed after the step of separating the conductive substrate, and then through-hole plating is carried out, followed by the removal of exposed portions of the thin metal film by etching.
摘要翻译：一种适用于制造具有高密度，精细电路图案的导体电路板的方法。导体电路和虚拟电路形成在平面导电基板的表面上，并且在去除抗蚀剂掩模之后，去除不必要的虚设电路。在导电基板的表面和导体电路的表面和剩余的虚设电路之间形成薄金属膜。将绝缘基板重叠在其上形成有金属薄膜的导电基板的表面上，并且将两个基板通过加热加压粘合在一起。随后，仅去除导电基板，并通过蚀刻去除薄金属膜的暴露部分。在制造具有通孔的导体电路板的情况下，在分离导电基板的步骤之后形成通孔，然后进行通孔电镀，然后除去薄金属膜的暴露部分通过蚀刻。

2. 发明授权

US5096522A Process for producing copper-clad laminate 失效
标题翻译：生产铜箔层压板的方法
公开(公告)号：US5096522A
公开(公告)日：1992-03-17
申请号：US542360
申请日：1990-06-22
申请人： Norio Kawachi , Katsurou Aoshima , Tatsuo Wada , Toshiro Miki , Takeharu Kato
发明人： Norio Kawachi , Katsurou Aoshima , Tatsuo Wada , Toshiro Miki , Takeharu Kato
IPC分类号： H05K3/02
CPC分类号： H05K3/025 , H05K2203/0152 , H05K2203/0307 , H05K2203/0716 , H05K2203/0723 , H05K2203/0726
摘要： A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

3. 发明授权

US4677225A Process for the production of acrylic acid or methacrylic acid 失效
标题翻译：制备丙烯酸或甲基丙烯酸的方法
公开(公告)号：US4677225A
公开(公告)日：1987-06-30
申请号：US736621
申请日：1985-05-21
申请人： Hiroshi Niizuma , Toshiro Miki , Shiro Kojima , Kishiro Azuma , Hiroyuki Kato , Yuichi Murakami , Tsutomu Ito
发明人： Hiroshi Niizuma , Toshiro Miki , Shiro Kojima , Kishiro Azuma , Hiroyuki Kato , Yuichi Murakami , Tsutomu Ito
IPC分类号： B01J27/18 , B01J27/186 , C07C51/353 , C07C57/05 , C07C57/04
CPC分类号： B01J27/186 , B01J27/18 , C07C51/353
摘要： A process for producing acrylic acid or methacrylic acid by reacting acetic acid or propionic acid with formaldehyde in a gas phase is described, characterized by carrying out the reaction in the presence of a solid catalyst containing at least one of boron oxide or phosphorus oxide and having an acid site of an acid strength, pKa.ltoreq.-3.0. The solid catalyst is of high activity and is satisfactory in both selectivity and conversion and, furthermore, its high selectivity can be maintained for long periods of time. Thus the desired product, acrylic acid or methacrylic acid, can be produced in high yield.
摘要翻译：描述了一种通过使乙酸或丙酸与甲醛在气相中反应生产丙烯酸或甲基丙烯酸的方法，其特征在于在含有氧化硼或氧化磷中的至少一种的固体催化剂存在下进行反应，并且具有酸强度的酸性位点，pKa <3.0。固体催化剂具有高活性，并且在选择性和转化率方面均令人满意，此外，其高选择性可以长时间保持。因此，可以高产率生产所需产物丙烯酸或甲基丙烯酸。

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