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1. 发明授权

US08932716B2 Conductive particle, and anisotropic conductive film, bonded structure, and bonding method 有权
标题翻译：导电粒子，各向异性导电膜，接合结构和接合方法
公开(公告)号：US08932716B2
公开(公告)日：2015-01-13
申请号：US13332555
申请日：2011-12-21
申请人： Tomoyuki Ishimatsu , Yuta Araki
发明人： Tomoyuki Ishimatsu , Yuta Araki
IPC分类号： B32B5/16 , H05K3/32 , B22F1/02 , C22C5/02 , C22C19/03 , H01B1/02
CPC分类号： H05K3/323 , B22F1/02 , C22C5/02 , C22C19/03 , H01B1/02 , H05K2201/0218 , Y10T428/12181 , Y10T428/12944 , Y10T428/256 , Y10T428/287 , Y10T428/2991
摘要： To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.
摘要翻译：提供导电颗粒，其包含：核心颗粒; 以及形成在所述芯粒子的表面上的导电层，其中所述芯粒子为镍粒子，所述导电层为表面的磷浓度为10质量％以下的镀镍层，导电层的平均厚度为1nm〜10nm。

2. 发明授权

US08524032B2 Connecting film, and joined structure and method for producing the same 失效
标题翻译：连接膜及其结合体及其制造方法
公开(公告)号：US08524032B2
公开(公告)日：2013-09-03
申请号：US13613560
申请日：2012-09-13
申请人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
发明人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
IPC分类号： H05K3/36 , H05K3/02 , H05K3/10 , B21F15/02 , H01R3/00 , H01R4/00 , H01R43/00 , H02G1/14 , B32B7/12
CPC分类号： C09J7/00 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H05K1/0346 , H05K3/323 , H05K2201/0154 , H05K2201/10674 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T428/25 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.
摘要翻译：一种接合结构体的制造方法，其特征在于，在将所述电路部件加热的同时，经由连接膜将第一电路部件和第二电路部件压接在一起，从而将所述电路部件彼此接合，包括第一层和第二层，其中第一层和第二层之一是含导电颗粒的有机树脂层，另一层是不含导电颗粒的绝缘有机树脂层，并且其中导电颗粒的最小熔体粘度的绝缘性有机树脂层的绝缘性有机树脂层的最低熔融粘度的10倍以上。

3. 发明申请

US20120279781A1 CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCTURE, AND BONDING METHOD 有权
标题翻译：导电颗粒和各向异性导电膜，粘结结构和粘结方法
公开(公告)号：US20120279781A1
公开(公告)日：2012-11-08
申请号：US13552858
申请日：2012-07-19
申请人： Hiroki Ozeki , Tomoyuki Ishimatsu , Reiji Tsukao
发明人： Hiroki Ozeki , Tomoyuki Ishimatsu , Reiji Tsukao
IPC分类号： H01B1/12 , H05K3/46 , H01B1/22 , H01R4/00 , H01B1/02 , H01B1/24
CPC分类号： H01B1/22 , H01R4/04 , H01R13/03
摘要： To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.
摘要翻译：为了提供含有芯颗粒的导电性粒子和在芯粒子的表面形成的导电层，其中核心粒子由树脂或金属形成，或者二者形成，并且导电层含有磷在其表面具有疏水性基团。

4. 发明授权

US06827880B2 Anisotropic conductive adhesive 有权
标题翻译：各向异性导电胶
公开(公告)号：US06827880B2
公开(公告)日：2004-12-07
申请号：US10013373
申请日：2001-12-13
申请人： Tomoyuki Ishimatsu
发明人： Tomoyuki Ishimatsu
IPC分类号： H01B120
CPC分类号： H05K3/323 , C08F290/147 , C09J4/00 , C09J4/06 , H01B1/20 , H01B1/22 , H01B1/24 , H05K2201/0129 , Y10S525/921 , C08F222/1006
摘要： An anisotropic conductive adhesive includes the following components (a) to (d): (a) radical polymerizable compound with bridged hydrocarbon residue, (b) an organic peroxide, (c) a thermoplastic resin, and (d) conductive particles for anisotropic conductive connection. In the radical polymerizable compound of component (a), it is desirable that the bridged hydrocarbon residue may be a tricyclodecane residue, and that it contain two or more unsaturated bonds.
摘要翻译：各向异性导电粘合剂包括以下组分（a）至（d）：（a）具有桥连烃残基的自由基聚合性化合物，（b）有机过氧化物，（c）热塑性树脂和（d）各向异性导电性导电颗粒连接。组分（a）的可自由基聚合的化合物中，优选桥连的烃残基可以是三环癸烷残基，并且它含有两个或多个不饱和键。

5. 发明授权

US06777478B2 Adhesive material 有权
标题翻译：胶粘材料
公开(公告)号：US06777478B2
公开(公告)日：2004-08-17
申请号：US09799634
申请日：2001-03-07
申请人： Tomoyuki Ishimatsu
发明人： Tomoyuki Ishimatsu
IPC分类号： C08J300
CPC分类号： C09J4/00 , C08F246/00
摘要： The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.
摘要翻译：粘合剂材料含有可自由基聚合的化合物，固化剂和热塑性树脂; 给出了Ames测试的负面结果; 并具有PII或皮肤刺激，值2以下。特别地，所有的起始成分应优选地给出Ames试验的阴性结果，并且具有2或更低的PII或皮肤刺激性。

6. 发明授权

US08330052B2 Joined structure and method for producing the same 有权
标题翻译：加工结构及其制造方法
公开(公告)号：US08330052B2
公开(公告)日：2012-12-11
申请号：US13242712
申请日：2011-09-23
申请人： Tomoyuki Ishimatsu , Yukio Yamada
发明人： Tomoyuki Ishimatsu , Yukio Yamada
IPC分类号： H05K1/02
CPC分类号： H05K3/361 , H05K3/28 , H05K3/323 , H05K2201/09154 , H05K2201/099 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.
摘要翻译：一种接合结构体的制造方法，其特征在于，具有：在以规定的方式配置各向异性导电膜之后，配置包含布线板的配线构件，所述布线构件具有在所述布线板被抗蚀剂覆盖的抗蚀剂区域以及布线板未被抗蚀剂层覆盖的第二电极区域，使得与第二电极区域的边界处的抗蚀剂区域的边缘位于基板的倒角部分的上方; 并且从布线部件的侧面加热和压缩各向异性导电膜以熔化，使各向异性导电膜流入抗蚀剂区域的侧面，从而利用各向异性导电膜覆盖第二电极区域，从而将第一电极区域和第二电极区域。

7. 发明申请

US20120285603A1 ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE 有权
标题翻译：各向异性导电膜，接合结构和生产接合结构的方法
公开(公告)号：US20120285603A1
公开(公告)日：2012-11-15
申请号：US13554303
申请日：2012-07-20
申请人： Tomoyuki ISHIMATSU
发明人： Tomoyuki ISHIMATSU
IPC分类号： B32B37/26
CPC分类号： H05K3/323 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H05K2203/1189 , Y10T156/10 , H01L2924/00
摘要： A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
摘要翻译：一种接合结构体的制造方法，其特征在于，在电路部件被加热的同时，通过各向异性导电膜将第一和第二电路部件压接在一起，从而使电路部件相互连接。各向异性导电膜在与第一电路构件相对的表面上使第一电路构件与具有含氮原子的膜的第二电路构件电连接，其中各向异性导电膜，第一层和第二层进一步限定，其包括规定第一层和第二层中的至少一层包括导电颗粒，并且第一层和第二层之间的最大放热峰值温度差在高达20℃的范围内。

8. 发明授权

US08273207B2 Method for connecting electronic part and joined structure 有权
标题翻译：电子部件和接合结构的连接方法
公开(公告)号：US08273207B2
公开(公告)日：2012-09-25
申请号：US12631210
申请日：2009-12-04
申请人： Tomoyuki Ishimatsu , Daisuke Sato , Hiroki Ozeki
发明人： Tomoyuki Ishimatsu , Daisuke Sato , Hiroki Ozeki
IPC分类号： B29C65/00 , B31B1/60 , B32B37/00 , B32B7/12 , B32B9/04 , A61F13/15 , B41J2/16
CPC分类号： H05K3/323 , C08K7/00 , C09J9/02 , C09J11/00 , H01L24/83 , H01L2224/2929 , H01L2224/29388 , H01L2224/2939 , H01L2224/29444 , H01L2224/29455 , H01L2224/29499 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01R4/04 , H01R12/52 , H01R13/2414 , H05K3/361 , H05K2201/0209 , H05K2201/0212 , H05K2201/0233 , Y10T156/10 , Y10T428/31504 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.
摘要翻译：一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于绝缘颗粒。

9. 发明申请

US20100285305A1 CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：连接膜及其连接结构及其制造方法
公开(公告)号：US20100285305A1
公开(公告)日：2010-11-11
申请号：US12838625
申请日：2010-07-19
申请人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
发明人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
IPC分类号： B32B5/16 , H01R4/04
CPC分类号： C09J7/00 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H05K1/0346 , H05K3/323 , H05K2201/0154 , H05K2201/10674 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T428/25 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.
摘要翻译：一种连接膜，其将第一电路部件与具有含氮原子的膜的第二电路部件的面对第一电路部件的表面电连接，所述连接膜包括位于第一电路部件侧的第一层以及位于第二电路部件侧的第二层，其中第一层含有阳离子固化剂和环氧树脂，第二层含有自由基固化剂，丙烯酸树脂和环氧化合物，其中，第一层和第二层之一是含导电粒子的有机树脂层，另一层是不含导电性粒子的绝缘性有机树脂层，其中，导电性粒子的有机树脂层的最小熔融粘度为是绝缘性有机树脂层的10倍以上。

10. 再颁专利

USRE41784E1 Adhesive material 有权
标题翻译：胶粘材料
公开(公告)号：USRE41784E1
公开(公告)日：2010-09-28
申请号：US11987675
申请日：2007-12-03
申请人： Tomoyuki Ishimatsu
发明人： Tomoyuki Ishimatsu
IPC分类号： B29C65/00 , B32B37/00 , C08C19/04 , C08F8/06 , C08F251/00 , C08F283/04 , C08F297/02 , C08G18/42 , C08G18/62 , C08J3/00 , C08J5/00 , C08K3/08 , C08L29/04 , C08L51/00 , C08L67/00 , C09B67/00 , D21H21/14
CPC分类号： C09J4/00 , C08F246/00
摘要： The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.
摘要翻译：粘合剂材料含有可自由基聚合的化合物，固化剂和热塑性树脂; 给出了Ames测试的负面结果; 并具有PII或皮肤刺激，值2以下。特别地，所有的起始成分应优选地给出Ames试验的阴性结果，并且具有2或更低的PII或皮肤刺激性。

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