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    • 4. 发明授权
    • Semiconductor manufacturing method and semiconductor manufacturing apparatus
    • 半导体制造方法和半导体制造装置
    • US07033843B2
    • 2006-04-25
    • US10696702
    • 2003-10-30
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • G01R31/26
    • C23C16/4408C23C16/4401C23C16/52C23C16/54C30B25/14C30B25/165H01L21/67242Y10S438/906Y10S438/908Y10T29/41
    • A semiconductor manufacturing method whereby reactive gas processing such as selective epitaxial growth can be carried out with high precision by correctly adjusting conditions during processing is performed by a semiconductor manufacturing apparatus which can restrict increases in the moisture content, prevent heavy metal pollution and the like, and investigate the correlation between moisture content in the process chamber and outside regions. The moisture content in a reaction chamber and in a gas discharge system of the reaction chamber are measured when a substrate is provided, and the conditions for reactive gas processing are adjusted based on the moisture content. Furthermore, the moisture content in the airtight space is measured by a first moisture measuring device which is connected to the airtight space, and thereafter, the substrate is inserted and ejected by a substrate carrying system, and a reactive gas is processed while measuring the moisture content in the reaction chamber by a second moisture measuring device, which is connected to the reaction chamber, after the moisture content in the airtight space is measured.
    • 通过半导体制造装置可以通过正确调整处理条件,可以高精度地进行诸如选择性外延生长的反应气体处理的半导体制造方法,该半导体制造装置可以限制水分含量的增加,防止重金属污染等, 并研究了处理室和外部区域的含水量之间的相关性。 在提供基板时测量反应室和反应室的气体放电系统中的含水量,并且基于水分含量调节反应气体处理条件。 此外,气密空间中的水分含量通过连接到气密空间的第一湿度测量装置测量,然后由基板承载系统插入和喷射基板,并且在测量湿气的同时处理反应气体 在测量气密空间中的水分含量之后,通过与反应室连接的第二水分测量装置在反应室中的含量。
    • 5. 发明授权
    • Semiconductor manufacturing apparatus having a moisture measuring device
    • 具有水分测量装置的半导体制造装置
    • US06776805B2
    • 2004-08-17
    • US09793124
    • 2001-02-27
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • H01L2100
    • C23C16/4408C23C16/4401C23C16/52C23C16/54C30B25/14C30B25/165H01L21/67242Y10S438/906Y10S438/908Y10T29/41
    • A semiconductor manufacturing method whereby reactive gas processing such as selective epitaxial growth can be carried out with high precision by correctly adjusting conditions during processing is performed by a semiconductor manufacturing apparatus which can restrict increases in the moisture content, prevent heavy metal pollution and the like, and investigate the correlation between moisture content in the process chamber and outside regions. The moisture content in a reaction chamber and in a gas discharge system of the reaction chamber are measured when a substrate is provided, and the conditions for reactive gas processing are adjusted based on the moisture content. Furthermore, the moisture content in the airtight space is measured by a first moisture measuring device which is connected to the airtight space, and thereafter, the substrate is inserted and ejected by a substrate carrying system, and a reactive gas is processed while measuring the moisture content in the reaction chamber by a second moisture measuring device, which is connected to the reaction chamber, after the moisture content in the airtight space is measured.
    • 通过半导体制造装置可以通过正确调整处理条件,可以高精度地进行诸如选择性外延生长的反应气体处理的半导体制造方法,该半导体制造装置可以限制水分含量的增加,防止重金属污染等, 并研究了处理室和外部区域的含水量之间的相关性。 在提供基板时测量反应室和反应室的气体放电系统中的含水量,并且基于水分含量调节反应气体处理条件。 此外,气密空间中的水分含量通过连接到气密空间的第一湿度测量装置测量,然后由基板承载系统插入和喷射基板,并且在测量湿气的同时处理反应气体 在测量气密空间中的水分含量之后,通过与反应室连接的第二湿度测量装置在反应室中的含量。