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    • 5. 发明授权
    • Line-illuminating device
    • 线路照明装置
    • US06808280B2
    • 2004-10-26
    • US10016587
    • 2001-10-22
    • Yoshiyuki UemuraTomihisa Saito
    • Yoshiyuki UemuraTomihisa Saito
    • F21V704
    • G02B6/0021G02B6/0031H04N1/031
    • A line-illuminating device 10, 20 having a light guide 11, 21 of which the cross-sectional shape is rectangular and its one corner is chamfered to form an emission plane 11a, 21a is provided, in which the light guide 11, 21 is housed in a light guide casing 12, 22, wherein the chamfer dimension of the emission plane 11a, 21a is more than 40% of a height dimension of the light guide 11, 21. By enlarging the chamfer dimension and broadening the width of the emission plane 11a, 21a, the directional characteristics of the emitted light is expanded. In this manner, it is possible to reduce the extent of decrease in the quantity of illuminating light on a document surface when the document surface is elevated.
    • 线路照明装置10,20具有导光体11,21,其横截面形状为矩形并且其一个角部被倒角以形成发射面11a,21a,其中导光体11,21为 容纳在导光壳体12,22中,其中发射平面11a,21a的倒角尺寸大于导光体11,21的高度尺寸的40%。通过扩大倒角尺寸并扩大发射宽度 平面11a,21a,发射光的方向特性扩大。 以这种方式,当文件表面升高时,可以减小文件表面上的照明光量的减少程度。
    • 8. 发明申请
    • Electronic component, illuminating device, contact-type image sensor, and image reading device
    • 电子部件,照明装置,接触式图像传感器和图像读取装置
    • US20090256064A1
    • 2009-10-15
    • US12384833
    • 2009-04-09
    • Tomihisa Saito
    • Tomihisa Saito
    • G06K7/00H01J1/00
    • H05K1/0203H01L2224/48091H01L2224/73265H05K1/05H05K3/3442H05K2201/09472H05K2201/09509H05K2201/09554H05K2201/10106H01L2924/00014
    • An electronic component capable of effectively dissipating heat generated in an LED chip and other elements is provided. A light emitting unit 1 includes a substrate 2 made of copper or aluminum, an insulating layer 3 formed on the surface thereof, a circuit pattern 4 formed on the insulating layer 3, and a circuit pattern 5 formed on the substrate 2 through an opening 3a that has been formed in advance in the insulation layer 3. An LED chip 6 is mounted on the circuit patterns 4 and 5 by using solder 7. The LED chip 6 includes a ceramic substrate 9, electrodes 10 and 11 formed thereon, and an LED die 12 as a light emitting portion disposed on the electrode 11, which is one of the electrodes. Terminals 13 and 14 are provided on the upper surface of the LED die 12. The terminal 13, which is one of the terminals, is connected to the electrode 10 via a bonding wire 15, and the terminal 14, which is the other one of the terminals, is connected to the electrode 11 via a bonding wire 16.
    • 提供能够有效地散发在LED芯片和其他元件中产生的热的电子部件。 发光单元1包括由铜或铝制成的基板2,形成在其表面上的绝缘层3,形成在绝缘层3上的电路图案4和通过开口3a形成在基板2上的电路图案5 预先形成在绝缘层3中。通过使用焊料7将LED芯片6安装在电路图案4,5上.LED芯片6包括陶瓷基板9,形成在其上的电极10和11以及LED 管芯12作为发光部分,设置在作为电极之一的电极11上。 端子13和14设置在LED管芯12的上表面上。作为端子之一的端子13通过接合线15连接到电极10,端子14是另一个 端子经由接合线16连接到电极11。