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1. 发明授权

EP0833375B1 Apparatus for and method of cleaning objects to be processed 失效
标题翻译：设备和方法，用于清洗物体被处理
公开(公告)号：EP0833375B1
公开(公告)日：2006-07-26
申请号：EP97307511.2
申请日：1997-09-25
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kamikawa, Yuji , Nakashima, Satoshi , Ueno, Kinya
IPC分类号： H01L21/00
CPC分类号： H01L21/67034 , Y10S134/902

2. 发明公开

EP0833375A3 Apparatus for and method of cleaning objects to be processed 失效
标题翻译：设备和方法，用于清洗物体被处理
公开(公告)号：EP0833375A3
公开(公告)日：2001-05-23
申请号：EP97307511.2
申请日：1997-09-25
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kamikawa, Yuji , Nakashima, Satoshi , Ueno, Kinya
IPC分类号： H01L21/00
CPC分类号： H01L21/67034 , Y10S134/902
摘要： A cleaning apparatus and a cleaning method for restricting an occurrence of water marks on a surface of a object to be processed are provided. The cleaning apparatus is constructed so as to dry wafers W, which have been rinsed by DIW in a drying chamber 42, in a cooling system. Thus, the reaction between, for example, IPA, DIW etc. and silicon in surfaces of the wafers W is inactivated to cause the surfaces to be oxidized with difficulty, so that it is possible to restrict the occurrence of the water marks on the surfaces.

3. 发明公开

EP0833375A2 Apparatus for and method of cleaning objects to be processed 失效
标题翻译： Vorrichtung und Verfahren zur Reinigung von zu verarbeitenden Objekte
公开(公告)号：EP0833375A2
公开(公告)日：1998-04-01
申请号：EP97307511.2
申请日：1997-09-25
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kamikawa, Yuji , Nakashima, Satoshi , Ueno, Kinya
IPC分类号： H01L21/00
CPC分类号： H01L21/67034 , Y10S134/902
摘要： A cleaning apparatus and a cleaning method for restricting an occurrence of water marks on a surface of a object to be processed are provided. The cleaning apparatus is constructed so as to dry wafers W, which have been rinsed by DIW in a drying chamber 42, in a cooling system. Thus, the reaction between, for example, IPA, DIW etc. and silicon in surfaces of the wafers W is inactivated to cause the surfaces to be oxidized with difficulty, so that it is possible to restrict the occurrence of the water marks on the surfaces.
摘要翻译：提供了一种用于限制待处理物体表面上的水痕发生的清洁装置和清洁方法。清洁装置被构造成在冷却系统中干燥由干燥室42中的DIW冲洗的晶片W. 因此，例如IPA，DIW等与晶片W的表面中的硅之间的反应失活，使得表面难以氧化，从而可以限制表面上的水痕的出现。

4. 发明公开

EP0675523A3 Heat treatment method and device 失效
标题翻译：热处理方法和装置
公开(公告)号：EP0675523A3
公开(公告)日：1995-11-15
申请号：EP95104581.4
申请日：1995-03-28
申请人： Tokyo Electron Kabushiki Kaisha , Tokyo Electron Tohoku Kabushiki Kaisha
发明人： Ohsawa, Tetsu , Iwai, Hiroyuki , Kikuchi, Hisashi , Watanabe, Shingo , Takano, Keiji , Haraoka, Tsutomu , Nakao, Ken
IPC分类号： H01L21/00
CPC分类号： H01L21/67115 , H01L21/67769 , H01L21/67781
摘要： A heat treatment device according to the present invention comprises a handling chamber (1) including a carriers feed in/out opening (8) for carriers holding plural sheets of objects to be treated parallelly vertical, and housing a vertical heat treatment furnace (2) for heat treating the objects to be treated; posture changing device (9) disposed in the handling chamber (1) and near the carriers feed in/out opening (8) for swinging the carriers near the carriers feed in/out opening (8) of the handling chamber (1) on a rotational center (X) into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position; a carriers storage unit (49) disposed above the posture changing device (9) and being capable of storing a plural number of the carriers (7) whose posture has been changed; conveyor (51) for conveying the carriers between the carriers storage unit (49) and the posture changing device (9), and the side of the heat treatment furnace (2); and transfer device (52) for transferring the objects-to-be-treated to/from an objects-to-be-treated holder (5) for loading and unloading into/out of the heat treatment furnace (2) the carriers conveyed to the side of the heat treatment furnace (2). The posture changing device (9) changes the posture of the carriers so that the carriers (7) are swung down on the rotational center (X) to a territory of sides of the carriers (7) so that the objects to be treated (W) have the posture changed from the vertical position to the horizontal position, whereby the carriers (7) can have the postures changed along a swing track of a minimum radius with small bulge amounts and a minimum moving amount. Accordingly the posture change of the carriers (7) is quick, and a small space can allow the carriers (7) to have the postures changed without interference with the conveyor. A conveying distance and a conveying time for conveying the posture changed carriers (7) to the upper storage unit (49) can be reduced, and the heat treatment device (2) can be smaller-sized and have improved processing efficiency.
摘要翻译：根据本发明的热处理装置包括处理室（1），该处理室包括用于使多个待处理物体平行垂直地保持的载体的载体进/出口（8），并容纳立式热处理炉（2）用于热处理待处理的物体; （1）内的搬运搬入搬出口（8）附近，使搬运搬入搬出搬入搬出口（8）中的搬运器摆动的姿势变更装置（9）旋转中心（X）进入载体下侧的区域，以将待处理物体的姿势从垂直位置改变为水平位置; 载置体收纳部（49），配置在所述姿势变更装置（9）的上方，能够收纳变更了姿势的多个所述载体（7）; （49）与姿态改变装置（9）之间输送载体的输送机（51）和热处理炉（2）的侧面; 和传送装置（52），用于将待处理物体传送到待处理物体（5）或从待处理物体（5）传送，以将载体传送至热处理炉（2）和从热处理炉热处理炉（2）的一侧。姿势变更装置（9）改变托架的姿势，以使托架（7）在旋转中心（X）上向下摆动到托架（7）的侧面的范围内，使得待处理物体（W ）具有从垂直位置改变到水平位置的姿势，从而载体（7）可以具有沿着具有小凸起量和最小移动量的最小半径的摆动轨迹改变的姿势。因此，载体（7）的姿态变化很快，并且小的空间可以允许载体（7）改变姿势而不干扰输送机。能够减少用于将姿势变更后的托架7输送到上部储存部49的输送距离和输送时间，能够使热处理装置2小型化并提高处理效率。

5. 发明公开

EP0675523A2 Heat treatment method and device 失效
标题翻译： Verfahren und Vorrichtung zur thermischen Behandlung。
公开(公告)号：EP0675523A2
公开(公告)日：1995-10-04
申请号：EP95104581.4
申请日：1995-03-28
申请人： Tokyo Electron Kabushiki Kaisha , Tokyo Electron Tohoku Kabushiki Kaisha
发明人： Ohsawa, Tetsu , Iwai, Hiroyuki , Kikuchi, Hisashi , Watanabe, Shingo , Takano, Keiji , Haraoka, Tsutomu , Nakao, Ken
IPC分类号： H01L21/00
CPC分类号： H01L21/67115 , H01L21/67769 , H01L21/67781
摘要： A heat treatment device according to the present invention comprises a handling chamber (1) including a carriers feed in/out opening (8) for carriers holding plural sheets of objects to be treated parallelly vertical, and housing a vertical heat treatment furnace (2) for heat treating the objects to be treated; posture changing device (9) disposed in the handling chamber (1) and near the carriers feed in/out opening (8) for swinging the carriers near the carriers feed in/out opening (8) of the handling chamber (1) on a rotational center (X) into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position; a carriers storage unit (49) disposed above the posture changing device (9) and being capable of storing a plural number of the carriers (7) whose posture has been changed; conveyor (51) for conveying the carriers between the carriers storage unit (49) and the posture changing device (9), and the side of the heat treatment furnace (2); and transfer device (52) for transferring the objects-to-be-treated to/from an objects-to-be-treated holder (5) for loading and unloading into/out of the heat treatment furnace (2) the carriers conveyed to the side of the heat treatment furnace (2). The posture changing device (9) changes the posture of the carriers so that the carriers (7) are swung down on the rotational center (X) to a territory of sides of the carriers (7) so that the objects to be treated (W) have the posture changed from the vertical position to the horizontal position, whereby the carriers (7) can have the postures changed along a swing track of a minimum radius with small bulge amounts and a minimum moving amount. Accordingly the posture change of the carriers (7) is quick, and a small space can allow the carriers (7) to have the postures changed without interference with the conveyor. A conveying distance and a conveying time for conveying the posture changed carriers (7) to the upper storage unit (49) can be reduced, and the heat treatment device (2) can be smaller-sized and have improved processing efficiency.
摘要翻译：根据本发明的热处理装置包括处理室（1），其包括用于承载待平行垂直处理的待处理物体的托架的托架进/出开口（8），并且容纳竖直热处理炉（2）用于热处理被处理物体; 姿势改变装置（9），其布置在处理室（1）中并且靠近载体进/出开口（8），用于使处理室（1）的进/出开口旋转中心（X）进入托架的下侧的区域，以将待处理物体的姿态从竖直位置改变到水平位置; 布置在所述姿势改变装置（9）的上方并且能够存储多个姿势被改变的所述载体（7）的载体存储单元（49）用于在载体存放单元（49）和姿势改变装置（9）之间传送载体的输送机（51）和热处理炉（2）的一侧; 和传送装置（52），用于将要处理的被处理物体（5）转移到用于装载和卸载进入/离开热处理炉（2）的被处理物体（5），所述传送装置传送到热处理炉侧（2）。姿势改变装置（9）改变载体的姿态，使得载体（7）在旋转中心（X）上向下摆动到载体（7）的侧面的领域，使得待处理的物体（W ）具有从垂直位置改变到水平位置的姿势，由此托架（7）可以具有沿具有小凸起量和最小移动量的最小半径的摆动轨道改变的姿势。因此，载体（7）的姿势变化很快，并且小的空间可以允许载体（7）在不干扰输送机的情况下改变姿势。可以减少输送距离和用于输送姿势的输送时间，使载体（7）到上部存储单元（49），并且热处理装置（2）可以更小尺寸并且具有改善的处理效率。

6. 发明公开

EP0516136A2 Semiconductor manufacturing apparatus 失效转让
标题翻译： Halbleiter-Herstellungseinrichtung。
公开(公告)号：EP0516136A2
公开(公告)日：1992-12-02
申请号：EP92109073.4
申请日：1992-05-29
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kumagai, Hiromi
IPC分类号： H01L21/00
CPC分类号： H01L21/67069 , H01L21/67739 , H01L21/67742 , H01L21/67745 , H01L21/67751 , H01L21/67754 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： In a semiconductor manufacturing apparatus, provided are a vacuum processing chamber (2) which implements a required processing to an object (4) of processing under an atmosphere of reduced pressure, a single spare vacuum processing chamber (3) provided to one side and adjacent to the vacuum processing chamber (2) and provided with a support mechanism (6) to support the object (4) of processing and a conveyor (5) arm to convey the object (4) of processing internally. Thus the object of processing (4) is conveyed to the vacuum processing chamber (2) and conveyed from the vacuum processing chamber (2) via the spare vacuum processing chamber (3).
摘要翻译：在半导体制造装置中，设置有在减压气氛下进行处理对象物（4）的真空处理室（2），设置在一侧和相邻的单个备用真空处理室（3）到真空处理室（2）并且设置有用于支撑处理物体（4）的支撑机构（6）和输送机（5）臂以在内部传送处理物体（4）。因此，处理（4）的目的被传送到真空处理室（2）并且经由备用真空处理室（3）从真空处理室（2）传送。

7. 发明授权

EP0516136B1 Semiconductor manufacturing apparatus 失效转让
标题翻译：半导体制造工厂
公开(公告)号：EP0516136B1
公开(公告)日：1996-03-13
申请号：EP92109073.4
申请日：1992-05-29
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kumagai, Hiromi
IPC分类号： H01L21/00
CPC分类号： H01L21/67069 , H01L21/67739 , H01L21/67742 , H01L21/67745 , H01L21/67751 , H01L21/67754 , Y10S414/137 , Y10S414/139 , Y10S414/14

8. 发明公开

EP0516136A3 Semiconductor manufacturing apparatus 失效转让
标题翻译：半导体制造设备
公开(公告)号：EP0516136A3
公开(公告)日：1993-01-20
申请号：EP92109073.4
申请日：1992-05-29
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kumagai, Hiromi
IPC分类号： H01L21/00
CPC分类号： H01L21/67069 , H01L21/67739 , H01L21/67742 , H01L21/67745 , H01L21/67751 , H01L21/67754 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： In a semiconductor manufacturing apparatus, provided are a vacuum processing chamber (2) which implements a required processing to an object (4) of processing under an atmosphere of reduced pressure, a single spare vacuum processing chamber (3) provided to one side and adjacent to the vacuum processing chamber (2) and provided with a support mechanism (6) to support the object (4) of processing and a conveyor (5) arm to convey the object (4) of processing internally. Thus the object of processing (4) is conveyed to the vacuum processing chamber (2) and conveyed from the vacuum processing chamber (2) via the spare vacuum processing chamber (3).

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