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    • 10. 发明申请
    • SELECTIVE SHIELD/MATERIAL FLOW MECHANISM
    • 选择性屏蔽/材料流动机制
    • US20080000777A1
    • 2008-01-03
    • US11855507
    • 2007-09-14
    • Ralph BarreseGary GajdorusAllen HopkinsJohn KonradRobert SchafferTimothy Wells
    • Ralph BarreseGary GajdorusAllen HopkinsJohn KonradRobert SchafferTimothy Wells
    • C25D5/00
    • C25D17/008C25D5/00C25D5/003C25D17/12C25D21/12Y10S204/07
    • An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.
    • 一种用于电镀工件的装置和方法。 该装置通常包括阳极,阴极和选择性阳极屏蔽/材料流组件。 在使用中,将阳极和阴极两者浸入溶液中,阴极用于支撑工件。 在电镀过程中,阳极和阴极产生从阳极向阴极发出的电场,以产生相应的电流,以将电镀材料沉积在工件上。 选择性屏蔽/材料流动组件位于阳极和阴极之间,并形成多个可调开口。 这些开口具有在电镀过程中可调节的尺寸,用于选择性地和可控地调节通过选择性屏蔽/材料流组件的电流量以及电镀材料在工件上的分布。 选择性屏蔽/材料流动组件也可以与无电镀系统一起使用。 在选择性屏蔽材料流动组件中使用至少一种选择性屏蔽材料流动机构。