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1. 发明授权

US08324915B2 Increasing thermal isolation of a probe card assembly 失效
标题翻译：增加探针卡组件的热隔离
公开(公告)号：US08324915B2
公开(公告)日：2012-12-04
申请号：US12275491
申请日：2008-11-21
申请人： Kevin Y. Yasumura , Timothy Blomgren , Jacob C. Chang , Michael W. Huebner
发明人： Kevin Y. Yasumura , Timothy Blomgren , Jacob C. Chang , Michael W. Huebner
IPC分类号： G01R31/00
CPC分类号： G01R31/2875 , G01R31/2863
摘要： A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.
摘要翻译：探针卡组件可以包括用于测试诸如半导体管芯的电子器件的测试系统的电接口。探针卡组件还可以包括位于探针卡组件的第一侧的探针。可以电连接到电接口的探针可以被配置为在探针卡组件附接到测试系统时接触测试系统中的电子设备的端子。探针卡组件可被配置为在探针卡组件与测试系统相连时探测卡组件与测试系统之间物理接触的位置处阻止从探针卡组件到测试系统的热流。

2. 发明授权

US07292427B1 Pin lift chuck assembly for warped substrates 有权
标题翻译：用于翘曲基材的销钉提升卡盘组件
公开(公告)号：US07292427B1
公开(公告)日：2007-11-06
申请号：US10962737
申请日：2004-10-12
申请人： Steven Murdoch , Timothy Blomgren
发明人： Steven Murdoch , Timothy Blomgren
IPC分类号： H01L21/67
CPC分类号： H01L21/68714 , H01L21/6838
摘要： A vacuum chuck apparatus may include chuck plate having a substantially flat chucking surface, one or more lift pins, and a lifting mechanism. The lift pins are configured to clamp a substrate at three or more locations. The lifting mechanism lifts the heads of the pins above the level of the chucking surface subsequently lowers the pins to pull the substrate to substantially conform to the chucking surface. A warped substrate may be secured to the chuck surface by raising the lift pins above the surface of chuck, securing a backside of the substrate with the lift pins at three or more locations, and lowering the lift pins to draw the substrate against the surface of the chuck so that the substrate substantially conforms to the surface of the chuck.
摘要翻译：真空吸盘装置可以包括具有基本上平坦的夹紧表面的卡盘板，一个或多个提升销和提升机构。提升销被配置成在三个或更多个位置处夹持基板。提升机构将销钉的头部提升到夹紧表面的高度之上，随后降低销以拉动基板以基本上符合夹紧表面。翘曲的基底可以通过将提升销抬高到卡盘的表面上而固定到卡盘表面，将提升销的基板的背面固定在三个或更多个位置，并且降低升降销以将基板拉到卡盘，使得基底基本上符合卡盘的表面。

3. 发明申请

US20090230981A1 INCREASING THERMAL ISOLATION OF A PROBE CARD ASSEMBLY 失效
标题翻译：增加探头卡大会的热分离
公开(公告)号：US20090230981A1
公开(公告)日：2009-09-17
申请号：US12275491
申请日：2008-11-21
申请人： Kevin Y. Yasumura , Timothy Blomgren , Jacob C. Chang , Michael W. Huebner
发明人： Kevin Y. Yasumura , Timothy Blomgren , Jacob C. Chang , Michael W. Huebner
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R31/2875 , G01R31/2863
摘要： A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.
摘要翻译：探针卡组件可以包括用于测试诸如半导体管芯的电子器件的测试系统的电接口。探针卡组件还可以包括位于探针卡组件的第一侧的探针。可以电连接到电接口的探针可以被配置为在探针卡组件附接到测试系统时接触测试系统中的电子设备的端子。探针卡组件可被配置为在探针卡组件与测试系统相连时探测卡组件与测试系统之间物理接触的位置处阻止从探针卡组件到测试系统的热流。

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