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1. 发明申请

US20070274044A1 Cooling Device For an Electronic Component, Especially for a Microprocessor 有权
标题翻译：电子元件冷却装置，特别是微处理器
公开(公告)号：US20070274044A1
公开(公告)日：2007-11-29
申请号：US10566797
申请日：2004-06-28
申请人： Harald Fonfara , Herbert Gostl , Thorsten Miltkau , Markus Eberl , Ralf Mollik
发明人： Harald Fonfara , Herbert Gostl , Thorsten Miltkau , Markus Eberl , Ralf Mollik
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/427 , H01L2924/0002 , H05K7/20009 , H01L2924/00
摘要： The invention relates to a cooling device (1) for an electronic component (3), especially for a microprocessor, with a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). According to the invention, the heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). In addition, the invention relates to a rack for storing several electronic components, such as servers for data-processing systems, wherein at least one electronic component (3) to be cooled is arranged on or in several electronic components. The electronic components to be cooled are each equipped with a cooling device (1) according to the invention, which is formed as cooling devices carrying a flow of a liquid medium.
摘要翻译：本发明涉及一种用于电子部件（3）的冷却装置（1），特别是用于具有散热器（7,9）的微处理器，其可连接到要冷却的电子部件（3），使得由电子部件（3）产生的废热通过散热器（7,9）上的电子部件（3）的热界面被传送和传送。根据本发明，散热器（7,9）包括形成为用于连接到电子部件的第一散热部分（7）和第二散热部分（9），其可拆卸地连接到第一散热部分散热部分（7），使得具有低的传热阻力，其中废热的至少主要部分经由第二散热部分（9）传递到冷却剂。此外，本发明涉及一种用于存储数个电子部件的机架，例如用于数据处理系统的服务器，其中待冷却的至少一个电子部件（3）布置在多个电子部件上或其中。待冷却的电子部件各自配备有根据本发明的冷却装置（1），其形成为承载液体介质的流动的冷却装置。

2. 发明申请

US20080285228A1 Arrangement For Cooling Electronic Modular Units in Equipment and Network Cabinets 失效
标题翻译：设备和网络柜中电子模块单元冷却布置
公开(公告)号：US20080285228A1
公开(公告)日：2008-11-20
申请号：US11547240
申请日：2005-12-05
申请人： Peter Koch , Rainer Bretschneider , Heiko Ebermann , Manfred Willnecker , Harald Fonfara , Thorsten Miltkau , Thomas Kunkler , Lars Weissmann
发明人： Peter Koch , Rainer Bretschneider , Heiko Ebermann , Manfred Willnecker , Harald Fonfara , Thorsten Miltkau , Thomas Kunkler , Lars Weissmann
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H05K7/20781
摘要： The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.
摘要翻译：本发明涉及一种用于冷却设备和网络机柜的装置，特别是其中风扇被集成到门中的服务器机柜。所形成的风扇门处于关闭位置，覆盖机柜后部的进入区域，并且纵向相邻于风扇门以固定的方式布置空气对流体的热交换器，同时覆盖了后部的剩余区域柜子和风扇门铰接。在热交换器中通过管道系统除去热交换器中的冷却液，特别是冷水的热损失，并且气密材料的刚性连接管可用于连接热交换器各个柜体到建筑物侧管道系统。

3. 发明授权

US07619887B2 Arrangement for cooling electronic modular units in equipment and network cabinets 失效
标题翻译：用于冷却设备和网络机柜中的电子模块单元的布置
公开(公告)号：US07619887B2
公开(公告)日：2009-11-17
申请号：US11547240
申请日：2005-12-05
申请人： Peter Koch , Rainer Bretschneider , Heiko Ebermann , Manfred Willnecker , Harald Fonfara , Thorsten Miltkau , Thomas Künkler , Lars Weiβmann
发明人： Peter Koch , Rainer Bretschneider , Heiko Ebermann , Manfred Willnecker , Harald Fonfara , Thorsten Miltkau , Thomas Künkler , Lars Weiβmann
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H05K7/20781
摘要： The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.
摘要翻译：本发明涉及一种用于冷却设备和网络机柜的装置，特别是其中风扇被集成到门中的服务器机柜。所形成的风扇门处于关闭位置，覆盖机柜后部的进入区域，并且纵向相邻于风扇门以固定的方式布置空气对流体的热交换器，同时覆盖了后部的剩余区域柜子和风扇门铰接。在热交换器中通过管道系统除去热交换器中的冷却液，特别是冷水的热损失，并且气密材料的刚性连接管可用于连接热交换器各个柜体到建筑物侧管道系统。

4. 发明授权

US07508669B2 Cooling device for an electronic component, especially for a microprocessor 有权
标题翻译：用于电子部件的冷却装置，特别是用于微处理器
公开(公告)号：US07508669B2
公开(公告)日：2009-03-24
申请号：US10566797
申请日：2004-06-28
申请人： Harald Fonfara , Herbert Göstl , Thorsten Miltkau , Markus Eberl , Ralf Mollik
发明人： Harald Fonfara , Herbert Göstl , Thorsten Miltkau , Markus Eberl , Ralf Mollik
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/427 , H01L2924/0002 , H05K7/20009 , H01L2924/00
摘要： A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). The heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). A rack may store several electronic components (3) to be cooled, wherein each electronic component to be cooled is included in a respective system such as respective server for a data-processing system. The electronic components (3) to be cooled are each equipped with a respective cooling device (1) which carries a flow of a liquid medium.
摘要翻译：一种用于电子部件（3）的冷却装置（1），特别是用于微处理器的冷却装置（1）包括散热器（7,9），其可连接到要冷却的电子部件（3），从而产生废热电子部件（3）经由散热器（7,9）上的电子部件（3）的热界面被传送和传送。散热器（7,9）包括形成为连接到电子部件的第一散热部分（7）和可拆卸地连接到第一散热部分（7）的第二散热部分（9）），使得具有低的耐热转移性，其中废热的至少主要部分经由第二散热部（9）传递到冷却剂。机架可以存储要冷却的几个电子部件（3），其中要冷却的每个电子部件被包括在诸如用于数据处理系统的相应服务器的相应系统中。待冷却的电子部件（3）各自配备有携带液体介质流的各自的冷却装置（1）。

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