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    • 1. 发明授权
    • Lead crimping apparatus
    • 铅压接装置
    • US4817272A
    • 1989-04-04
    • US87009
    • 1987-08-18
    • Carl CampisiAndrew KaliszekElmer M. KleinRichard G. SchmidThomas J. Bradfish
    • Carl CampisiAndrew KaliszekElmer M. KleinRichard G. SchmidThomas J. Bradfish
    • H05K13/04B23P19/04
    • H05K13/0473Y10T29/4914Y10T29/5146Y10T29/53183
    • An electronic component lead or tab crimping apparatus adapted for use with a conveyor system in the assembly of printed circuit (PC) boards includes an upper assembly having an upper interchangeable plate and a lower actuator plate and further includes a pneumatically actuated lower assembly. The interchangeable plate includes a plurality of spaced apertures within each of which is disposed a lead/tab engaging, crimping element. The upper assembly is initially displaced upward by the pneumatically actuated lower assembly to a position in close proximity to and in alignment with the lower surface of a PC board such that each of the crimping elements is disposed in close proximity to a lead, or leads (or tabs), of an electronic component positioned on the PC board. The lower assembly then displaces the actuator plate upward by cam action such that the actuator plate simultaneously engages and pivotally displaces the crimping elements resulting in crimping of the electronic component leads or tabs. The actuator plate of the upper assembly is then lowered by the lower assembly allowing for disengagement of the leads/tabs by the crimping elements, followed by further lowering of the upper assembly by the lower assembly to permit the PC board with crimped leads/tabs to be displaced by the conveyor system and another PC board to be moved in position for lead/tab crimping.
    • 适用于印刷电路板(PC)板组件中的输送系统的电子部件引线或接头压接装置包括具有上部可互换板和下部致动器板的上部组件,并且还包括气动致动的下部组件。 可互换板包括多个间隔开的孔,每个间隔开的孔设置有引线/突片接合的压接元件。 上部组件最初由气动致动的下部组件向上移动到靠近并与PC板的下表面对准的位置,使得每个压接元件设置成紧邻引线或引线( 或选项卡),位于PC板上的电子组件。 然后,下组件通过凸轮作用向上移动致动器板,使得致动器板同时接合并枢转地移动压接元件,导致电子部件引线或突片的卷曲。 上部组件的致动器板然后被下部组件降下,允许通过压接元件分离引线/凸片,随后通过下部组件进一步降低上部组件,以允许具有压接引线/凸片的PC板 由输送机系统和另一个PC板移动,以便移动到适合位置以进行导线/接头压接。