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1. 发明申请

US20090174291A1 PACKAGE FOR ELECTRONIC COMPONENT AND PIEZOELECTRIC RESONATOR 有权
标题翻译：电子元件和压电谐振器的封装
公开(公告)号：US20090174291A1
公开(公告)日：2009-07-09
申请号：US12348578
申请日：2009-01-05
申请人： Yoji NAGANO , Hideo TANAYA , Tatsuya ANZAI
发明人： Yoji NAGANO , Hideo TANAYA , Tatsuya ANZAI
IPC分类号： H01L41/053 , H01L41/047 , H05K5/00
CPC分类号： H03H9/1021
摘要： A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
摘要翻译：一种用于电子部件的封装包括：矩形封装体，密封封装体的盖子，设置在封装主体中的电极焊盘，设置在封装主体的底面的至少四个角附近的安装端子，在安装表面上，以及多个耦合电极，其将该焊盘电耦合到安装端子。

2. 发明申请

US20080231145A1 QUARTZ CRYSTAL DEVICE AND METHOD FOR SEALING THE SAME 有权
标题翻译： QUARTZ晶体装置及其密封方法
公开(公告)号：US20080231145A1
公开(公告)日：2008-09-25
申请号：US12051463
申请日：2008-03-19
申请人： Yoji NAGANO , Tatsuya ANZAI , Hideo TANAYA
发明人： Yoji NAGANO , Tatsuya ANZAI , Hideo TANAYA
IPC分类号： H01L41/053 , H01L41/18 , B22F5/10
CPC分类号： H03H9/0595 , B22F1/0074 , B22F7/062 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0547 , H03H9/1021 , H03H9/1035 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T156/1089 , H01L2924/00
摘要： A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
摘要翻译：石英晶体器件包括晶体谐振器元件和包括多个元件的封装。使用包含平均粒径为0.1〜1.0μm的金属粒子，有机溶剂和树脂材料的金属糊料密封材料，按照88〜93重量％的比例，将5〜15重量％，分别为0.01〜4.0重量％，以密封包装中的晶体振子元件。

3. 发明申请

US20060150381A1 Saw device manufacturing method 有权
标题翻译：锯装置制造方法
公开(公告)号：US20060150381A1
公开(公告)日：2006-07-13
申请号：US10559238
申请日：2004-06-01
申请人： Tatsuya Anzai , Yuji Ogawa , Yasuhide Onozawa
发明人： Tatsuya Anzai , Yuji Ogawa , Yasuhide Onozawa
IPC分类号： H04R17/00
CPC分类号： H03H9/1085 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H03H3/08 , Y10T29/42 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device. A method for manufacturing the SAW device includes: a step of flip-chip mounting the SAW chip on the mounting substrate, a step of placing the resin sheet on an upper face of the SAW chip; a laminating step of setting ambient environment to pressure-reduced or vacuum atmosphere and covering the outer face of the SAW chip with resin while securing the airtight space by pressurizing the resin sheet while heating the resin sheet; a press forming step of curing the resin while maintaining the airtight space by maintaining pressurized and heated state in the laminating step; and a post-curing step of performing heating at a temperature and for a time in which the resin completely cures, wherein a thickness tr of the resin sheet before the laminating step satisfies an equation of L/{(X+Gx)(Y+Gy)}≦tr.
摘要翻译：为了提供提高生产率的高品质SAW器件，其中安装在安装基板上的SAW芯片的外表面被热软化的树脂片覆盖，树脂填充在SAW芯片上，以在IDT下方形成气密空间 SAW器件。一种制造SAW器件的方法包括：将SAW芯片倒装安装在安装基板上的步骤，将树脂片放置在SAW芯片的上表面上的步骤; 将周围环境设置为减压或真空气氛并用树脂覆盖SAW芯片的外表面的层压步骤，同时通过在加热树脂板的同时加压树脂板来确保气密空间; 压制成形步骤，通过在层叠步骤中保持加压和加热状态，同时保持气密空间而固化树脂; 以及在树脂完全固化的温度和时间进行加热的后固化步骤，其中层压步骤之前的树脂片的厚度tr满足方程式<？in-line-formula description =“In 线/公式“end =”lead“？> L / {（X + Gx）（Y + Gy）} <= tr。 <？in-line-formula description =“In-line Formulas”end =“tail”？>

4. 发明申请

US20120025673A1 QUARTZ CRYSTAL DEVICE AND METHOD FOR SEALING THE SAME 有权
标题翻译： QUARTZ晶体装置及其密封方法
公开(公告)号：US20120025673A1
公开(公告)日：2012-02-02
申请号：US13272952
申请日：2011-10-13
申请人： Yoji NAGANO , Tatsuya Anzai , Hideo Tanaya
发明人： Yoji NAGANO , Tatsuya Anzai , Hideo Tanaya
IPC分类号： H01L41/053 , B29C65/48
CPC分类号： H03H9/0595 , B22F1/0074 , B22F7/062 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0547 , H03H9/1021 , H03H9/1035 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T156/1089 , H01L2924/00
摘要： A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
摘要翻译：石英晶体器件包括晶体谐振器元件和包括多个元件的封装。使用含有平均粒径为0.1〜1.0μm的金属粒子，有机溶剂和树脂材料的金属膏状密封材料，按照88〜93重量％的比例粘合多个成分，5〜15 分别为0.01〜4.0重量％，以密封封装体内的晶体振子元件。

5. 发明授权

US07928635B2 Package for electronic component and piezoelectric resonator 有权
标题翻译：电子部件和压电谐振器封装
公开(公告)号：US07928635B2
公开(公告)日：2011-04-19
申请号：US12348578
申请日：2009-01-05
申请人： Yoji Nagano , Hideo Tanaya , Tatsuya Anzai
发明人： Yoji Nagano , Hideo Tanaya , Tatsuya Anzai
IPC分类号： H01L41/053
CPC分类号： H03H9/1021
摘要： A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
摘要翻译：一种用于电子部件的封装包括：矩形封装体，密封封装体的盖子，设置在封装主体中的电极焊盘，设置在封装主体的底面的至少四个角附近的安装端子，在安装表面上，以及多个耦合电极，其将该焊盘电耦合到安装端子。

6. 发明授权

US07183125B2 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US07183125B2
公开(公告)日：2007-02-27
申请号：US10559238
申请日：2004-06-01
申请人： Tatsuya Anzai , Yuji Ogawa , Yasuhide Onozawa
发明人： Tatsuya Anzai , Yuji Ogawa , Yasuhide Onozawa
IPC分类号： H01L21/00 , H01L41/00
CPC分类号： H03H9/1085 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H03H3/08 , Y10T29/42 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device. A method for manufacturing the SAW device includes: a step of flip-chip mounting the SAW chip on the mounting substrate, a step of placing the resin sheet on an upper face of the SAW chip; a laminating step of setting ambient environment to pressure-reduced or vacuum atmosphere and covering the outer face of the SAW chip with resin while securing the airtight space by pressurizing the resin sheet while heating the resin sheet; a press forming step of curing the resin while maintaining the airtight space by maintaining pressurized and heated state in the laminating step; and a post-curing step of performing heating at a temperature and for a time in which the resin completely cures, wherein a thickness tr of the resin sheet before the laminating step satisfies an equation of L/{(X+Gx)(Y+Gy)}≦tr.
摘要翻译：为了提供提高生产率的高品质SAW器件，其中安装在安装基板上的SAW芯片的外表面被热软化的树脂片覆盖，树脂填充在SAW芯片上，以在IDT下方形成气密空间 SAW器件。一种制造SAW器件的方法包括：将SAW芯片倒装安装在安装基板上的步骤，将树脂片放置在SAW芯片的上表面上的步骤; 将周围环境设置为减压或真空气氛并用树脂覆盖SAW芯片的外表面的层压步骤，同时通过在加热树脂板的同时加压树脂板来确保气密空间; 压制成形步骤，通过在层叠步骤中保持加压和加热状态，同时保持气密空间而固化树脂; 以及在树脂完全固化的温度和时间进行加热的后固化步骤，其中层压步骤之前的树脂片的厚度tr满足方程式<？in-line-formula description =“In 线/公式“end =”lead“？> L / {（X + Gx）（Y + Gy）} <= tr。 <？in-line-formula description =“In-line Formulas”end =“tail”？>

7. 发明授权

US08344599B2 Quartz crystal device and method for sealing the same 有权
标题翻译：石英晶体装置及其密封方法
公开(公告)号：US08344599B2
公开(公告)日：2013-01-01
申请号：US13272952
申请日：2011-10-13
申请人： Yoji Nagano , Tatsuya Anzai , Hideo Tanaya
发明人： Yoji Nagano , Tatsuya Anzai , Hideo Tanaya
IPC分类号： H01L41/08
CPC分类号： H03H9/0595 , B22F1/0074 , B22F7/062 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0547 , H03H9/1021 , H03H9/1035 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T156/1089 , H01L2924/00
摘要： A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
摘要翻译：石英晶体器件包括晶体谐振器元件和包括多个元件的封装。使用含有平均粒径为0.1〜1.0μm的金属粒子，有机溶剂和树脂材料的金属膏状密封材料，按照88〜93重量％的比例粘合多个成分，5〜15 分别为0.01〜4.0重量％，以密封封装体内的晶体振子元件。

8. 发明授权

US08069549B2 Method for sealing a quartz crystal device 有权
标题翻译：密封石英晶体器件的方法
公开(公告)号：US08069549B2
公开(公告)日：2011-12-06
申请号：US12051463
申请日：2008-03-19
申请人： Yoji Nagano , Tatsuya Anzai , Hideo Tanaya
发明人： Yoji Nagano , Tatsuya Anzai , Hideo Tanaya
IPC分类号： H04R31/00
CPC分类号： H03H9/0595 , B22F1/0074 , B22F7/062 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0547 , H03H9/1021 , H03H9/1035 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T156/1089 , H01L2924/00
摘要： A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
摘要翻译：石英晶体器件包括晶体谐振器元件和包括多个元件的封装。使用含有平均粒径为0.1〜1.0μm的金属粒子，有机溶剂和树脂材料的金属膏状密封材料将多个成分按重量百分比计为88〜93％，分别为0.01〜4.0重量％，以密封包装中的晶体振子元件。

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