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    • 2. 发明申请
    • MEMORY DEVICE
    • 内存设备
    • US20110296235A1
    • 2011-12-01
    • US13021243
    • 2011-02-04
    • Masaru OGAWATarou Iwashiro
    • Masaru OGAWATarou Iwashiro
    • G06F11/16
    • G06F11/1048G06F12/0246G06F2212/7209
    • According to one embodiment, a memory device includes a semiconductor memory and a controller that controls the semiconductor memory. The controller includes a first command issuing module, second command issuing module, error correction module and control module. The first command issuing module is configured to issue a read command to the semiconductor memory. The second command issuing module is configured to issue a first command instructing a process that does not involve reading data from the semiconductor memory independently from the first command issuing module to the semiconductor memory. The error correction module is configured to correct an error contained in data supplied from the semiconductor memory. The control module is configured to control the error correction module, first command issuing module and second command issuing module.
    • 根据一个实施例,存储器件包括半导体存储器和控制半导体存储器的控制器。 控制器包括第一命令发布模块,第二命令发布模块,纠错模块和控制模块。 第一命令发布模块被配置为向半导体存储器发出读取命令。 第二指令发布模块被配置为发出指示不涉及从第一命令发布模块向半导体存储器独立地从半导体存储器读取数据的处理的第一命令。 误差校正模块被配置为校正由半导体存储器提供的数据中包含的误差。 控制模块被配置为控制纠错模块,第一命令发布模块和第二命令发布模块。
    • 4. 发明授权
    • Memory device
    • 内存设备
    • US08886989B2
    • 2014-11-11
    • US13021243
    • 2011-02-04
    • Masaru OgawaTarou Iwashiro
    • Masaru OgawaTarou Iwashiro
    • G06F11/00G06F12/02G06F11/10
    • G06F11/1048G06F12/0246G06F2212/7209
    • According to one embodiment, a memory device includes a semiconductor memory and a controller that controls the semiconductor memory. The controller includes a first command issuing module, second command issuing module, error correction module and control module. The first command issuing module is configured to issue a read command to the semiconductor memory. The second command issuing module is configured to issue a first command instructing a process that does not involve reading data from the semiconductor memory independently from the first command issuing module to the semiconductor memory. The error correction module is configured to correct an error contained in data supplied from the semiconductor memory. The control module is configured to control the error correction module, first command issuing module and second command issuing module.
    • 根据一个实施例,存储器件包括半导体存储器和控制半导体存储器的控制器。 控制器包括第一命令发布模块,第二命令发布模块,纠错模块和控制模块。 第一命令发布模块被配置为向半导体存储器发出读取命令。 第二指令发布模块被配置为发出指示不涉及从第一命令发布模块向半导体存储器独立地从半导体存储器读取数据的处理的第一命令。 误差校正模块被配置为校正由半导体存储器提供的数据中包含的误差。 控制模块被配置为控制纠错模块,第一命令发布模块和第二命令发布模块。