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    • 1. 发明申请
    • GATE INSULATING MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD-EFFECT TRANSISTOR
    • 栅绝缘材料,栅绝缘膜和有机场效应晶体管
    • US20110068417A1
    • 2011-03-24
    • US12933417
    • 2009-02-27
    • Seiichiro MuraseTakenori FujiwaraYukari JoJun Tsukamoto
    • Seiichiro MuraseTakenori FujiwaraYukari JoJun Tsukamoto
    • H01L29/78
    • H01L51/052C08G59/306C08G59/3281C08G65/20C08G77/14C09D163/00G03F7/0757H01B3/40H01B3/46H01L21/02126H01L21/02216H01L21/02282H01L21/3122H01L51/0036H01L51/0068H01L51/0545
    • To provide a gate insulating material which has high chemical resistance, is superior in coatability of a resist and an organic semiconductor coating liquid, and has small hysteresis, a gate insulating film and an FET using the same by a polysiloxane having an epoxy group-containing silane compound as a copolymerization component.A gate insulating material containing a polysiloxane having, as copolymerization components, at least a silane compound represented by the general formula (1): R1mSi(OR2)4-m  (1), wherein R1 represents hydrogen, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a heteroaryl group or an alkenyl group and in the case where a plurality of R1s are present, R1s may be the same or different, R2 represents an alkyl group or a cycloalkyl group and in the case where a plurality of R2s are present, R2s may be the same or different, and m represents an integer of 1 to 3, and an epoxy group-containing silane compound represented by the general formula (2): R3nR4lSi(OR5)4-n-1  (2), wherein R3 represents an alkyl group or a cycloalkyl group having one or more epoxy groups in a part of a chain and in the case where a plurality of R3s are present, R3s may be the same or different, R4 represents hydrogen, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a heteroaryl group or an alkenyl group and in the case where a plurality of R4s are present, R4s may be the same or different, R5 represents an alkyl group or a cycloalkyl group and in the case where a plurality of R5s are present, R5s may be the same or different, l represents an integer of 0 to 2, and n represents 1 or 2 (however, l+n≦3).
    • 为了提供耐化学性高的栅极绝缘材料,具有优异的抗蚀剂和有机半导体涂布液的涂布性,并且具有较小的滞后性,栅极绝缘膜和使用该绝缘材料的FET通过具有含环氧基的聚硅氧烷 硅烷化合物作为共聚成分。 含有作为共聚成分的至少一种由通式(1)表示的硅烷化合物的聚硅氧烷的栅绝缘材料:R1mSi(OR2)4-m(1),其中R1表示氢,烷基,环烷基 ,杂环基,芳基,杂芳基或烯基,在存在多个R 1的情况下,R 1可以相同或不同,R 2表示烷基或环烷基,在 存在多个R 2,R 2可以相同或不同,m表示1〜3的整数,和由通式(2)表示的含环氧基的硅烷化合物:R3nR4lSi(OR5)4-n- 1(2)其中R3表示一部分链中具有一个或多个环氧基的烷基或环烷基,在存在多个R 3的情况下,R 3可以相同或不同,R 4表示氢 ,烷基,环烷基,杂环基,芳基g 稠环,杂芳基或烯基,在存在多个R 4的情况下,R 4可以相同或不同,R 5表示烷基或环烷基,在存在多个R 5的情况下, R5可以相同或不同,l表示0〜2的整数,n表示1或2(然而,l + n≦̸ 3)。
    • 4. 发明授权
    • Gate insulating material, gate insulating film and organic field-effect transistor
    • 栅极绝缘材料,栅极绝缘膜和有机场效应晶体管
    • US09048445B2
    • 2015-06-02
    • US12933417
    • 2009-02-27
    • Seiichiro MuraseTakenori FujiwaraYukari JoJun Tsukamoto
    • Seiichiro MuraseTakenori FujiwaraYukari JoJun Tsukamoto
    • H01L29/78H01L51/05C08G59/30C08G59/32C08G65/20C08G77/14C09D163/00H01L21/02H01L21/312G03F7/075H01B3/40H01B3/46H01L51/00
    • H01L51/052C08G59/306C08G59/3281C08G65/20C08G77/14C09D163/00G03F7/0757H01B3/40H01B3/46H01L21/02126H01L21/02216H01L21/02282H01L21/3122H01L51/0036H01L51/0068H01L51/0545
    • To provide a gate insulating material which has high chemical resistance, is superior in coatability of a resist and an organic semiconductor coating liquid, and has small hysteresis, a gate insulating film and an FET using the same by a polysiloxane having an epoxy group-containing silane compound as a copolymerization component.A gate insulating material containing a polysiloxane having, as copolymerization components, at least a silane compound represented by the general formula (1): R1mSi(OR2)4-m  (1), wherein R1 represents hydrogen, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a heteroaryl group or an alkenyl group and in the case where a plurality of R1s are present, R1s may be the same or different, R2 represents an alkyl group or a cycloalkyl group and in the case where a plurality of R2s are present, R2s may be the same or different, and m represents an integer of 1 to 3, and an epoxy group-containing silane compound represented by the general formula (2): R3nR4lSi(OR5)4-n-1  (2), wherein R3 represents an alkyl group or a cycloalkyl group having one or more epoxy groups in a part of a chain and in the case where a plurality of R3s are present, R3s may be the same or different, R4 represents hydrogen, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a heteroaryl group or an alkenyl group and in the case where a plurality of R4s are present, R4s may be the same or different, R5 represents an alkyl group or a cycloalkyl group and in the case where a plurality of R5s are present, R5s may be the same or different, l represents an integer of 0 to 2, and n represents 1 or 2 (however, l+n≦3).
    • 为了提供耐化学性高的栅极绝缘材料,具有优异的抗蚀剂和有机半导体涂布液的涂布性,并且具有较小的滞后性,栅极绝缘膜和使用该绝缘材料的FET通过具有含环氧基的聚硅氧烷 硅烷化合物作为共聚成分。 含有作为共聚成分的至少一种由通式(1)表示的硅烷化合物的聚硅氧烷的栅绝缘材料:R1mSi(OR2)4-m(1),其中R1表示氢,烷基,环烷基 ,杂环基,芳基,杂芳基或烯基,在存在多个R 1的情况下,R 1可以相同或不同,R 2表示烷基或环烷基,在 存在多个R 2,R 2可以相同或不同,m表示1〜3的整数,和由通式(2)表示的含环氧基的硅烷化合物:R3nR4lSi(OR5)4-n- 1(2)其中R3表示一部分链中具有一个或多个环氧基的烷基或环烷基,在存在多个R 3的情况下,R 3可以相同或不同,R 4表示氢 ,烷基,环烷基,杂环基,芳基g 稠环,杂芳基或烯基,在存在多个R 4的情况下,R 4可以相同或不同,R 5表示烷基或环烷基,在存在多个R 5的情况下, R5可以相同或不同,l表示0〜2的整数,n表示1或2(然而,l + n≦̸ 3)。
    • 5. 发明申请
    • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM
    • 阳性感光树脂组合物,由其形成的固化膜和具有固化膜的装置
    • US20120237873A1
    • 2012-09-20
    • US13513270
    • 2010-12-20
    • Takenori FujiwaraKeiichi UchidaYugo TanigakiMitsuhito Suwa
    • Takenori FujiwaraKeiichi UchidaYugo TanigakiMitsuhito Suwa
    • G03F7/075
    • C08G77/14C08G77/70C09D183/06G03F7/0757
    • Disclosed is a positive photosensitive resin composition which contains a polisiloxane, a naphthoquinone diazide compound, and a solvent. The positive photosensitive resin composition is characterized in that the polysiloxane has: an organosilane-derived structure represented by the general formula (1): at a content ration of 20-80% inclusive of Si relative to the overall number of moles of Si atoms in the polysiloxane; and an organosilane-derived structure represented by general formula (2): The positive photosensitive resin composition exhibits high heat resistance, high transparency, and enables high sensitivity, high resolution patterning. The positive photosensitive resin composition can be used to form cured films such as planarization films used in TFT substrates, interlayer insulating films, core materials and cladding materials, and can be used in elements having cured films such as display elements, semiconductor elements, solid-state imaging elements, and optical waveguide elements.
    • 公开了含有聚硅氧烷,萘醌二叠氮化合物和溶剂的正型感光性树脂组合物。 正型感光性树脂组合物的特征在于,聚硅氧烷具有:由通式(1)表示的有机硅烷衍生结构:相对于Si原子的总摩尔数,含量为20〜80%,包括Si的含量 聚硅氧烷; 和由通式(2)表示的有机硅烷衍生物结构:正型感光性树脂组合物的耐热性高,透明性高,能够实现高灵敏度,高分辨率图案化。 正型感光性树脂组合物可以用于形成用于TFT基板,层间绝缘膜,芯材料和包层材料的平坦化膜等固化膜,并且可以用于具有固化膜的元件,例如显示元件,半导体元件, 状态成像元件和光波导元件。