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1. 发明申请

US20110025225A1 Light-Emitting Diode Driver Circuit and Lighting Apparatus 有权
标题翻译：发光二极管驱动电路和照明设备
公开(公告)号：US20110025225A1
公开(公告)日：2011-02-03
申请号：US12840975
申请日：2010-07-21
申请人： Fumio Horiuchi , Toru Imaizumi , Takaya Kusabe
发明人： Fumio Horiuchi , Toru Imaizumi , Takaya Kusabe
IPC分类号： H05B37/02
CPC分类号： H05B33/0815
摘要： A light-emitting diode driver circuit includes: a first-rectifier circuit to output a first-rectified voltage; a transformer including primary and secondary coils and an auxiliary coil inductively coupled to the primary or secondary coils, the primary coil being applied with the first-rectified voltage; a transistor connected in series to the primary coil; a second-rectifier circuit to output a second-rectified voltage obtained by rectifying a voltage generated in the auxiliary coil; a capacitor to be charged with the second-rectified voltage; and a control circuit to control on and off of the transistor based on a charging voltage of the capacitor so that the charging voltage becomes equal to a predetermined voltage, the secondary coil outputting a voltage that varies with a frequency corresponding to a frequency of the first-rectified voltage and that corresponds to a turns ratio between the primary and secondary coils, as a voltage for driving a light-emitting diode.
摘要翻译：发光二极管驱动电路包括：第一整流电路，用于输出第一整流电压; 包括初级线圈和次级线圈的变压器和感应耦合到初级或次级线圈的辅助线圈，初级线圈被施加第一整流电压; 与初级线圈串联连接的晶体管; 输出通过对在辅助线圈中产生的电压进行整流而得到的二次整流电压的二次整流电路; 用二次整流电压充电的电容器; 以及控制电路，用于基于所述电容器的充电电压来控制所述晶体管的导通和截止，使得所述充电电压变得等于预定电压，所述次级线圈输出以对应于所述第一电压的频率的频率变化的电压并且其对应于初级和次级线圈之间的匝数比，作为用于驱动发光二极管的电压。

2. 发明申请

US20080106875A1 Circuit Device And Method Of Manufacturing The Same 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20080106875A1
公开(公告)日：2008-05-08
申请号：US10588467
申请日：2005-02-18
申请人： Yusuke Igarashi , Sadamichi Takakusaki , Motoichi Nezu , Takaya Kusabe
发明人： Yusuke Igarashi , Sadamichi Takakusaki , Motoichi Nezu , Takaya Kusabe
IPC分类号： H05K7/02 , H05K3/30
CPC分类号： H01L23/49531 , H01L21/4846 , H01L21/565 , H01L23/4334 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2224/16 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H05K1/0203 , H05K1/0265 , H05K1/056 , H05K3/06 , H05K3/284 , H05K2201/0355 , H05K2201/09736 , H05K2203/0369 , H05K2203/1476 , Y10T29/49139 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.
摘要翻译：提供一种混合集成电路器件及其制造方法，其中可以形成精细图案，同时确保载流电容。本发明的混合集成电路装置包括形成在电路基板的前表面上的导电图案和分别电连接到导电图案的电路元件。导电图案包括比第一导电图案更厚的第一导电图案和第二导电图案。第二导电图案包括在其厚度方向上突出的突出部分。

3. 发明授权

US07851921B2 Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board 失效
标题翻译：具有多个电路基板的装置安装板以及具有装置安装板的半导体模块
公开(公告)号：US07851921B2
公开(公告)日：2010-12-14
申请号：US11830505
申请日：2007-07-30
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H01L23/48
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

4. 发明申请

US20100299920A1 METHODS FOR MANUFACTURING DEVICE MOUNTING BOARD AND CIRCUIT SUBSTRATE 失效
标题翻译：制造器件安装板和电路基板的方法
公开(公告)号：US20100299920A1
公开(公告)日：2010-12-02
申请号：US12856168
申请日：2010-08-13
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H05K3/10
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部上的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

5. 发明授权

US07714232B2 Circuit device and method of manufacturing the same 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07714232B2
公开(公告)日：2010-05-11
申请号：US10588467
申请日：2005-02-18
申请人： Yusuke Igarashi , Sadamichi Takakusaki , Motoichi Nezu , Takaya Kusabe
发明人： Yusuke Igarashi , Sadamichi Takakusaki , Motoichi Nezu , Takaya Kusabe
IPC分类号： H05K1/16
CPC分类号： H01L23/49531 , H01L21/4846 , H01L21/565 , H01L23/4334 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2224/16 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H05K1/0203 , H05K1/0265 , H05K1/056 , H05K3/06 , H05K3/284 , H05K2201/0355 , H05K2201/09736 , H05K2203/0369 , H05K2203/1476 , Y10T29/49139 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.
摘要翻译：提供一种混合集成电路器件及其制造方法，其中可以形成精细图案，同时确保载流电容。本发明的混合集成电路装置包括形成在电路基板的前表面上的导电图案和分别电连接到导电图案的电路元件。导电图案包括比第一导电图案更厚的第一导电图案和第二导电图案。第二导电图案包括在其厚度方向上突出的突出部分。

6. 发明授权

US08183090B2 Methods for manufacturing device mounting board and circuit substrate 失效
标题翻译：制造装置安装板和电路基板的方法
公开(公告)号：US08183090B2
公开(公告)日：2012-05-22
申请号：US12856168
申请日：2010-08-13
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H05K3/10
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部上的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

7. 发明申请

US20080123299A1 Circuit Device and Manufacturing Method of the Same 审中-公开
标题翻译：电路装置及其制造方法
公开(公告)号：US20080123299A1
公开(公告)日：2008-05-29
申请号：US10599302
申请日：2005-03-24
申请人： Sadamichi Takakusaki , Yusuke Igarashi , Motoichi Nezu , Takaya Kusabe
发明人： Sadamichi Takakusaki , Yusuke Igarashi , Motoichi Nezu , Takaya Kusabe
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H01L23/3677 , H01L23/13 , H01L24/45 , H01L24/48 , H01L25/16 , H01L25/165 , H01L2224/451 , H01L2224/48472 , H01L2224/73265 , H01L2924/07802 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0204 , H05K1/056 , H05K3/284 , H05K2201/09054 , H05K2203/0369 , H05K2203/1189 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A circuit device exhibiting excellent heat radiation properties and a manufacturing method thereof are hereby provided. A circuit device comprises a circuit board, an insulating layer formed on the circuit board, a conductive pattern formed on the insulating layer, a circuit element electrically connected to the conductive pattern, wherein a protrusion partially extending and being buried in the insulating layer is provided on the circuit board. Accordingly, heat generated inside the device can be efficiently discharged to the exterior via the protrusion.
摘要翻译：因此提供了具有优异的散热性能的电路装置及其制造方法。电路装置包括电路板，形成在电路板上的绝缘层，形成在绝缘层上的导电图案，电连接到导电图案的电路元件，其中部分地延伸并被埋在绝缘层中的突起被提供在电路板上。因此，装置内部产生的热能够经由突起被有效地排出到外部。

8. 发明申请

US20080023841A1 MOUNTING BOARD, METHOD FOR MANUFACTURING MOUNTING BOARD, AND SEMICONDUCTOR MODULE 失效
标题翻译：安装板，制造安装板的方法和半导体模块
公开(公告)号：US20080023841A1
公开(公告)日：2008-01-31
申请号：US11830505
申请日：2007-07-30
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H01L23/48 , H01R12/04 , H05K3/02
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

9. 发明授权

US07163841B2 Method of manufacturing circuit device 有权
标题翻译：制造电路装置的方法
公开(公告)号：US07163841B2
公开(公告)日：2007-01-16
申请号：US11179431
申请日：2005-07-11
申请人： Sadamichi Takakusaki , Yusuke Igarashi , Motoichi Nezu , Takaya Kusabe
发明人： Sadamichi Takakusaki , Yusuke Igarashi , Motoichi Nezu , Takaya Kusabe
IPC分类号： H01L21/49
CPC分类号： H05K3/4647 , H01L21/4857 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L2221/68345 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0265 , H05K1/185 , H05K1/187 , H05K3/06 , H05K3/20 , H05K3/423 , H05K3/4652 , H05K3/4658 , H05K3/4682 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/09736 , H05K2203/0152 , H05K2203/0369 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.
摘要翻译：提供一种制造高可靠性电路装置的方法，其实现更小，更薄和更轻的构造。在根据本发明的电路装置的制造方法中，在支撑基板的顶表面上形成包含电路装置的树脂密封体之后，树脂密封体与支撑基板分离。因此，可以制造没有基板的电路装置，并且实现了具有改善的散热的更薄更轻的电路装置。此外，由于可以在支撑基板上进行密封树脂的密封，所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。因此，可以防止导电图案从基板剥落，并且导电图案与金属细线之间的接触不良，从而制造高可靠性的电路装置。

10. 发明授权

US08305001B2 Light-emitting diode driver circuit and lighting apparatus 有权
标题翻译：发光二极管驱动电路及照明装置
公开(公告)号：US08305001B2
公开(公告)日：2012-11-06
申请号：US12840975
申请日：2010-07-21
申请人： Fumio Horiuchi , Toru Imaizumi , Takaya Kusabe
发明人： Fumio Horiuchi , Toru Imaizumi , Takaya Kusabe
IPC分类号： H05B37/02 , H02M3/335
CPC分类号： H05B33/0815
摘要： A light-emitting diode driver circuit includes: a first-rectifier circuit to output a first-rectified voltage; a transformer including primary and secondary coils and an auxiliary coil inductively coupled to the primary or secondary coils, the primary coil being applied with the first-rectified voltage; a transistor connected in series to the primary coil; a second-rectifier circuit to output a second-rectified voltage obtained by rectifying a voltage generated in the auxiliary coil; a capacitor to be charged with the second-rectified voltage; and a control circuit to control on and off of the transistor based on a charging voltage of the capacitor so that the charging voltage becomes equal to a predetermined voltage, the secondary coil outputting a voltage that varies with a frequency corresponding to a frequency of the first-rectified voltage and that corresponds to a turns ratio between the primary and secondary coils, as a voltage for driving a light-emitting diode.
摘要翻译：发光二极管驱动电路包括：第一整流电路，用于输出第一整流电压; 包括初级线圈和次级线圈的变压器和感应耦合到初级或次级线圈的辅助线圈，初级线圈被施加第一整流电压; 与初级线圈串联连接的晶体管; 输出通过对在辅助线圈中产生的电压进行整流而得到的二次整流电压的二次整流电路; 用二次整流电压充电的电容器; 以及控制电路，用于基于所述电容器的充电电压来控制所述晶体管的导通和截止，使得所述充电电压变得等于预定电压，所述次级线圈输出以对应于所述第一电压的频率的频率变化的电压并且其对应于初级和次级线圈之间的匝数比，作为用于驱动发光二极管的电压。

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