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1. 发明授权

US08525046B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08525046B2
公开(公告)日：2013-09-03
申请号：US12961261
申请日：2010-12-06
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H01R13/46
CPC分类号： G06F1/1616 , G06F1/1658
摘要： According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.
摘要翻译：根据一个实施例，一种电子设备包括具有电绝缘性能的壳体和安装在壳体中并包括多个连接端子的电路元件，其中壳体包括内表面，该内表面包括安装电路元件的安装区域，安装区域中的多个粘合剂填充部分，其被分隔壁分隔，以便对应于电路元件的连接端子，并且连接端子被插入其中，并且多个迹线设置在内部壳体的表面，穿过粘合剂填充部分的迹线的一端，其中壳体的粘合剂填充部分填充有将电路元件固定到安装区域的导电粘合剂，并且其中连接端子电连接到痕迹由导电胶。

2. 发明申请

US20110147075A1 Electronic Apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20110147075A1
公开(公告)日：2011-06-23
申请号：US12961261
申请日：2010-12-06
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H05K5/00
CPC分类号： G06F1/1616 , G06F1/1658
摘要： According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.
摘要翻译：根据一个实施例，一种电子设备包括具有电绝缘性能的壳体和安装在壳体中并包括多个连接端子的电路元件，其中壳体包括内表面，该内表面包括安装电路元件的安装区域，安装区域中的多个粘合剂填充部分，其被分隔壁分隔，以便对应于电路元件的连接端子，并且连接端子被插入其中，并且多个迹线设置在内部壳体的表面，穿过粘合剂填充部分的迹线的一端，其中壳体的粘合剂填充部分填充有将电路元件固定到安装区域的导电粘合剂，并且其中连接端子电连接到痕迹由导电胶。

3. 发明申请

US20120318572A1 ENDOSCOPE DEVICE AND CIRCUIT BOARD 审中-公开
标题翻译：内窥镜装置和电路板
公开(公告)号：US20120318572A1
公开(公告)日：2012-12-20
申请号：US13444592
申请日：2012-04-11
申请人： Norihiro Ishii , Takahiro Sugai
发明人： Norihiro Ishii , Takahiro Sugai
IPC分类号： H05K1/18
CPC分类号： H05K3/3436 , H05K2201/10719 , Y02P70/613
摘要： An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode.
摘要翻译：一种内窥镜装置，包括：电路基板，包括安装面; 包括面向所述安装表面的底表面和侧部的电子部件; 安装在所述底表面和所述侧部的拐角部分上的第一电极; 与所述第一电极相邻并且安装在所述底表面和所述横向部分上的第二电极; 安装在所述安装表面上以面对所述第一电极的第三电极，所述第三电极包括沿着所述侧部并且位于所述电子部件覆盖的所述安装表面的第一区域的外侧的边缘部分，并且具有比所述第一电极的面积更宽的面积并焊接到第一电极; 以及第四电极，其安装在所述安装表面上以面对所述第二电极，所述第四电极包括跟随所述侧部并且位于所述第一区域外部的边缘部分，并焊接到所述第二电极。

4. 发明申请

US20120060134A1 Wiring Design Support Apparatus and Wiring Design Support Method 审中-公开
标题翻译：接线设计支持设备和接线设计支持方法
公开(公告)号：US20120060134A1
公开(公告)日：2012-03-08
申请号：US13094680
申请日：2011-04-26
申请人： Akihisa Shimizu , Takahiro Sugai
发明人： Akihisa Shimizu , Takahiro Sugai
IPC分类号： G06F17/50
CPC分类号： H05K3/0005 , H05K1/0284 , H05K2201/0999
摘要： According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.
摘要翻译：根据一个实施例，布线设计支持装置包括显示器，绘图模块和数据创建模块。显示器被配置为显示三维对象。绘图模块被配置为绘制连接由显示器显示的三维对象的表面上的两个点的线。数据创建模块被配置为基于由绘图模块画出的线来创建指示布线的第一三维数据。

5. 发明申请

US20120026712A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20120026712A1
公开(公告)日：2012-02-02
申请号：US13027883
申请日：2011-02-15
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H05K7/02
CPC分类号： G06F1/18 , G06F1/183 , G06F2213/0038 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/1329 , H01L2224/13339 , H01L2224/16225 , H01L2224/17517 , H01L2924/01012 , H01R4/04 , H01R12/7041
摘要： According to one embodiment, an electronic apparatus includes a housing, a signal wiring and an electronic component. The signal wiring is provided on a first surface which is an inner surface of the housing. The electronic component is accommodated in the housing and includes a conductive member for electrical continuity with the signal wiring. The conductive member is formed on a surface of the electronic component facing the first surface of the housing. The electronic component is fixed to the first surface of the housing by a conductive adhesive agent having conductivity so that the conductive member has electrically continuity with the signal wiring. The electronic component is fixed to the first surface of the housing by a reinforcing adhesive agent having adhesive strength higher than the conductive adhesive agent.
摘要翻译：根据一个实施例，一种电子设备包括壳体，信号布线和电子部件。信号线设置在作为壳体的内表面的第一表面上。电子部件容纳在壳体中，并且包括用于与信号布线电连接的导电部件。导电构件形成在面向壳体的第一表面的电子部件的表面上。电子部件通过具有导电性的导电性粘合剂固定在壳体的第一表面上，使得导电部件与信号布线具有导电性。电子部件通过具有比导电性粘合剂高的粘合强度的增强粘合剂固定在壳体的第一面上。

6. 发明授权

US09044135B2 Endoscope apparatus and electronic apparatus 有权
标题翻译：内窥镜装置及电子仪器
公开(公告)号：US09044135B2
公开(公告)日：2015-06-02
申请号：US13457211
申请日：2012-04-26
申请人： Norihiro Ishii , Takahiro Sugai
发明人： Norihiro Ishii , Takahiro Sugai
IPC分类号： A61B1/00 , H01L23/053 , A61B1/12 , H05K1/11 , H05K3/34 , H01L23/498
CPC分类号： A61B1/00004 , A61B1/0011 , A61B1/121 , H01L23/053 , H01L23/49805 , H01L2924/0002 , H01L2924/15153 , H01L2924/15313 , H01L2924/16195 , H05K1/111 , H05K3/3436 , H05K2201/094 , H05K2201/10719 , H05K2201/10977 , H01L2924/00
摘要： According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the insertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.
摘要翻译：根据一个示例性实施例，一种内窥镜装置包括：作为被煮沸消毒的物体的插入单元; 连接到插入部的操作单元; 连接到操作单元的主单元; 嵌入在主单元中的第一电路板; 经由第一焊料与第一电路板电连接的第一电子部件; 插入到所述插入单元和所述操作单元中的至少任一个中的第二电路板; 第二电子部件经由具有比第一焊料的耐应力高的第二焊料电连接到第二电路板; 以及接合构件，其结合到所述第二电子部件和所述第二电路板，所述接合部件具有比所述第二电路板的玻璃化转变点高的玻璃化转变点。

7. 发明授权

US08451616B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08451616B2
公开(公告)日：2013-05-28
申请号：US13093650
申请日：2011-04-25
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/325 , G06F1/169 , G06F3/03547 , H05K3/1241 , H05K7/1076 , H05K2201/0311 , H05K2201/09036 , H05K2201/09045 , H05K2201/0999 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.
摘要翻译：根据一个实施例，电子设备包括壳体，布线图案，凹部，垫部分和电子部件。布线图案由导电粘合剂形成在外壳的内表面上。凹槽位于壳体的内表面。焊盘部分从导电粘合剂形成在凹部中并连接到布线图案的端部。电子部件包括接触焊盘部分的端子。

8. 发明授权

US08139375B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08139375B2
公开(公告)日：2012-03-20
申请号：US12769480
申请日：2010-04-28
申请人： Minoru Takizawa , Kiyokazu Ishizaki , Takahiro Sugai , Syuji Hiramoto , Koji Tada , Ichioh Murakami , Satoru Yasui , Masaru Harashima
发明人： Minoru Takizawa , Kiyokazu Ishizaki , Takahiro Sugai , Syuji Hiramoto , Koji Tada , Ichioh Murakami , Satoru Yasui , Masaru Harashima
IPC分类号： H05K7/02 , H05K7/04
CPC分类号： G06F1/1658
摘要： According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component.
摘要翻译：根据一个实施例，电子设备包括壳体，容纳在壳体中的印刷线路板，以及电连接到印刷线路板的电路部件，该电路部件包括外周面。印刷电路板包括：外周边缘，至少一对沿交叉方向延伸的边缘部分，所述一对边缘部分与电路部件的外周面相对并位于外周边缘的内侧，突出部分位于一对边缘部分之间并朝着电路部件突出。

9. 发明申请

US20120057279A1 Electronic Apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20120057279A1
公开(公告)日：2012-03-08
申请号：US13093650
申请日：2011-04-25
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H05K7/02
CPC分类号： H05K3/325 , G06F1/169 , G06F3/03547 , H05K3/1241 , H05K7/1076 , H05K2201/0311 , H05K2201/09036 , H05K2201/09045 , H05K2201/0999 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.
摘要翻译：根据一个实施例，电子设备包括壳体，布线图案，凹部，垫部分和电子部件。布线图案由导电粘合剂形成在外壳的内表面上。凹槽位于壳体的内表面。焊盘部分从导电粘合剂形成在凹部中并连接到布线图案的端部。电子部件包括接触焊盘部分的端子。

10. 发明申请

US20120026702A1 Electronic Apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20120026702A1
公开(公告)日：2012-02-02
申请号：US13016618
申请日：2011-01-28
申请人： Takahiro Sugai
发明人： Takahiro Sugai
IPC分类号： H05K5/00
CPC分类号： H05K3/321 , G06F1/181 , H05K3/325 , H05K3/368 , H05K2201/0999 , H05K2201/10189 , H05K2201/10378 , H05K2201/10409
摘要： According to one embodiment, there is provided an electronic apparatus, including: an electrically-insulative housing having a first part and a second part attachable to and detachable from the first part; a circuit board housed in the housing; a signal wire formed on an inner face of the second part; and a connector formed to electrically connect the signal wire and a terminal part of the circuit board.
摘要翻译：根据一个实施例，提供一种电子设备，包括：电绝缘壳体，其具有可附接到第一部分并可从第一部分拆卸的第一部分和第二部分; 容纳在壳体中的电路板; 信号线，形成在所述第二部分的内表面上; 以及形成为将信号线和电路板的端子部电连接的连接器。

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