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1. 发明授权

US5851853A Method of attaching a die onto a pad of a lead frame 失效
标题翻译：将管芯附接到引线框架的焊盘上的方法
公开(公告)号：US5851853A
公开(公告)日：1998-12-22
申请号：US632050
申请日：1996-04-15
申请人： Hwa Young Lee , Jong Keun Jun , Tae Hyuk Kim , Jae Won Lee
发明人： Hwa Young Lee , Jong Keun Jun , Tae Hyuk Kim , Jae Won Lee
IPC分类号： H01L21/52 , H01L23/48 , H01L23/495 , H01L21/44
CPC分类号： H01L24/83 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/83805 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802
摘要： An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.
摘要翻译：一种改进的方法，通过将环氧粘合剂分配到模片垫上，使用环氧树脂粘合剂将半导体芯片附接到引线框架的芯片焊盘上，通过至少吹送热气体来降低分配到芯片焊盘上的环氧粘合剂的粘度环氧树脂粘合剂的一部分，从而防止环氧树脂尾部的形成，并将芯片放置在粘合剂中以将芯片附接到管芯焊盘。使用的热气体可以是空气或氮气，温度为50℃至70℃。热气体从模头垫和分配器之间的鼓风机吹出，并且可以从多于一个方向。

2. 发明申请

US20050173491A1 System and method for automated wire bonding 有权
标题翻译：自动引线接合的系统和方法
公开(公告)号：US20050173491A1
公开(公告)日：2005-08-11
申请号：US10981637
申请日：2004-11-05
申请人： Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
发明人： Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
IPC分类号： B23K20/00 , B23K37/00 , H01L21/60
CPC分类号： H01L24/85 , B23K20/007 , B23K31/125 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06136 , H01L2224/48465 , H01L2224/49113 , H01L2224/49171 , H01L2224/78301 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2224/45099 , H01L2924/00
摘要： A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.
摘要翻译：焊接器观察器系统可以基于由绘图管理系统提供的信息来提供用于确定引线键合序列的自动化过程。接合器观察器系统可以包括接合顺序判定单元，接收对应于IC芯片的焊盘和引线坐标数据，以及确定用于接合IC芯片的引线的接合顺序。接合器观察器系统还可以包括转折点检查单元和接合模拟单元，其可以提供对接合序列信息的修改，其可以基于引线接合器的毛细管是否与接合顺序信息的预接合线接触 IC芯片。焊接者查看器系统还可以包括用于基于粘合顺序信息生成数据的标准文件生成器和用于以适合于焊线机的格式准备数据的翻译器。

3. 发明授权

US07631795B2 System and method for automated wire bonding 有权
标题翻译：自动引线接合的系统和方法
公开(公告)号：US07631795B2
公开(公告)日：2009-12-15
申请号：US10981637
申请日：2004-11-05
申请人： Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
发明人： Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
IPC分类号： B23K37/00
CPC分类号： H01L24/85 , B23K20/007 , B23K31/125 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06136 , H01L2224/48465 , H01L2224/49113 , H01L2224/49171 , H01L2224/78301 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2224/45099 , H01L2924/00
摘要： A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.
摘要翻译：焊接器观察器系统可以基于由绘图管理系统提供的信息来提供用于确定引线键合序列的自动化过程。接合器观察器系统可以包括接合顺序判定单元，接收对应于IC芯片的焊盘和引线坐标数据，以及确定用于接合IC芯片的引线的接合顺序。接合器观察器系统还可以包括转折点检查单元和接合模拟单元，其可以提供对接合序列信息的修改，其可以基于引线接合器的毛细管是否与接合顺序信息的预接合线接触 IC芯片。焊接者查看器系统还可以包括用于基于粘合顺序信息生成数据的标准文件生成器和用于以适合于焊线机的格式准备数据的翻译器。

4. 发明授权

US06971863B2 Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent 有权
标题翻译：用于模制用脱模剂自动处理的半导体器件的成型装置
公开(公告)号：US06971863B2
公开(公告)日：2005-12-06
申请号：US10320485
申请日：2002-12-17
申请人： Kyung-soo Park , Tae-hyuk Kim , Hoon Chang , Sung-soo Lee
发明人： Kyung-soo Park , Tae-hyuk Kim , Hoon Chang , Sung-soo Lee
IPC分类号： H01L21/56 , B29C33/58 , B29C45/14 , B29C70/72
CPC分类号： B29C33/58 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.
摘要翻译：提供了一种用于模制使用模塑料的半导体器件的成型设备，其中模具被脱模剂自动处理。引线框条盒内部片剂和片剂装载部分被设计成使得在脱模剂处理过程中使用的虚拟引线框带和释放片在脱模剂处理模式或模具清洁中被自动提供给模制设备模式。在脱模剂处理模式或模具清洁模式完成之后，将成型装置切换回正常的成型工艺，并将正常的引线框条和模塑复合片放置在模具部分。此外，拾取部分和堆叠盒部分被设计成将脱模剂处理过程中产生的副产物与正常模制产品相区分，从正常模塑过程切换到脱模剂处理工艺或模具清洗过程。

5. 发明申请

US20050126696A1 Snap cure device for semiconductor chip attachment 审中-公开
标题翻译：用于半导体芯片连接的快速固化装置
公开(公告)号：US20050126696A1
公开(公告)日：2005-06-16
申请号：US10976790
申请日：2004-11-01
申请人： Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim , Suk-Chun Jung , Byung-Soo Kim , Sang-Woo Lee , Jung-Hyon Byon
发明人： Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim , Suk-Chun Jung , Byung-Soo Kim , Sang-Woo Lee , Jung-Hyon Byon
IPC分类号： H01L21/52 , H01L21/00 , H01L21/677 , B32B31/00 , H01L21/30 , H01L21/46
CPC分类号： H01L21/67754 , H01L21/67103
摘要： Provided are a variety of snap cure apparatus configuration and corresponding methods for operating each such apparatus in order to snap cure an adhesive composition. Each of the configurations includes at least one vertical stack of heater blocks whereby the horizontal area required for conducting the snap cure processing may be reduced. Depending on the configuration utilized, two or more transfer devices may be required to remove the substrate(s) from a conveyor, index the substrate(s) through the heater blocks to apply the predetermined thermal cycle and return the cured substrate to the conveyor. Similarly, depending on the particular adhesive utilized, the number, relative temperatures, and duration of the substrate(s) on each of the heater blocks may be adjusted to provide the desired degree of curing.
摘要翻译：提供了各种快速固化设备配置和用于操作每个这样的设备的相应方法，以便将粘合剂组合物快速固化。每个配置包括至少一个垂直堆叠的加热器块，由此可以减少用于进行快速固化处理所需的水平面积。根据所使用的配置，可能需要两个或更多个转移装置以从输送机移除基材，从而将基底指引通过加热器块以施加预定的热循环并将固化的基底返回到输送机。类似地，取决于所使用的具体粘合剂，可以调节每个加热器块上的基底的数量，相对温度和持续时间以提供所需的固化程度。

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