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1. 发明授权

US07125810B2 Semiconductor device and method of manufacturing semiconductor device 有权
公开(公告)号：US07125810B2
公开(公告)日：2006-10-24
申请号：US10964714
申请日：2004-10-15
申请人： Tadayoshi Muta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
发明人： Tadayoshi Muta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
IPC分类号： H01L21/31
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

2. 发明授权

US08772944B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08772944B2
公开(公告)日：2014-07-08
申请号：US13344396
申请日：2012-01-05
申请人： Tadanori Suto
发明人： Tadanori Suto
IPC分类号： H01L23/52
CPC分类号： H01L23/481 , H01L21/76898 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate includes a via-hole that extends from a first surface to a second surface. An electrode pad layer that serves as the bottom of the via-hole is disposed on the second surface. An insulating layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole. A metal layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole with the insulating layer interposed therebetween and is directly formed on the bottom of the via-hole. An inclined surface is formed on the sidewall of the via-hole such that the bottom of the via-hole has a smaller opening size than the open end of the via-hole. The inclined surface has asperities.
摘要翻译：半导体衬底包括从第一表面延伸到第二表面的通孔。用作通孔底部的电极焊盘层设置在第二表面上。绝缘层形成在半导体衬底的第一表面和通孔的侧壁上。在半导体衬底的第一表面和介于其间的绝缘层的通孔的侧壁上形成金属层，并且直接形成在通孔的底部。在通孔的侧壁上形成倾斜表面，使得通孔的底部具有比通孔的开口端小的开口尺寸。倾斜面呈凹凸。

3. 发明申请

US20120175781A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20120175781A1
公开(公告)日：2012-07-12
申请号：US13344396
申请日：2012-01-05
申请人： Tadanori Suto
发明人： Tadanori Suto
IPC分类号： H01L23/48 , H01L21/28
CPC分类号： H01L23/481 , H01L21/76898 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate includes a via-hole that extends from a first surface to a second surface. An electrode pad layer that serves as the bottom of the via-hole is disposed on the second surface. An insulating layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole. A metal layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole with the insulating layer interposed therebetween and is directly formed on the bottom of the via-hole. An inclined surface is formed on the sidewall of the via-hole such that the bottom of the via-hole has a smaller opening size than the open end of the via-hole. The inclined surface has asperities.
摘要翻译：半导体衬底包括从第一表面延伸到第二表面的通孔。用作通孔底部的电极焊盘层设置在第二表面上。绝缘层形成在半导体衬底的第一表面和通孔的侧壁上。在半导体衬底的第一表面和介于其间的绝缘层的通孔的侧壁上形成金属层，并且直接形成在通孔的底部。在通孔的侧壁上形成倾斜表面，使得通孔的底部具有比通孔的开口端小的开口尺寸。倾斜面呈凹凸。

4. 发明授权

US06342321B1 Method of drying resinous composition layer, method of manufacturing color filter substrate using the same drying method, and liquid crystal display device 有权
标题翻译：干燥树脂组合物层的方法，使用相同干燥方法制造滤色器基板的方法以及液晶显示装置
公开(公告)号：US06342321B1
公开(公告)日：2002-01-29
申请号：US09467981
申请日：1999-12-21
申请人： Junichi Sakamoto , Nagato Osano , Tadanori Suto , Kenichi Iwata
发明人： Junichi Sakamoto , Nagato Osano , Tadanori Suto , Kenichi Iwata
IPC分类号： G02B520
CPC分类号： F26B5/045 , B05D3/0493 , G03F7/168
摘要： A method of drying a resinous composition layer, comprises the steps of coating a resinous composition over a substrate and drying the resinous composition layer to be dried. The drying method is a vacuum dry. And a drying condition in that case is such that an exhaustion is performed taking over 6 sec. till a degree of vacuum comes to 100 Torr.
摘要翻译：干燥树脂组合物层的方法包括以下步骤：将树脂组合物涂布在基材上并干燥待干燥的树脂组合物层。干燥方法是真空干燥。在这种情况下，干燥条件使得耗尽超过6秒。直到真空度达到100乇。

5. 发明申请

US20050067713A1 Semiconductor device and method of manufacturing semiconductor device 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050067713A1
公开(公告)日：2005-03-31
申请号：US10964714
申请日：2004-10-15
申请人： Tadayoshi Mutta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
发明人： Tadayoshi Mutta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/768 , H01L23/48 , H01L21/84
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.
摘要翻译：本发明的半导体器件包括衬底; 在所述基板的前表面和后表面之间穿过所述基板形成的至少一个通孔; 在所述通孔的端部开口附近，在所述基板的前表面和后表面的至少一个表面上由半导体工艺形成的电连接部分; 在所述通孔的内表面上由有机材料形成的绝缘层; 以及形成在所述绝缘层的内表面上的导电层，其中所述电连接部分电连接到所述导电层以与所述基板的另一表面的一侧电连接。

6. 发明授权

US06856023B2 Semiconductor device and method of manufacturing semiconductor device 失效
公开(公告)号：US06856023B2
公开(公告)日：2005-02-15
申请号：US10347937
申请日：2003-01-22
申请人： Tadayoshi Muta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
发明人： Tadayoshi Muta , Jin Tachikawa , Riichi Saito , Tadanori Suto , Manabu Takayama , Hiroyuki Morimoto
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/768 , H01L23/48 , H01L29/40
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

7. 发明授权

US6067439A Delivery member, and apparatus employing the same 失效
标题翻译：交付成员，以及使用它的装置
公开(公告)号：US6067439A
公开(公告)日：2000-05-23
申请号：US985253
申请日：1992-12-03
申请人： Susumu Kadokura , Naoki Shirai , Shigeru Yoshimura , Tomoaki Kato , Yoshiaki Tomari , Tadanori Suto
发明人： Susumu Kadokura , Naoki Shirai , Shigeru Yoshimura , Tomoaki Kato , Yoshiaki Tomari , Tadanori Suto
IPC分类号： B65H27/00 , G03G15/00
CPC分类号： B65H27/00 , B65H2404/18 , B65H2404/5212 , B65H2404/5521
摘要： A delivery member has a substrate material, a first coating film containing a filler and formed by electrodeposition on a substrate material, and a second coating film composed of an organic coating film formed on the first coating film.
摘要翻译：配送部件具有基板材料，含有填料并通过电沉积在基板材料上形成的第一涂膜，以及由形成在第一涂膜上的有机涂膜构成的第二涂膜。

8. 发明授权

US5523833A Delivery member and apparatus making use of the same 失效
标题翻译：交付成员和使用相同的设备
公开(公告)号：US5523833A
公开(公告)日：1996-06-04
申请号：US957820
申请日：1992-10-08
申请人： Yoshiaki Tomari , Susumu Kadokura , Tomoaki Kato , Tadanori Suto
发明人： Yoshiaki Tomari , Susumu Kadokura , Tomoaki Kato , Tadanori Suto
IPC分类号： B65H27/00 , C09D5/44 , G03G21/00 , G01D15/06
CPC分类号： C09D5/448 , B65H27/00
摘要： A delivery member has a substrate and, provided thereon, an eletro-deposition coating film containing an organic powder. By this configuration, a delivery member having a homogeneous coating is formed. Stress is therefore uniformly distributed and the coating is resistant to wear. The delivery member can be made in a variety of different forms and can be used in many different types of apparatus.
摘要翻译：传送部件具有基板，并且在其上设置含有有机粉末的电沉积涂膜。通过这种构造，形成具有均匀涂层的输送构件。因此应力均匀分布，并且涂层耐磨损。输送构件可以以各种不同形式制成并且可以用于许多不同类型的装置中。

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