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1. 发明申请

WO1997019204A1 METHOD AND APPARATUS FOR SURFACE TREATMENT 审中-公开
标题翻译：表面处理方法和装置
公开(公告)号：WO1997019204A1
公开(公告)日：1997-05-29
申请号：PCT/JP1996003434
申请日：1996-11-22
申请人： SEIKO EPSON CORPORATION , MIYAKAWA, Takuya , TSUTSUI, Shoji , MORI, Yoshiaki , KATO, Masaki , KURASHIMA, Yohei
发明人： SEIKO EPSON CORPORATION
IPC分类号： C23F04/00
CPC分类号： C23G5/00 , B23K1/20 , H01L23/49586 , H01L2924/0002 , H05K3/3489 , H01L2924/00
摘要： A method and apparatus for surface treatment, wherein a workpiece is exposed to an activated gas containing nitrogen and water at an atmospheric pressure to modify the surface of the workpiece. To improve wettability of a soldered lead frame (12), oxygen is fed from a gas supply (619) to a plasma generator in a surface treatment unit (30) through a first pipe (657). Nitrogen is fed from the gas supply (619) into a container (659) of pure water (660) through a second pipe (658), and the wet nitrogen is introduced to the plasma generator in the surface treatment unit (30). The gas supplied into the plasma generator is excited and decomposed by an electrode to which a D.C. voltage or a low-frequency A.C. voltage of not higher than 50 KHz is applied, and a plasma containing nitrogen oxides is generated. An IC (10) is exposed to this plasma for the surface treatment of the lead frame (12). Oxides on the surface of the lead frame (12) are reduced or their oxides are substituted by nitrogen oxides, and the surface of the lead frame (12) is modified.
摘要翻译：一种用于表面处理的方法和装置，其中工件暴露于含有大气压力的氮和水的活性气体以改变工件的表面。为了改善焊接引线框架（12）的润湿性，氧气通过第一管道（657）从气体供应源（619）供给到表面处理单元（30）中的等离子体发生器。氮气通过第二管道（658）从气体供应源（619）进入纯水（660）的容器（659）中，并且湿的氮气被引入表面处理单元（30）中的等离子体发生器。供给到等离子体发生器中的气体被施加了不高于50KHz的直流电压或低频交流电压的电极激发并分解，产生含氮氧化物的等离子体。 IC（10）暴露于该等离子体以进行引线框架（12）的表面处理。引线框架（12）的表面上的氧化物被还原或其氧化物被氮氧化物所取代，引线框架（12）的表面被改性。

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