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1. 发明申请

WO2010080590A2 HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE 审中-公开
标题翻译：高温静电胶粘剂粘合剂
公开(公告)号：WO2010080590A2
公开(公告)日：2010-07-15
申请号：PCT/US2009068686
申请日：2009-12-18
申请人： APPLIED MATERIALS INC , SUN JENNIFER Y , THACH SENH , DUAN REN-GUAN
发明人： SUN JENNIFER Y , THACH SENH , DUAN REN-GUAN
IPC分类号： H01L21/683 , H01L21/687
CPC分类号： H01L21/6833 , C08K3/22 , C08K3/28 , C08K2003/2227 , C08K2003/282 , C09D183/04 , C09J11/04 , C09J183/04 , H01L21/6831 , H02N13/00 , Y10T279/23 , Y10T279/34
摘要： Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content S D3 - D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (AI2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.
摘要翻译：本文提供了用于将静电卡盘结合到基板支撑件的部件的方法和装置。在一些实施例中，用于粘合基底支撑件的部件的粘合剂可以包括其中分散有填料的硅基聚合物材料的基体。硅基聚合物材料可以是分子量小于约500ppm的低分子量（LMW）含量S D3 -D 10的聚二甲基硅氧烷（PDMS）结构。在一些实施方案中，填料可以占粘合剂层的约50至约70体积％。在一些实施例中，填料可以包括氧化铝（Al 2 O 3），氮化铝（AlN），氧化钇（Y 2 O 3）或其组合的颗粒。在一些实施方案中，填料可以包含直径为约10纳米至约10微米的颗粒。

2. 发明申请

WO2010054112A2 PLASMA RESISTANT COATINGS FOR PLASMA CHAMBER COMPONENTS 审中-公开
标题翻译：用于等离子体室组分的抗菌涂料
公开(公告)号：WO2010054112A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/063437
申请日：2009-11-05
申请人： APPLIED MATERIALS, INC. , SUN, Jennifer, Y. , HE, Xiao-Ming , THACH, Senh
发明人： SUN, Jennifer, Y. , HE, Xiao-Ming , THACH, Senh
IPC分类号： H05H1/34 , H01L21/3065
CPC分类号： H01J37/32477 , Y10T428/31678
摘要： Plasma resistant coating materials, plasma resistant coatings and methods of forming such coatings on hardware components. In one embodiment, hardware component is an electrostatic chuck (ESC) and the plasma resistant coating is formed on a surface of the ESC. The plasma resistant coatings are formed by methods other than thermal spraying to provide plasma resistant coatings having advantageous material properties.
摘要翻译：等离子体涂层材料，等离子体涂层以及在硬件部件上形成这种涂层的方法。在一个实施例中，硬件部件是静电卡盘（ESC），等离子体涂层形成在ESC的表面上。耐等离子涂层通过热喷涂以外的方法形成，以提供具有有利材料特性的等离子体涂层。

3. 发明申请

WO2010054112A3 PLASMA RESISTANT COATINGS FOR PLASMA CHAMBER COMPONENTS 审中-公开
标题翻译：用于等离子体室部件的抗等离子体涂层
公开(公告)号：WO2010054112A3
公开(公告)日：2010-07-29
申请号：PCT/US2009063437
申请日：2009-11-05
申请人： APPLIED MATERIALS INC , SUN JENNIFER Y , HE XIAO-MING , THACH SENH
发明人： SUN JENNIFER Y , HE XIAO-MING , THACH SENH
IPC分类号： H05H1/34 , H01L21/3065
CPC分类号： H01J37/32477 , Y10T428/31678
摘要： Plasma resistant coating materials, plasma resistant coatings and methods of forming such coatings on hardware components. In one embodiment, hardware component is an electrostatic chuck (ESC) and the plasma resistant coating is formed on a surface of the ESC. The plasma resistant coatings are formed by methods other than thermal spraying to provide plasma resistant coatings having advantageous material properties.
摘要翻译：抗等离子涂层材料，抗等离子涂层和在硬件部件上形成这种涂层的方法。在一个实施例中，硬件部件是静电卡盘（ESC），并且抗等离子涂层形成在ESC的表面上。耐等离子体涂层是通过除热喷涂之外的方法形成的，以提供具有有利材料性质的抗等离子涂层。

4. 发明申请

WO2010080590A3 HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE 审中-公开
公开(公告)号：WO2010080590A3
公开(公告)日：2010-07-15
申请号：PCT/US2009/068686
申请日：2009-12-18
申请人： APPLIED MATERIALS, INC. , SUN, Jennifer Y. , THACH, Senh , DUAN, Ren-Guan
发明人： SUN, Jennifer Y. , THACH, Senh , DUAN, Ren-Guan
IPC分类号： H01L21/683 , H01L21/687
摘要： Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3 - D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (AI 2 O 3 ), aluminum nitride (AlN), yttrium oxide (Y 2 O 3 ), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

5. 发明申请

WO2013162820A1 HIGH TEMPERATURE ELECTROSTATIC CHUCK WITH REAL-TIME HEAT ZONE REGULATING CAPABILITY 审中-公开
标题翻译：具有实时热区调节能力的高温静电卡盘
公开(公告)号：WO2013162820A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/034380
申请日：2013-03-28
申请人： APPLIED MATERIALS, INC. , LUBOMIRSKY, Dmitry , SUN, Jennifer Y. , THACH, Senh , LIN, Xing , WILLWERTH, Michael D. , MAKHRATCHEV, Konstantin
发明人： LUBOMIRSKY, Dmitry , SUN, Jennifer Y. , LIN, Xing , WILLWERTH, Michael D. , MAKHRATCHEV, Konstantin
IPC分类号： H01L21/683 , H02N13/00 , H05B3/20 , B23Q3/15
CPC分类号： H02N13/00 , B23B31/28 , H01L21/67103 , H01L21/67109 , H01L21/67248 , H01L21/6831 , H01L21/68792
摘要： Embodiments of the present invention provide electrostatic chucks for operating at elevated temperatures. One embodiment of the present invention provides a dielectric chuck body for an electrostatic chuck. The dielectric chuck body includes a substrate supporting plate having a top surface for receiving a substrate and a back surface opposing the top surface, an electrode embedded in the substrate supporting plate, and a shaft having a first end attached to the back surface of the substrate supporting plate and a second end opposing the first end. The second end is configured to contact a cooling base and provide temperature control to the substrate supporting plate. The shaft is hollow having a sidewall enclosing a central opening, and two or more channels formed through the sidewall and extending from the first end to the second end.
摘要翻译：本发明的实施例提供了用于在升高的温度下操作的静电卡盘。本发明的一个实施例提供了一种用于静电卡盘的电介质卡盘体。电介质卡盘体包括：基板支撑板，具有用于接收基板的顶表面和与顶表面相对的后表面，嵌入在基板支撑板中的电极;以及轴，其具有附接到基板的背面的第一端支撑板和与第一端相对的第二端。第二端构造成接触冷却基座并且向基板支撑板提供温度控制。轴是中空的，具有封闭中心开口的侧壁，以及穿过侧壁形成并从第一端延伸到第二端的两个或更多个通道。

6. 发明申请

WO2010068635A3 FILLED POLYMER COMPOSITION FOR ETCH CHAMBER COMPONENT 审中-公开
标题翻译：用于蚀刻室部件的填充聚合物组合物
公开(公告)号：WO2010068635A3
公开(公告)日：2010-08-19
申请号：PCT/US2009067218
申请日：2009-12-08
申请人： APPLIED MATERIALS INC , SUN JENNIFER Y , DUAN REN-GUAN , THACH SENH , XU LI
发明人： SUN JENNIFER Y , DUAN REN-GUAN , THACH SENH , XU LI
IPC分类号： C08K3/22 , B01J19/08 , C08K3/34 , C08L101/00 , C09J11/04
CPC分类号： C09K3/10 , Y10T428/2857
摘要： A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.
摘要翻译：公开了具有改善的抗等离子体性的填充聚合物组合物该组合物包含分散在聚合物基质中的颗粒填料。颗粒填料可以是Nb2O5，YF3，AlN，SiC或Si3N4和稀土氧化物。在一个实施方案中，该组合物用作静电卡盘的粘合剂，淋浴喷头的粘合剂，衬垫的粘合剂，密封材料，O形环或塑料部件。

7. 发明申请

WO2011100109A3 GAS DISTRIBUTION SHOWERHEAD WITH COATING MATERIAL FOR SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：具有涂层材料的气体分布式淋浴器用于半导体加工
公开(公告)号：WO2011100109A3
公开(公告)日：2011-10-27
申请号：PCT/US2011022418
申请日：2011-01-25
申请人： APPLIED MATERIALS INC , SUN JENNIFER , THACH SENH , DUAN RENGUAN , GRAVES THOMAS
发明人： SUN JENNIFER , THACH SENH , DUAN RENGUAN , GRAVES THOMAS
IPC分类号： H01L21/316 , H01L21/205
CPC分类号： H01J37/3244 , C23C4/02 , C23C4/11 , C23C4/18
摘要： Described herein are exemplary methods and apparatuses for fabricating a gas distribution showerhead assembly in accordance with one embodiment. In one embodiment, a method includes providing a gas distribution plate having a first set of through-holes for delivering processing gases into a semiconductor processing chamber. The first set of through-holes is located on a backside of the plate (e.g., Aluminum substrate). The method includes spraying (e.g., plasma spraying) a coating material (e.g., Ytrria based material) onto a cleaned surface of the gas distribution plate. The method includes removing (e.g., surface grinding) a portion of the coating material from the surface to reduce a thickness of the coating material. The method includes forming (e.g., UV laser drilling, machining) a second set of through-holes in the coating material such that the through-holes are aligned with the first-set of through-holes.
摘要翻译：这里描述了根据一个实施例的用于制造气体分配喷头组件的示例性方法和装置。在一个实施例中，一种方法包括提供具有第一组通孔的气体分配板，用于将处理气体输送到半导体处理室中。第一组通孔位于板的背面（例如铝基板）上。该方法包括将涂料（例如，基于Ytrria的材料）喷雾（例如，等离子体喷涂）到气体分配板的清洁表面上。该方法包括从表面去除（例如，表面研磨）涂层材料的一部分以减少涂层材料的厚度。该方法包括在涂层材料中形成（例如UV激光钻孔，加工）第二组通孔，使得通孔与第一组通孔对齐。

8. 发明申请

WO2011100109A2 GAS DISTRIBUTION SHOWERHEAD WITH COATING MATERIAL FOR SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：用于半导体加工的带涂层材料的气体分配喷头
公开(公告)号：WO2011100109A2
公开(公告)日：2011-08-18
申请号：PCT/US2011/022418
申请日：2011-01-25
申请人： APPLIED MATERIALS, INC. , SUN, Jennifer , THACH, Senh , DUAN, Renguan , GRAVES, Thomas
发明人： SUN, Jennifer , THACH, Senh , DUAN, Renguan , GRAVES, Thomas
IPC分类号： H01L21/316 , H01L21/205
CPC分类号： H01J37/3244 , C23C4/02 , C23C4/11 , C23C4/18
摘要： Described herein are exemplary methods and apparatuses for fabricating a gas distribution showerhead assembly in accordance with one embodiment. In one embodiment, a method includes providing a gas distribution plate having a first set of through-holes for delivering processing gases into a semiconductor processing chamber. The first set of through-holes is located on a backside of the plate (e.g., Aluminum substrate). The method includes spraying (e.g., plasma spraying) a coating material (e.g., Ytrria based material) onto a cleaned surface of the gas distribution plate. The method includes removing (e.g., surface grinding) a portion of the coating material from the surface to reduce a thickness of the coating material. The method includes forming (e.g., UV laser drilling, machining) a second set of through-holes in the coating material such that the through-holes are aligned with the first-set of through-holes.
摘要翻译：这里描述了根据一个实施例的用于制造气体分配喷头组件的示例性方法和设备。在一个实施例中，一种方法包括提供具有用于将处理气体输送到半导体处理室中的第一组通孔的气体分配板。第一组通孔位于板的背面（例如，铝基板）上。该方法包括将涂层材料（例如，基于Ytrria的材料）喷射（例如等离子喷涂）到气体分配板的清洁表面上。该方法包括从表面去除（例如，表面研磨）一部分涂层材料以减小涂层材料的厚度。该方法包括在涂层材料中形成（例如UV激光钻孔，加工）第二组通孔，使得通孔与第一组通孔对准。

9. 发明申请

WO2010068635A2 FILLED POLYMER COMPOSITION FOR ETCH CHAMBER COMPONENT 审中-公开
标题翻译：用于蚀刻室组件的填充聚合物组合物
公开(公告)号：WO2010068635A2
公开(公告)日：2010-06-17
申请号：PCT/US2009/067218
申请日：2009-12-08
申请人： APPLIED MATERIALS, INC. , SUN, Jennifer, Y. , DUAN, Ren-guan , THACH, Senh , XU, Li
发明人： SUN, Jennifer, Y. , DUAN, Ren-guan , THACH, Senh , XU, Li
IPC分类号： C08K3/22 , C08K3/34 , C08L101/00 , C09J11/04 , B01J19/08
CPC分类号： C09K3/10 , Y10T428/2857
摘要： A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb 2 O 5 , YF 3 , AlN, SiC or Si 3 N 4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.
摘要翻译：公开了具有改善的等离子体电阻的填充聚合物组合物。该组合物包括分散在聚合物基质中的颗粒填料。颗粒填料可以是Nb2O5，YF3，AlN，SiC或Si3N4和稀土氧化物。在一个实施方案中，组合物用作静电卡盘的粘合剂，用于喷头的粘合剂，衬垫的粘合剂，密封材料，O形环或塑料组分。

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