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1. 发明授权

US11749638B2 Method for contacting and packetising a semiconductor chip 有权
公开(公告)号：US11749638B2
公开(公告)日：2023-09-05
申请号：US16965603
申请日：2019-01-29
申请人： Technische Universität Chemnitz
发明人： Johannes Rudolph , Fabian Lorenz , Ralf Werner , Peter Seidel
IPC分类号： H01L23/00
CPC分类号： H01L24/82 , H01L24/25 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2224/8284 , H01L2224/82104 , H01L2924/13091
摘要： A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

2. 发明公开

US20240145601A1 STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIATE PRODUCT, AND METHOD FOR PRODUCING A NANOELECTRONIC COMPONENT STRUCTURE 审中-公开
公开(公告)号：US20240145601A1
公开(公告)日：2024-05-02
申请号：US18562429
申请日：2022-04-14
申请人： TECHNISCHE UNIVERSITÄT CHEMNITZ
发明人： Sascha Hermann , Simon Böttger , Eric Pankenin
IPC分类号： H01L29/84 , B82Y40/00
CPC分类号： H01L29/84 , B82Y40/00
摘要： An intermediate product for producing a nanoelectronic component structure and a nanoelectronic component structure, each have a substrate, a cavity formed therein, and a nanostructure which partly spans the cavity. A method for producing a nanoelectronic component structure, includes the steps of introducing a cavity into the substrate, and each cavity is bridged by at least one nanostructure. This allows mechanical stress states in nanostructures to be adjusted in a decoupled manner from location and direction. This is achieved in that the nanoelectronic component structure has an arm, which partly overlaps with the cavity, on one side of the respective cavity, the arm being bent or shrunk at the arm end protruding beyond or into the respective cavity. A gap is formed over the cavity, and the nanostructure is arranged on the respective arm so as to span the respective gap and is fixed between the respective arm and contact electrodes formed on each side of the gap.

3. 发明申请

US20210147223A1 MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME 有权
公开(公告)号：US20210147223A1
公开(公告)日：2021-05-20
申请号：US17256565
申请日：2019-06-27
申请人： Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung e.V. , Technische Universität Chemnitz
发明人： Roman Forke , Karla Hiller
IPC分类号： B81C1/00 , B81B3/00 , G01P15/125
摘要： A component for a micromechanical system has an upper side and a lower side disposed opposite the upper side and includes at least one first structural element that is arranged in a first region of the component and bounded by at least one first gap and at least one second structural element that is arranged in a second region of the component different from the first region and bounded by at least one second gap. The first region includes a first cutout in the lower side of the component, wherein a first thickness of the component in the first region is reduced in the second region with respect to a second thickness of the component. A minimal second gap width of the at least one second gap is larger than a minimal first gap width of the at least one first gap.

4. 发明公开

US20240230423A1 Method for Determining the Temperature in a Joining Zone 审中-公开
公开(公告)号：US20240230423A1
公开(公告)日：2024-07-11
申请号：US18290292
申请日：2022-06-10
申请人： Technische Universität Chemnitz Körperschaft des Öffentlichen Rechts
发明人： Guntram Wagner , Andreas Gester , Marco Thomä
IPC分类号： G01K7/08 , B23K20/10 , B23K103/18
CPC分类号： G01K7/08 , B23K20/10 , B23K2103/18
摘要： The invention relates to a method for determining the temperature in a joining zone in a vibration welding process, wherein a first joining partner (1) and a second joining partner (2) are welded together, characterised in that the first and second joining partners (1, 2) act as a thermocouple, wherein, using a first measuring element (5) contacting the first joining partner (1) at a cold site (3) and a second measuring element (10) contacting the second joining partner at a distance from a hot site (8), a potential difference (PI) between the first and second joining partners (1, 2) is detected during the welding process: wherein the second measuring element (10) has a higher temperature than the temperature of the cold site (3) in the region of contact with the second joining partner (2) and has a material of the same type as the second joining partner (2): the potential difference (PI) is compared with material-specific calibration data and processed using a data processing system (7) and the welding process is controlled according to the determined potential difference (PI): the first joining partner (1) is in the form of a multi-wire cable: the first measuring element (5) is in the form of a measuring line, which is connected to the first joining partner (1) by its first end and connected to a data processing system (7) at a measuring point (6) by its second end: the first joining partner (1) and/or the first measuring element (5) are made from aluminium; the second joining partner (2) and/or the second measuring element (10) are made from copper; and the temperature of the cold site corresponds to the ambient temperature of approx. 20° and the contacting takes place in the region of the hot site (8) at a temperature greater than the ambient temperature.

5. 发明申请

US20210395406A1 REVERSIBLE CROSS-LINKING SYSTEM FOR POLYVINYLAMINES 有权
公开(公告)号：US20210395406A1
公开(公告)日：2021-12-23
申请号：US17304579
申请日：2021-06-23
申请人： SOLENIS TECHNOLOGIES, L.P. , Technische Universität Chemnitz
发明人： Florian Taubert , Lysann Kaßner , Tina Uhlig , Andreas Seifert , Stefan Spange , Michael Sommer , Christoph Hamers , Hans-Joachim Haehnle
IPC分类号： C08F26/02 , D21H17/34 , D21H21/18 , D21H27/10
摘要： A vinyl amine containing polymer comprises randomly distributed repeating monomer units having at least two of the following formulae: wherein, R1 is a hydrogen atom or a methyl group; and wherein the vinyl amine containing polymer comprises repeating monomer unit III and/or IV in a total amount of from about 1.5 weight percent to about 8 weight percent based on a total weight of the polymer.

6. 发明申请

US20220274282A1 Component Made from a Material Consisting Predominantly of Renewable Raw Materials, Having at Least One Compressed Region, and Method and Tool for Producing the Compressed Region 有权
公开(公告)号：US20220274282A1
公开(公告)日：2022-09-01
申请号：US17630950
申请日：2020-07-31
申请人： Technische Universität Chemnitz
发明人： Christoph Alt , Eric Penno , Sven Eichhorn , Ronny Eckardt
IPC分类号： B27M1/04 , B32B3/26 , B32B21/04 , B32B21/06 , B32B21/08 , B32B15/10 , B29C70/54
摘要： The invention relates to a component made from a material consisting predominantly of renewable raw materials, the component having at least one hole with a longitudinal axis (A) and the material being locally compressed in the region peripherally adjoining the hole. According to the method, at least one pin, which comprises a substantially cylindrical shaft and a tip having a reducing diameter in the direction of the component, penetrates into the material, thus creating a hole in the component, and displaces the wood material radially and/or axially, so that the material in the region surrounding the hole is compressed. The tool used for carrying out the method is designed in the form of at least one pin having a cylindrical or polygonal shaft and a tip reducing in diameter in the direction of the component.

7. 发明申请

US20220181291A1 Method for Contacting and Packetising a Semiconductor Chip 有权
公开(公告)号：US20220181291A1
公开(公告)日：2022-06-09
申请号：US16965603
申请日：2019-01-29
申请人： Technische Universität Chemnitz
发明人： Johannes Rudolph , Fabian Lorenz , Ralf Werner , Peter Seidel
IPC分类号： H01L23/00
摘要： A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

8. 发明申请

US20210060863A1 Device and Method for Producing a Component by Means of 3D Multi-Material Printing and Component Produced Therewith 有权
公开(公告)号：US20210060863A1
公开(公告)日：2021-03-04
申请号：US16643852
申请日：2018-08-24
申请人： Technische Universität Chemnitz
发明人： Johannes Rudolph , Fabian Lorenz , Ralf Werner
IPC分类号： B29C64/393 , B29C64/165 , B29C64/209 , B29C64/336 , B22F3/00 , B28B1/00 , B28B17/00 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/10
摘要： The invention relates to a method and a device for producing a component by means of 3D multi-material pressure and to a component part produced therewith, wherein metallic and ceramic pastes, mixed with powder and binding agents, for producing the component are applied in layers by means of an extrusion process and are shaped, and the printing process is monitored by means of a monitoring device in such a way that defects in the pressure are detected by means of a camera and the defects are eliminated and/or overfilling or underfilling of each printed layer in relation to the extrusion quantity is monitored by means of a camera and/or temporary blockages in the extrusion nozzle are detected by monitoring the pressure in the region of the extrusion nozzle and released by increasing the pressure. The device comprises a corresponding monitoring device. The device can also have a mixing and feeding device with a vacuum mixing container which is connected to a vibration device. The device can comprise a ceramic construction platform having a porous structure. The component has a lattice structure with beads which are deposited at a distance from one another on a plane.

10. 发明专利

DE102015201119B4 Herstellungsverfahren von Keramikmatrix-Halbzeugen 未知
公开(公告)号：DE102015201119B4
公开(公告)日：2017-10-19
申请号：DE102015201119
申请日：2015-01-23
申请人： TECHNISCHE UNIVERSITÄT CHEMNITZ
发明人： TODT ANDREAS , RODER KRISTINA , NESTLER DAISY , WIELAGE BERNHARD , NIER NATALIA , KROLL LOTHAR , NENDEL WOLFGANG , PÄSSLER ERIK , SPANGE STEFAN , WÜRFEL HENDRYK , WEISSHUHN JULIA
IPC分类号： C04B35/71 , C04B35/524 , C04B35/532 , C04B35/83 , C04B41/83 , C04B41/85
摘要： Verfahren zur Herstellung von Halbzeugen aus faserverstärkter Keramik, Monolithkeramik, Refraktärmetall oder aus einem durch Pyrolyse zersetzbaren Kunststoff, zur Weiterverarbeitung zu Keramikmatrix-Verbundwerkstoffen, aufweisend die folgenden Schritte: a) Bereitstellen von Verstärkungsfasern als Faserbündel oder Verstärkungsfaserhalbzeug, b) Beschichtung der Oberflächen der Verstärkungsfasern mit einem Grundharz, das als Komponenten β-Naphtol, Resorcin und Phloroglucin sowie verschiedene Xylenole enthält und mit einem Dispersionsgemisch, das aus Styren und Bisphenol A besteht und mit einem Epoxid angereichert ist, c) Initiation einer Vernetzungsreaktion der Komponenten aus b) mittels eines Peroxides, bevorzugt mittels Dibenzoylperoxid, d) Thermische Behandlung unter Sauerstoffausschluss bei 200 °C bis 300 °C.

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