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1. 发明专利

JP2017508278A 高出力ポータブルデバイス及びドッキングシステム审中-公开
公开(公告)号：JP2017508278A
公开(公告)日：2017-03-23
申请号：JP2016546003
申请日：2015-01-05
申请人：タンゴテック,インクTango Tech,Inc , タンゴテック,インクTango Tech,Inc
发明人：シャーバヴェシュ , シャーバヴェシュ
IPC分类号： H05K7/20 , G06F1/16 , G06F1/20
CPC分类号： G06F1/203 , G06F1/1632 , G06F1/1656 , G06F1/1658
摘要：システムは、高性能でありながら、極めてコンパクトなデバイス及び関連するドッキングステーションを含んでいる。デバイスは、プロセッサ及び他の発熱コンポーネントに熱的に結合される熱伝達面を画成するハウジング内部に含まれるプロセッサを含んでもよい。ドッキングステーションは、デバイスのハウジングを受けるための部分、受熱面を画成する熱伝導性基板、及び、熱伝達面を受熱面に熱的に結合する伝導性ファイバのアレイを含んでいる。これは、繰返しの熱的結合及び切離を可能にする乾式の低圧熱的結合インターフェースを形成する。これは、高圧、又は、信頼できない繰返し熱的結合及び切離を必要とする従来の半液体又は液体サーマルコンパウンド又はコンプライアントサーマルパッドに対して有利である。熱分散機構は、従って、デバイスから大きく分離され、従って、極めてコンパクトになる。

2. 发明申请

WO2015105741A1 HIGH POWER PORTABLE DEVICE AND DOCKING SYSTEM 审中-公开
标题翻译：高功率便携式设备和锁定系统
公开(公告)号：WO2015105741A1
公开(公告)日：2015-07-16
申请号：PCT/US2015/010100
申请日：2015-01-05
申请人： TANGO TECH, INC
发明人： SHAH, Bhavesh
IPC分类号： H05K7/20 , G06F1/16 , G06F1/20 , H02B1/56
CPC分类号： G06F1/203 , G06F1/1632 , G06F1/1656 , G06F1/1658
摘要： A system includes a high performance but very compact device and an associated docking station. The device may include a processor that is contained within a housing which defines a heat transmission surface that is thermally coupled to the processor and other heat generating components. The docking station includes a portion for receiving the housing of the device, a thermally conductive substrate defining a heat receiving surface, and an array of conductive fibers thermally coupled the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface capable of repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure or unreliable repetitive thermal coupling and decoupling. The thermal dissipation mechanism is therefore largely separated from the device and therefore it becomes very compact.
摘要翻译：系统包括高性能但非常紧凑的设备和相关联的坞站。该装置可以包括容纳在壳体内的处理器，其限定热耦合到处理器和其它发热部件的热传递表面。对接站包括用于接收设备的壳体的部分，限定热接收表面的导热基板和将热传递表面热耦合到热接收表面的导电纤维阵列。这形成了能够重复热耦合和去耦的干式低压热耦合接口。这相对于需要高压或不可靠的重复热耦合和去耦的传统半液体或液体热化合物或柔性热垫来说是有利的。因此，散热机构与设备大体上分离，因此变得非常紧凑。

3. 发明申请

WO2018005120A1 MULTIPLE SERVER ARCHITECTURE, SERVER MODULE, AND COOLER MODULE SYSTEMS AND ARCHITECTURE 审中-公开
标题翻译：多服务器体系结构，服务器模块和冷却器模块系统和体系结构
公开(公告)号：WO2018005120A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/037801
申请日：2017-06-15
申请人： SHAH, Bhavesh , TANGO TECH, INC.
发明人： SHAH, Bhavesh
IPC分类号： B60H3/00
摘要： Embodiments of multiple server architecture with server modules and cooler modules wherein the server modules may be slide from the server architecture back to front to enable servers to be seated or removed transversely from a server module relative to server architecture front. Other embodiments may be described and claimed.
摘要翻译：具有服务器模块和冷却器模块的多服务器体系结构的实施例，其中服务器模块可以从服务器体系结构向后滑动到前面以使服务器能够相对于服务器体系结构从服务器模块横向安装或移除面前。其他实施例可以被描述和要求保护。

4. 发明申请

US20170290202A1 MULTIPLE SERVER ARCHITECTURE, SERVER MODULE, AND COOLER MODULE SYSTEMS AND ARCHITECTURE 审中-公开
公开(公告)号：US20170290202A1
公开(公告)日：2017-10-05
申请号：US15624633
申请日：2017-06-15
申请人： Tango Tech, Inc.
发明人： Bhavesh Shah
IPC分类号： H05K7/20 , G06F13/40 , H05K7/14 , G06F1/20
CPC分类号： H05K7/20781 , G06F1/1632 , G06F1/20 , G06F1/206 , G06F13/4081 , G06F2200/201 , H05K7/1489 , Y02D10/14 , Y02D10/151 , Y02D10/16
摘要： Embodiments of multiple server architecture with server modules and cooler modules wherein the server modules may be slide from the server architecture back to front to enable servers to be seated or removed transversely from a server module relative to server architecture front. Other embodiments may be described and claimed.

5. 发明专利

CA2935924A1 HIGH POWER PORTABLE DEVICE AND DOCKING SYSTEM 未知
公开(公告)号：CA2935924A1
公开(公告)日：2015-07-16
申请号：CA2935924
申请日：2015-01-05
申请人： TANGO TECH INC
发明人： SHAH BHAVESH
IPC分类号： H05K7/20 , G06F1/16 , G06F1/20 , H02B1/56
摘要： A system includes a high performance but very compact device and an associated docking station. The device may include a processor that is contained within a housing which defines a heat transmission surface that is thermally coupled to the processor and other heat generating components. The docking station includes a portion for receiving the housing of the device, a thermally conductive substrate defining a heat receiving surface, and an array of conductive fibers thermally coupled the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface capable of repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure or unreliable repetitive thermal coupling and decoupling. The thermal dissipation mechanism is therefore largely separated from the device and therefore it becomes very compact.

6. 发明公开

EP3092880A1 HIGH POWER PORTABLE DEVICE AND DOCKING SYSTEM 审中-公开
标题翻译：便携式高性能设备和对接
公开(公告)号：EP3092880A1
公开(公告)日：2016-11-16
申请号：EP15735298.0
申请日：2015-01-05
申请人： Tango Tech Inc.
发明人： SHAH, Bhavesh
IPC分类号： H05K7/20 , G06F1/16 , G06F1/20 , H02B1/56
CPC分类号： G06F1/203 , G06F1/1632 , G06F1/1656 , G06F1/1658
摘要： A system includes a high performance but very compact device and an associated docking station. The device may include a processor that is contained within a housing which defines a heat transmission surface that is thermally coupled to the processor and other heat generating components. The docking station includes a portion for receiving the housing of the device, a thermally conductive substrate defining a heat receiving surface, and an array of conductive fibers thermally coupled the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface capable of repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure or unreliable repetitive thermal coupling and decoupling. The thermal dissipation mechanism is therefore largely separated from the device and therefore it becomes very compact.

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