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1. 发明授权

US08540396B2 Lighting system 有权
标题翻译：照明系统
公开(公告)号：US08540396B2
公开(公告)日：2013-09-24
申请号：US13597992
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： H01R33/00 , F21V15/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译：能够有效地散发灯装置的热量的照明器具可以被构造成附接到插座装置。在一些示例中，通过将灯装置附接到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体抵压并与夹具本体紧密接触。通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。

2. 发明申请

US20130201696A1 BULB-SHAPED LAMP AND LIGHTING DEVICE 审中-公开
标题翻译： BULB型灯和照明设备
公开(公告)号：US20130201696A1
公开(公告)日：2013-08-08
申请号：US13814435
申请日：2011-09-27
申请人： Takeshi Hisayasu , Hiroshi Matsushita
发明人： Takeshi Hisayasu , Hiroshi Matsushita
IPC分类号： F21V29/00
CPC分类号： F21V17/164 , F21K9/232 , F21K9/238 , F21V3/02 , F21V23/006 , F21V29/507 , F21V29/70 , F21Y2115/10
摘要： A bulb-shaped lamp includes a housing which is formed of metal, and formed in a cylindrical shape which widely opens toward one end side using press molding. A case which is formed of a synthetic resin, and formed in a cylindrical shape which widely opens toward one end side along the inner surface of the housing is arranged in the housing. A base is attached to the other end side of the case. A heat radiating plate on which a light emitting module having a semiconductor light emitting element is mounted is arranged on one end side of the housing. A lighting circuit is accommodated in the case. The lighting circuit includes a lighting circuit board which is vertically arranged along the lamp axis direction in the case. The lighting circuit board is formed in a shape in which one end side becomes wide in width along the inner surface shape of the case, and is arranged at a position which is close to the base side in the case.
摘要翻译：灯泡状灯包括由金属形成的壳体，并且形成为圆筒状，其通过压模成型朝向一端广泛地开口。由外壳形成的由合成树脂形成的壳体形成为沿着壳体的内表面向一端侧大致开口的圆筒状的壳体。基座附接到壳体的另一端。其上安装有具有半导体发光元件的发光模块的散热板设置在壳体的一端侧。照明电路容纳在壳体中。照明电路包括在壳体中沿灯轴方向垂直设置的照明电路板。照明电路板形成为沿着壳体的内表面形状的一端侧变宽的形状，并且布置在壳体的靠近底侧的位置。

3. 发明授权

US08500316B2 Self-ballasted lamp and lighting equipment 失效
标题翻译：自镇流灯和照明设备
公开(公告)号：US08500316B2
公开(公告)日：2013-08-06
申请号：US13034959
申请日：2011-02-25
申请人： Takeshi Hisayasu , Keisuke Ono
发明人： Takeshi Hisayasu , Keisuke Ono
IPC分类号： B60Q1/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V29/773 , F21Y2115/10
摘要： According to one embodiment, a self-ballasted lamp includes a light-emitting module, a base body, a first insulating member, a screw, a second insulating member, a cap and a lighting circuit. The light-emitting module has a light-emitting portion including semiconductor light-emitting elements mounted on a surface of a metallic substrate. The base body is made of metal and the light-emitting module is arranged on one end side of the base body. The first insulating member is interposed between the substrate of the light-emitting module and the base body. The substrate of the light-emitting module is fixed to the base body with the screws. The second insulating member is interposed between the screws and the substrate of the light-emitting module. The cap is provided at the other end side of the base body. The lighting circuit is housed inside the base body.
摘要翻译：根据一个实施例，自镇流灯包括发光模块，基体，第一绝缘构件，螺钉，第二绝缘构件，盖和照明电路。发光模块具有包括安装在金属基板的表面上的半导体发光元件的发光部。基体由金属制成，发光模块配置在基体的一端侧。第一绝缘构件设置在发光模块的基板和基体之间。发光模块的基板用螺丝固定在基体上。第二绝缘构件插入在发光模块的螺钉和基板之间。盖子设置在基体的另一端侧。照明电路容纳在基体内。

4. 发明申请

US20120320611A1 Socket Device 有权
标题翻译：插座设备
公开(公告)号：US20120320611A1
公开(公告)日：2012-12-20
申请号：US13597953
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V21/00 , F21V17/08 , F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译：能够有效地散发灯装置的热量的照明器具可以被构造成附接到插座装置。在一些示例中，通过将灯装置附接到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体抵压并与夹具本体紧密接触。通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。

5. 发明申请

US20100327746A1 LAMP AND LIGHTING EQUIPMENT USING THE SAME 有权
标题翻译：使用相同的灯和照明设备
公开(公告)号：US20100327746A1
公开(公告)日：2010-12-30
申请号：US12825650
申请日：2010-06-29
申请人： Takeshi HISAYASU
发明人： Takeshi HISAYASU
IPC分类号： F21V23/00
CPC分类号： F21V3/00 , F21K9/23 , F21K9/238 , F21V23/002 , F21V23/006 , F21V23/06 , F21V29/773 , F21V29/89 , F21Y2115/10
摘要： In one embodiment, a lamp with a ferrule includes a substrate to support a light emitting element and a wire insertion portion formed therein. A support portion to arrange the substrate is formed in one end portion of a base body. A through-hole is formed in the support portion corresponding to the wire insertion portion. A concave container portion is provided in the other end portion of the base body to accommodate a circuit board to mount electric parts. An insulating case is arranged between the circuit board and the concave container portion. The insulating case includes a protection element inserted in the through-hole and the wire insertion portion. The protection element is projected at least to inside of the wire insertion portion. A ferrule for supplying electric power to the light emitting element is provided in the other end portion of the base body.
摘要翻译：在一个实施例中，具有套圈的灯包括用于支撑发光元件的基板和形成在其中的线插入部。在基体的一个端部形成有用于配置基板的支撑部。在对应于电线插入部分的支撑部分中形成通孔。凹形容器部分设置在基体的另一端部，以容纳电路板以安装电气部件。绝缘壳体设置在电路板和凹形容器部分之间。绝缘壳体包括插入通孔和电线插入部分中的保护元件。保护元件至少突出到线插入部分的内部。在基体的另一端部设置有用于向发光元件供电的套圈。

6. 发明申请

US20100289396A1 LED BULB AND LIGHTING APPARATUS 有权
标题翻译： LED球泡灯和照明装置
公开(公告)号：US20100289396A1
公开(公告)日：2010-11-18
申请号：US12811795
申请日：2008-12-24
申请人： Shigeru Osawa , Kazuto Morikawa , Toshiya Tanaka , Takeshi Hisayasu
发明人： Shigeru Osawa , Kazuto Morikawa , Toshiya Tanaka , Takeshi Hisayasu
IPC分类号： H01J61/52
CPC分类号： F21V3/02 , F21K9/232 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： An object of the present invention is to provide an LED bulb in which temperature of a lighting circuit is suppressed from rising during lighting of an LED so that life time of the lighting circuit is maintained without increasing manufacturing cost of components. According to the invention, an LED module 11 having multiple LEDs surface-mounted thereon is mounted in a heat dissipating unit 12. Heat generated by the LEDs is dissipated through multiple heat dissipating fins 18 of the heat dissipating unit 12. A glove 14, covering the LED module 11, radiates outward radiant light from the LEDs. A lighting circuit 17 for lighting the LEDs is incorporated in an inner hollow portion 23 of a cap 16 arranged on a side opposite to the glove 14 of the heat dissipating unit 12. Accordingly, the heat generated by the LEDs of the LED module 11 is mostly dissipated by the heat dissipating unit 12, thereby suppressing the temperature of the lighting circuit from rising.
摘要翻译：本发明的一个目的是提供一种LED灯泡，其中在点亮LED期间抑制照明电路的温度升高，从而保持照明电路的寿命而不增加部件的制造成本。根据本发明，具有表面安装在其上的多个LED的LED模块11安装在散热单元12中。由LED产生的热量通过散热单元12的多个散热片18散发。手套14覆盖 LED模块11从LED辐射向外的辐射光。用于照明LED的照明电路17被结合在布置在与散热单元12的手套14相对的一侧的盖16的内部中空部分23中。因此，LED模块11的LED产生的热量是主要由散热单元12耗散，由此抑制点火电路的温度升高。

7. 发明授权

US08613529B2 Lighting fixture 有权
标题翻译：照明灯具
公开(公告)号：US08613529B2
公开(公告)日：2013-12-24
申请号：US13119519
申请日：2009-11-16
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00 , H01R33/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： There is provided a lighting fixture 11 capable of efficiently radiating heat of a lamp device 14 attached to a socket device 13. By attaching the lamp device 14 to the socket device 13, a cap portion 38 of the lamp device is brought into contact with a fixture body 12, and pressed against and brought into contact with the fixture body 12 by an elastic body 30. Heat generated by lighting of LEDs 35 of the lamp device 14 is conducted from the cap portion 38 to the fixture body 12 and efficiently radiated.
摘要翻译：提供了能够有效地散发安装在插座装置13上的灯装置14的热量的照明器具11.通过将灯装置14安装到插座装置13，使灯装置的盖部38与夹具本体12，并通过弹性体30压靠固定主体12.与灯装置14的LED35的照明产生的热量从盖部38向夹具本体12传导并有效地照射。

8. 发明授权

US08540399B2 Socket device 有权
公开(公告)号：US08540399B2
公开(公告)日：2013-09-24
申请号：US13597804
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

9. 发明授权

US08395304B2 Lamp and lighting equipment with thermally conductive substrate and body 有权
标题翻译：灯具和照明设备带有导热基板和主体
公开(公告)号：US08395304B2
公开(公告)日：2013-03-12
申请号：US12888921
申请日：2010-09-23
申请人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara
发明人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara
IPC分类号： H01J61/52
CPC分类号： F21V19/0055 , F21K9/23 , F21K9/238 , F21V3/00 , F21V19/004 , F21V23/002 , F21V23/006 , F21Y2115/10
摘要： In one embodiment, a lamp includes a thermal conductive hollow base body having a concave container portion, an opening portion formed at one end portion so as to communicate with the container portion and a substrate support portion formed at a peripheral portion of the opening portion. A substrate is formed of one of a thermal conductive metal plate and a thermal conductive insulating plate and including a semiconductor lighting element mounted on one surface. A peripheral portion of the other surface of the substrate is fixed to the substrate support portion so as to cover the opening portion in a thermally conductive state therebetween. A power supply device is accommodated in the container portion of the base body to light on the semiconductor lighting element. A base is provided at the other end portion side of the base body and electrically connected with the power supply device.
摘要翻译：在一个实施例中，灯包括导热中空基体，其具有凹形容器部分，在一个端部形成以与容器部分连通的开口部分和形成在开口部分的周边部分的基板支撑部分。基板由导热金属板和导热绝缘板中的一个形成，并且包括安装在一个表面上的半导体照明元件。基板的另一个表面的周边部分固定到基板支撑部分，以便在其间以导热状态覆盖开口部分。电源装置被容纳在基体的容器部分中以在半导体照明元件上点亮。基座设置在基体的另一端部侧并与电源装置电连接。

10. 发明授权

US08388189B2 Socket device 有权
公开(公告)号：US08388189B2
公开(公告)日：2013-03-05
申请号：US13597953
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

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