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1. 发明申请

WO2012121834A3 APPARATUS AND METHODS FOR REAL-TIME THREE-DIMENSIONAL SEM IMAGING AND VIEWING OF SEMICONDUCTOR WAFERS 审中-公开
标题翻译：用于实时三维扫描成像和半导体波形显示的装置和方法
公开(公告)号：WO2012121834A3
公开(公告)日：2013-01-03
申请号：PCT/US2012024857
申请日：2012-02-13
申请人： KLA TENCOR CORP , CHEN CHIEN-HUEI , MACDONALD PAUL D , KUPPA RAJASEKHAR , TADA TAKUJI , ABBOTT GORDON , TEH CHO , YANG HEDONG , LANG STEPHEN , NEIL MARK , SAIDIN ZAIN
发明人： CHEN CHIEN-HUEI , MACDONALD PAUL D , KUPPA RAJASEKHAR , TADA TAKUJI , ABBOTT GORDON , TEH CHO , YANG HEDONG , LANG STEPHEN , NEIL MARK , SAIDIN ZAIN
IPC分类号： G01N23/225 , G01B21/20
CPC分类号： G01N23/2251
摘要： One embodiment relates to a method of real-time three-dimensional electron beam imaging of a substrate surface. A primary electron beam is scanned over the substrate surface causing electrons to be emitted therefrom. The emitted electrons are simultaneously detection using a plurality of at least two off-axis sensors so as to generate a plurality of image data frames, each image data frame being due to electrons emitted from the substrate surface at a different view angle. The plurality of image data frames are automatically processed to generate a three-dimensional representation of the substrate surface. Multiple views of the three-dimensional representation are then displayed. Other embodiments, aspects and features are also disclosed.
摘要翻译：一个实施例涉及衬底表面的实时三维电子束成像的方法。在基板表面上扫描一次电子束，使电子从其发射。发射的电子同时使用多个至少两个离轴传感器进行检测，以产生多个图像数据帧，每个图像数据帧是由于以不同视角从基板表面发射的电子。多个图像数据帧被自动处理以产生衬底表面的三维表示。然后显示三维表示的多个视图。还公开了其它实施例，方面和特征。

2. 发明申请

WO2010094025A3 USE OF DESIGN INFORMATION AND DEFECT IMAGE INFORMATION IN DEFECT CLASSIFICATION 审中-公开
标题翻译：在缺陷分类中使用设计信息和缺陷图像信息
公开(公告)号：WO2010094025A3
公开(公告)日：2010-11-18
申请号：PCT/US2010024291
申请日：2010-02-16
申请人： KLA TENCOR CORP , ABBOTT GORDON , FOUQUET CHRISTOPHE , TADMOR ORI , TADA TAKUJI
发明人： ABBOTT GORDON , FOUQUET CHRISTOPHE , TADMOR ORI , TADA TAKUJI
IPC分类号： H01L21/66
CPC分类号： G06T7/0006 , G06K2209/19 , G06T2207/10061 , G06T2207/30148
摘要： Defects observed by imaging tools may be classified by automatic comparison of features observed in a defect image with design information relating to corresponding portions of the image. Defect information may be generated from a defect image from a defect imaging tool. Design information relating to one or more structures to be formed on the substrate in a vicinity of the defect may be retrieved. The defect may be classified based on a combination of the defect information from the defect image and design information relating to one or more structures to be formed on the substrate in the vicinity of the defect.
摘要翻译：成像工具观察到的缺陷可以通过将缺陷图像中观察到的特征与关于图像的对应部分的设计信息进行自动比较来分类。可以从缺陷成像工具的缺陷图像生成缺陷信息。可以检索与待形成在缺陷附近的衬底上的一个或多个结构相关的设计信息。缺陷可以基于来自缺陷图像的缺陷信息和与缺陷附近的衬底上要形成的一个或多个结构相关的设计信息的组合来分类。

3. 发明申请

WO2010094025A2 USE OF DESIGN INFORMATION AND DEFECT IMAGE INFORMATION IN DEFECT CLASSIFICATION 审中-公开
标题翻译：设计信息的使用和缺陷分类中的图像信息缺陷
公开(公告)号：WO2010094025A2
公开(公告)日：2010-08-19
申请号：PCT/US2010/024291
申请日：2010-02-16
申请人： KLA-TENCOR CORPORATION , ABBOTT, Gordon , FOUQUET, Christophe , TADMOR, Ori , TADA, Takuji
发明人： ABBOTT, Gordon , FOUQUET, Christophe , TADMOR, Ori , TADA, Takuji
IPC分类号： H01L21/66
CPC分类号： G06T7/0006 , G06K2209/19 , G06T2207/10061 , G06T2207/30148
摘要： Defects observed by imaging tools may be classified by automatic comparison of features observed in a defect image with design information relating to corresponding portions of the image. Defect information may be generated from a defect image from a defect imaging tool. Design information relating to one or more structures to be formed on the substrate in a vicinity of the defect may be retrieved. The defect may be classified based on a combination of the defect information from the defect image and design information relating to one or more structures to be formed on the substrate in the vicinity of the defect.
摘要翻译：通过成像工具观察到的缺陷可以通过将缺陷图像中观察到的特征与与图像的对应部分有关的设计信息进行自动比较来分类。可以从缺陷成像工具的缺陷图像生成缺陷信息。可以检索与在缺陷附近形成在基板上的一个或多个结构相关的设计信息。可以基于来自缺陷图像的缺陷信息和与要在缺陷附近的基板上形成的一个或多个结构相关的设计信息的组合来分类缺陷。

4. 发明申请

WO2012121834A2 APPARATUS AND METHODS FOR REAL-TIME THREE-DIMENSIONAL SEM IMAGING AND VIEWING OF SEMICONDUCTOR WAFERS 审中-公开
标题翻译：用于实时三维扫描成像和半导体波形显示的装置和方法
公开(公告)号：WO2012121834A2
公开(公告)日：2012-09-13
申请号：PCT/US2012/024857
申请日：2012-02-13
申请人： KLA-TENCOR CORPORATION , CHEN, Chien-Huei , MACDONALD, Paul D. , KUPPA, Rajasekhar , TADA, Takuji , ABBOTT, Gordon , TEH, Cho , YANG, Hedong , LANG, Stephen , NEIL, Mark , SAIDIN, Zain
发明人： CHEN, Chien-Huei , MACDONALD, Paul D. , KUPPA, Rajasekhar , TADA, Takuji , ABBOTT, Gordon , TEH, Cho , YANG, Hedong , LANG, Stephen , NEIL, Mark , SAIDIN, Zain
IPC分类号： G01N23/225 , G01B21/20
CPC分类号： G01N23/2251
摘要： One embodiment relates to a method of real-time three-dimensional electron beam imaging of a substrate surface. A primary electron beam is scanned over the substrate surface causing electrons to be emitted therefrom. The emitted electrons are simultaneously detection using a plurality of at least two off-axis sensors so as to generate a plurality of image data frames, each image data frame being due to electrons emitted from the substrate surface at a different view angle. The plurality of image data frames are automatically processed to generate a three-dimensional representation of the substrate surface. Multiple views of the three-dimensional representation are then displayed. Other embodiments, aspects and features are also disclosed.
摘要翻译：一个实施例涉及衬底表面的实时三维电子束成像的方法。在基板表面上扫描一次电子束，使电子从其发射。发射的电子同时使用多个至少两个离轴传感器进行检测，以产生多个图像数据帧，每个图像数据帧是由于以不同视角从基板表面发射的电子。多个图像数据帧被自动处理以产生衬底表面的三维表示。然后显示三维表示的多个视图。还公开了其它实施例，方面和特征。

5. 发明申请

WO2011122715A1 RADIATION DETECTION DEVICE, RADIOGRAPHIC APPARATUS AND RADIOGRAPHIC SYSTEM 审中-公开
标题翻译：辐射检测装置，放射性设备和放射性系统
公开(公告)号：WO2011122715A1
公开(公告)日：2011-10-06
申请号：PCT/JP2011/058950
申请日：2011-03-29
申请人： FUJIFILM Corporation , TADA, Takuji
发明人： TADA, Takuji
IPC分类号： A61B6/00 , A61B6/06
CPC分类号： A61B6/06 , A61B6/4291 , A61B6/484 , G21K2201/06 , G21K2207/005
摘要： A radiographic system includes an X-ray source, a first transmission type grating, a second transmission type grating, a scanning mechanism, and a flat panel detector, and an arithmetic processing section. The first transmission type grating is constituted by connecting a plurality of first grating pieces in a first direction, and the second transmission type grating is constituted by connecting a plurality of second grating pieces in the first direction. In projection onto the flat panel detector with the focus of the X-ray source as a viewpoint, at least one pixel is interposed between each pixel of the flat panel detector onto which a connection point of two adjacent first grating pieces is projected and each pixel onto which a connection portion of two adjacent second grating pieces is projected.
摘要翻译：射线照相系统包括X射线源，第一透射型光栅，第二透射型光栅，扫描机构和平板检测器，以及算术处理部。第一透射型光栅通过沿第一方向连接多个第一光栅片而构成，第二透射型光栅通过沿第一方向连接多个第二光栅片而构成。在将X射线源的焦点作为视点投影到平板检测器上时，在平板检测器的每个像素之间插入至少一个像素，其中两个相邻的第一光栅片的连接点投射到其上，并且每个像素两个相邻的第二光栅片的连接部分投射到其上。

6. 发明申请

WO2011096584A1 RADIATION IMAGING SYSTEM 审中-公开
标题翻译：辐射成像系统
公开(公告)号：WO2011096584A1
公开(公告)日：2011-08-11
申请号：PCT/JP2011/052675
申请日：2011-02-02
申请人： FUJIFILM Corporation , MURAKOSHI, Dai , TADA, Takuji , AGANO, Toshitaka , TAKAHASHI, Kenji
发明人： MURAKOSHI, Dai , TADA, Takuji , AGANO, Toshitaka , TAKAHASHI, Kenji
IPC分类号： A61B6/00 , A61B6/06
CPC分类号： A61B6/484 , A61B6/022 , A61B6/03 , A61B6/06 , A61B6/4233 , A61B6/4291 , A61B6/4441 , A61B6/4464 , A61B6/502 , A61B6/5241 , G21K1/06 , G21K1/067 , G21K2201/06 , G21K2207/005
摘要： An X-ray imaging system is provided with an X-ray source (11), first and second absorption gratings (31, 32), and a flat panel detector (FPD) (30), and obtains a phase contrast image of an object H by performing imaging while moving the second absorption grating (32) in x direction relative to the first absorption grating (31). The following mathematical expression is satisfied where p 1 ' denotes a period of a first pattern image at a position of the second absorption grating (32), and p 2 ' denotes a substantial grating pitch of the second absorption grating (32), and D x denotes a dimension, in the x-direction, of an X-ray imaging area of each pixel of the FPD (30). Here, "n" denotes a positive integer. D x ≠ n x (p 1 ' x p 2 ')/ |p 1 ' - p 2 '|
摘要翻译： X射线成像系统设置有X射线源（11），第一和第二吸收光栅（31,32）和平板检测器（FPD）（30），并且获得物体的相位对比图像 H，通过在相对于第一吸收光栅（31）的x方向上移动第二吸收光栅（32）的同时执行成像。满足以下数学表达式，其中p1'表示第二吸收光栅（32）的位置处的第一图案图像的周期，p2'表示第二吸收光栅（32）的实质光栅间距，Dx表示在所述FPD（30）的每个像素的X射线成像区域的x方向上的尺寸。这里，“n”表示正整数。 Dx？ n x（p1'x p2'）/ | p1' - p2'|

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