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    • 1. 发明申请
    • Die Change apparatus and die carrying-in device for use in flaskless molding machine
    • 用于无烧瓶成型机的模具更换装置和模具进入装置
    • US20140000833A1
    • 2014-01-02
    • US13576291
    • 2011-03-25
    • Keisuke YabuhanaSyuichi FurukawaSyozaburo TsuzukiEiji Ito
    • Keisuke YabuhanaSyuichi FurukawaSyozaburo TsuzukiEiji Ito
    • B22C19/00
    • B22D47/02B22C11/10B22C19/00B22C23/00
    • Provided are a die change apparatus for use in a flaskless molding machine capable of mounting dies for producing a casting mold on die bases even when the dies have a great thickness, and a die carrying-in device used therein. The die carrying-in device comprises a first movable plate provided so as to be slidable along a die carrying-in direction toward a first die base, and a second movable plate placed so as to face the first movable plate in a standby position. A die drive source causes dies which have been positioned in a height direction to be detached from the movable plates, move toward the die bases, and be supported by clamping elements. An intersection drive source causes at least one of the first movable plate and the second movable plate to move in a direction to intersect the die carrying-in direction independently of the other.
    • 提供了一种用于无棚成型机的模具更换装置,即使在模具具有较大厚度的情况下,也能够在模座上安装用于生产铸模的模具,以及其中使用的模具装载装置。 芯片承载装置包括:第一可移动板,其设置成沿着模具携带方向朝向第一模座基座滑动;以及第二可移动板,以在备用位置面对第一可移动板。 模具驱动源使得已经在高度方向上定位的模具能够从可移动板拆下,朝向模座移动,并被夹紧元件支撑。 交叉点驱动源使得第一可动板和第二可动板中的至少一个沿独立于另一个的模具移入方向相交的方向移动。
    • 2. 发明授权
    • Die change apparatus and die carrying-in device for use in flaskless molding machine
    • 用于无烧瓶成型机的模具更换装置和模具搬运装置
    • US08813819B2
    • 2014-08-26
    • US13576291
    • 2011-03-25
    • Keisuke YabuhanaSyuichi FurukawaSyozaburo TsuzukiEiji Ito
    • Keisuke YabuhanaSyuichi FurukawaSyozaburo TsuzukiEiji Ito
    • B22C11/10B22D47/02
    • B22D47/02B22C11/10B22C19/00B22C23/00
    • Provided are a die change apparatus for use in a flaskless molding machine capable of mounting dies for producing a casting mold on die bases even when the dies have a great thickness, and a die carrying-in device used therein. The die carrying-in device comprises a first movable plate provided so as to be slidable along a die carrying-in direction toward a first die base, and a second movable plate placed so as to face the first movable plate in a standby position. A die drive source causes dies which have been positioned in a height direction to be detached from the movable plates, move toward the die bases, and be supported by clamping elements. An intersection drive source causes at least one of the first movable plate and the second movable plate to move in a direction to intersect the die carrying-in direction independently of the other.
    • 提供了一种用于无棚成型机的模具更换装置,即使在模具具有较大厚度的情况下,也能够在模座上安装用于生产铸模的模具,以及其中使用的模具装载装置。 芯片承载装置包括:第一可移动板,其设置成沿着模具携带方向朝向第一模座基座滑动;以及第二可移动板,以在备用位置面对第一可移动板。 模具驱动源使得已经在高度方向上定位的模具能够从可移动板拆下,朝向模座移动,并被夹紧元件支撑。 交叉点驱动源使得第一可动板和第二可动板中的至少一个沿独立于另一个的模具移入方向相交的方向移动。