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    • 1. 发明授权
    • Bonded assembly and method for preparing same
    • 粘合组件及其制备方法
    • US06676795B1
    • 2004-01-13
    • US09916293
    • 2001-07-30
    • Susan Levandoski
    • Susan Levandoski
    • B32B3128
    • C09J5/00C08L33/14C08L75/04C09J133/14C09J175/16C09J2205/31C09J2400/226C09J2475/00
    • A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.
    • 一种制备两个基底的粘合组件的方法,所述两个基底的至少一个对于紫外线或可见光是透明或半透明的,包括:a)向至少一个基底施加光/厌氧双重固化组合物,其包含:i) 甲基)丙烯酸酯封端的氨基甲酸酯低聚物,ii)至少一种(甲基)丙烯酸酯稀释剂单体,iii)厌氧固化体系,和/或自由基光引发剂; b)接合两个基材c)通过所述透明或半透明 具有有效激活光引发剂的波长的光的衬底足以至少固定粘合剂的时间,然后d)允许组件在环境条件下进一步固化,而不会经历至少24小时,而不会使夹具组件受到显着的剥离应力。
    • 2. 发明授权
    • Method of preparing fiber/resin composites
    • 制备纤维/树脂复合材料的方法
    • US5679719A
    • 1997-10-21
    • US473730
    • 1995-06-07
    • Philip T. KlemarczykYoshihisa OkamotoJames P. Moran, Jr.Susan LevandoskiVeronica Hanlon
    • Philip T. KlemarczykYoshihisa OkamotoJames P. Moran, Jr.Susan LevandoskiVeronica Hanlon
    • C08F2/50C08F283/10C08J3/24C08J5/04C08L63/02C08L63/04
    • C08F283/10C08J3/243C08J5/04C08J5/24C08J2363/00Y10T428/2918Y10T428/2936
    • Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator which is not a peroxide, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C. Also, fiber resin composites comprising fiber substrates impregnated with the dual-curing resin compositions is disclosed. Also the process for coating fiber substrates with the dual-curing resin compositions is disclosed.
    • 用于长丝缠绕应用的树脂组合物,其包含包含至少一种可热固化的聚环氧树脂的环氧组分,包含至少一种可通过光化辐射固化的聚烯烃不饱和单体的烯属不饱和单体组分,至少一种不是过氧化物的光引发剂,至少 一种有机过氧化物和用于环氧化物的热活化固化剂。 该组合物的粘度小于约2000厘泊(cps),并且能够在约环境温度至约60℃的温度下保持该粘度至少约2小时。树脂能够通过光化辐射固定 暴露并进一步加热固化,而没有实质的树脂滴落。 使用一种或多种有机过氧化物,选自在约50℃至小于约104℃的温度下具有10分钟分解半衰期的有机过氧化物。此外,包含浸渍有双重的纤维基材的纤维树脂复合材料 公开了固化树脂组合物。 还公开了用双重固化树脂组合物涂布纤维基材的方法。