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1. 发明授权

US06945861B2 Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
公开(公告)号：US06945861B2
公开(公告)日：2005-09-20
申请号：US11075635
申请日：2005-03-08
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B41/06 , B24B49/00
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

2. 发明申请

US20070232209A1 METHOD FOR POLISHING A SEMICONDUCTOR WAFER 审中-公开
标题翻译：抛光半导体波长的方法
公开(公告)号：US20070232209A1
公开(公告)日：2007-10-04
申请号：US11753893
申请日：2007-05-25
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B19/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

3. 发明授权

US06921323B2 Apparatus for polishing a semiconductor wafer and method therefor 失效
标题翻译：用于研磨半导体晶片的装置及其方法
公开(公告)号：US06921323B2
公开(公告)日：2005-07-26
申请号：US10670855
申请日：2003-09-25
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

4. 发明授权

US06881135B2 Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
标题翻译：化学机械抛光装置的抛光头和使用其的抛光方法
公开(公告)号：US06881135B2
公开(公告)日：2005-04-19
申请号：US10881925
申请日：2004-06-30
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B41/06 , B24B49/00
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
摘要翻译：化学机械抛光（CMP）装置包括由载体和膜构成的抛光头，并且位于支撑部件的抛光垫上。抛光头具有安装在载体的内部中心的支撑件，位于载体和支撑件之间的卡环，以及用于沿垂直方向上下移动夹紧环的装置。支撑件与膜一起形成密封空间，夹紧环将真空中的晶片夹紧。

5. 发明申请

US20050136806A1 Apparatus for polishing a semiconductor wafer and method therefor 失效
公开(公告)号：US20050136806A1
公开(公告)日：2005-06-23
申请号：US11052275
申请日：2005-02-07
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

6. 发明授权

US06769973B2 Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
标题翻译：化学机械抛光装置的抛光头和使用其的抛光方法
公开(公告)号：US06769973B2
公开(公告)日：2004-08-03
申请号：US10107612
申请日：2002-03-27
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
摘要翻译：化学机械抛光（CMP）装置包括由载体和膜构成的抛光头，并且位于支撑部件的抛光垫上。抛光头具有安装在载体的内部中心的支撑件，位于载体和支撑件之间的卡环，以及用于沿垂直方向上下移动夹紧环的装置。支撑件与膜一起形成密封空间，夹紧环将真空中的晶片夹紧。

7. 发明授权

US06652362B2 Apparatus for polishing a semiconductor wafer and method therefor 失效
公开(公告)号：US06652362B2
公开(公告)日：2003-11-25
申请号：US09877922
申请日：2001-06-07
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

8. 发明授权

US06383882B1 Method for fabricating MOS transistor using selective silicide process 有权
标题翻译：使用选择性硅化物工艺制造MOS晶体管的方法
公开(公告)号：US06383882B1
公开(公告)日：2002-05-07
申请号：US09860591
申请日：2001-05-21
申请人： Sun-wung Lee , Jae-phil Boo , Kyung-hyun Kim , Chang-ki Hong
发明人： Sun-wung Lee , Jae-phil Boo , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： H01L21336
CPC分类号： H01L21/823468 , H01L21/28052 , H01L21/28114 , H01L21/823425 , H01L21/823443
摘要： A method for fabricating a MOS transistor using a selective silicide process wherein a gate insulating layer and a gate polysilicon layer are sequentially formed on a silicon substrate, and a gate spacer is formed on a side wall of the gate insulating layer and the gate polysilicon layer. Impurity ions are implanted and diffused using the gate spacer and the gate polysilicon layer as a mask layer to form a source/drain region in the substrate. An etching blocking layer is formed to cover the source/drain region, the gate spacer, and the gate polysilicon layer, and then, a dielectric layer to cover the etching blocking layer is formed. The dielectric layer is planarized, and the etching blocking layer on the gate polysilicon layer is exposed. The exposed etching blocking layer and a part of the gate spacer are etched, and a top surface and a top side of the gate polysilicon layer are exposed. A silicide layer is formed over the exposed part of the gate polysilicon layer.
摘要翻译：一种使用选择性硅化物工艺制造MOS晶体管的方法，其中在硅衬底上依次形成栅极绝缘层和栅极多晶硅层，并且栅极间隔物形成在栅极绝缘层和栅极多晶硅层的侧壁上。使用栅极间隔物和栅极多晶硅层作为掩模层注入和扩散杂质离子，以在衬底中形成源极/漏极区域。形成蚀刻阻挡层以覆盖源极/漏极区域，栅极间隔物和栅极多晶硅层，然后形成覆盖蚀刻阻挡层的电介质层。介电层被平坦化，并且露出栅极多晶硅层上的蚀刻阻挡层。蚀刻暴露的蚀刻阻挡层和栅极间隔物的一部分，并且露出栅极多晶硅层的顶表面和顶侧。在栅极多晶硅层的暴露部分上形成硅化物层。

9. 发明授权

US07223158B2 Method for polishing a semiconductor wafer 失效
标题翻译：抛光半导体晶片的方法
公开(公告)号：US07223158B2
公开(公告)日：2007-05-29
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

10. 发明申请

US20060116056A1 Apparatus and methods for polishing a semiconductor wafer 失效
标题翻译：用于抛光半导体晶片的装置和方法
公开(公告)号：US20060116056A1
公开(公告)日：2006-06-01
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B1/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

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