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    • 2. 发明授权
    • Nitride semiconductor light emitting device and fabrication method thereof
    • 氮化物半导体发光器件及其制造方法
    • US08558258B2
    • 2013-10-15
    • US13524688
    • 2012-06-15
    • Suk Hun Lee
    • Suk Hun Lee
    • H01L33/20
    • H01L33/007H01L33/12
    • The present invention relates to a nitride semiconductor light emitting device including: a substrate having a predetermined pattern formed on a surface thereof by an etch; a protruded portion disposed on a non-etched region of the substrate, and having a first buffer layer and a first nitride semiconductor layer stacked thereon; a second buffer layer formed on the etched region of the substrate; a second nitride semiconductor layer formed on the second buffer layer and the protruded portion; a third nitride semiconductor layer formed on the second nitride semiconductor layer; an active layer formed on the third nitride semiconductor layer to emit light; and a fourth nitride semiconductor layer formed on the active layer. According to the present invention, the optical extraction efficiency of the nitride semiconductor light emitting device can be enhanced.
    • 本发明涉及一种氮化物半导体发光器件,包括:具有通过蚀刻形成在其表面上的预定图案的衬底; 突出部,设置在所述基板的未蚀刻区域上,并且具有堆叠在其上的第一缓冲层和第一氮化物半导体层; 形成在所述基板的所述蚀刻区域上的第二缓冲层; 形成在第二缓冲层和突出部分上的第二氮化物半导体层; 形成在所述第二氮化物半导体层上的第三氮化物半导体层; 形成在所述第三氮化物半导体层上以发光的有源层; 以及形成在所述有源层上的第四氮化物半导体层。 根据本发明,能够提高氮化物半导体发光元件的光学提取效率。
    • 3. 发明申请
    • NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF
    • 氮化物半导体发光器件及其制造方法
    • US20120248411A1
    • 2012-10-04
    • US13524688
    • 2012-06-15
    • SUK HUN LEE
    • SUK HUN LEE
    • H01L33/04
    • H01L33/007H01L33/12
    • The present invention relates to a nitride semiconductor light emitting device including: a substrate having a predetermined pattern formed on a surface thereof by an etch; a protruded portion disposed on a non-etched region of the substrate, and having a first buffer layer and a first nitride semiconductor layer stacked thereon; a second buffer layer formed on the etched region of the substrate; a second nitride semiconductor layer formed on the second buffer layer and the protruded portion; a third nitride semiconductor layer formed on the second nitride semiconductor layer; an active layer formed on the third nitride semiconductor layer to emit light; and a fourth nitride semiconductor layer formed on the active layer. According to the present invention, the optical extraction efficiency of the nitride semiconductor light emitting device can be enhanced.
    • 本发明涉及一种氮化物半导体发光器件,包括:具有通过蚀刻形成在其表面上的预定图案的衬底; 突出部,设置在所述基板的未蚀刻区域上,并且具有堆叠在其上的第一缓冲层和第一氮化物半导体层; 形成在所述基板的所述蚀刻区域上的第二缓冲层; 形成在第二缓冲层和突出部分上的第二氮化物半导体层; 形成在所述第二氮化物半导体层上的第三氮化物半导体层; 形成在所述第三氮化物半导体层上以发光的有源层; 以及形成在所述有源层上的第四氮化物半导体层。 根据本发明,能够提高氮化物半导体发光元件的光学提取效率。
    • 5. 发明授权
    • Nitride semiconductor LED and fabrication method thereof
    • 氮化物半导体LED及其制造方法
    • US07847279B2
    • 2010-12-07
    • US11718664
    • 2005-07-06
    • Suk Hun Lee
    • Suk Hun Lee
    • H01L33/00
    • H01L33/32H01L33/04H01L33/06H01L33/12H01L33/14H01L33/36
    • A nitride semiconductor light emitting diode according to the present invention, includes: a substrate; a buffer layer formed on the substrate; an In-doped GaN layer formed on the buffer layer; a first electrode layer formed on the In-doped GaN layer; an InxGa1-xN layer formed on the first electrode layer; an active layer formed on the InxGa1-xN layer; a first P—GaN layer formed on the active layer; a second electrode layer formed on the first P—GaN layer; a second P—GaN layer partially protruded on the second electrode layer; and a third electrode formed on the second P—GaN layer.
    • 根据本发明的氮化物半导体发光二极管包括:基板; 形成在所述基板上的缓冲层; 形成在缓冲层上的In掺杂GaN层; 形成在In掺杂GaN层上的第一电极层; 形成在所述第一电极层上的In x Ga 1-x N层; 形成在In x Ga 1-x N层上的有源层; 形成在有源层上的第一P-GaN层; 形成在所述第一P-GaN层上的第二电极层; 在第二电极层上部分地突出的第二P-GaN层; 以及形成在第二P-GaN层上的第三电极。
    • 7. 发明授权
    • Nitride semiconductor light emitting device and fabrication method thereof
    • 氮化物半导体发光器件及其制造方法
    • US07808010B2
    • 2010-10-05
    • US11661185
    • 2005-08-19
    • Suk Hun Lee
    • Suk Hun Lee
    • H01L33/00H01L29/06
    • H01L33/32H01L33/02H01L33/025H01L33/06H01L33/26
    • A nitride semiconductor light emitting device comprises a first nitride semiconductor layer, an active layer of a single or multiple quantum well structure formed on the first nitride semiconductor layer and including an InGaN well layer and a multilayer barrier layer, and a second nitride semiconductor layer formed on the active layer. A fabrication method of a nitride semiconductor light emitting device comprises: forming a buffer layer on a substrate, forming a GaN layer on the buffer layer, forming a first electrode layer on the GaN layer, forming an InxGa1-xN layer on the first electrode layer, forming on the first InxGa1-xN layer an active layer including an InGaN well layer and a multilayer barrier layer for emitting light, forming a p-GaN layer on the active layer, and forming a second electrode layer on the p-GaN layer.
    • 氮化物半导体发光器件包括第一氮化物半导体层,形成在第一氮化物半导体层上并包括InGaN阱层和多层势垒层的单个或多个量子阱结构的有源层和形成的第二氮化物半导体层 在活动层。 氮化物半导体发光器件的制造方法包括:在衬底上形成缓冲层,在缓冲层上形成GaN层,在GaN层上形成第一电极层,在第一电极层上形成In x Ga 1-x N层 在第一In x Ga 1-x N层上形成包括InGaN阱层的有源层和用于发光的多层势垒层,在有源层上形成p-GaN层,并在p-GaN层上形成第二电极层。