专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130084658A1 Separation of Semiconductor Devices from a Wafer Carrier 有权
标题翻译：半导体器件与晶圆载体的分离
公开(公告)号：US20130084658A1
公开(公告)日：2013-04-04
申请号：US13252816
申请日：2011-10-04
申请人： Mathias Vaupel , Sebastian Bernrieder , Adolf Koller , Stefan Martens
发明人： Mathias Vaupel , Sebastian Bernrieder , Adolf Koller , Stefan Martens
IPC分类号： H01L21/66 , H01L21/50 , H01L21/78
CPC分类号： H01L21/78 , H01L21/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67 , H01L21/67092 , H01L21/67144 , H01L21/683 , H01L21/6836 , H01L23/3107 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.
摘要翻译：根据本发明的实施例，通过在框架上配置多个半导体器件来制造半导体器件，所述半导体器件具有粘合箔。多个半导体器件附接到粘合箔。使用二氧化碳喷射和/或激光工艺，使用粘合剂箔从框架中移除多个半导体器件。

2. 发明申请

US20100051828A1 PROCESSING SYSTEM 有权
标题翻译：加工系统
公开(公告)号：US20100051828A1
公开(公告)日：2010-03-04
申请号：US12542926
申请日：2009-08-18
申请人： Holger Doemer , Stefan Martens , Walter Mack
发明人： Holger Doemer , Stefan Martens , Walter Mack
IPC分类号： G21K5/04
CPC分类号： G21K5/04 , B23K26/032 , B23K26/082 , B23K26/083 , B23K26/1224 , B23K26/705 , G21K5/00 , H01J37/20 , H01J37/3056 , H01J37/3178 , H01J2237/20221 , H01J2237/3151 , H01J2237/31732 , H01J2237/3174 , H01J2237/31744
摘要： A processing system includes a particle beam column for generating a particle beam directed to a first processing location; a laser system for generating a laser beam directed to a second processing location located at a distance from the first processing location; and a protector including an actuator and a plate connected to the actuator. The actuator is configured to move the plate between a first position in which it protects a component of the particle beam column from particles released from the object by the laser beam and a second position in which the component of the particle beam column is not protected from particles released from the object by the laser beam.
摘要翻译：处理系统包括用于产生指向第一处理位置的粒子束的粒子束列; 用于产生指向位于距离所述第一处理位置一定距离的第二处理位置的激光束的激光系统; 以及包括致动器和连接到致动器的板的保护器。所述致动器构造成使所述板在第一位置和第二位置之间移动，所述第一位置在所述第一位置和所述第二位置之间移动，所述第一位置通过所述激光束来保护所述粒子束柱的部件与从所述物体释放的粒子之间，通过激光束从物体释放的颗粒。

3. 发明授权

US08883565B2 Separation of semiconductor devices from a wafer carrier 有权
标题翻译：半导体器件与晶片载体的分离
公开(公告)号：US08883565B2
公开(公告)日：2014-11-11
申请号：US13252816
申请日：2011-10-04
申请人： Mathias Vaupel , Sebastian Bernrieder , Adolf Koller , Stefan Martens
发明人： Mathias Vaupel , Sebastian Bernrieder , Adolf Koller , Stefan Martens
IPC分类号： H01L21/00 , H01L21/78 , H01L21/683 , H01L21/67 , H01L21/50 , H01L21/56 , H01L23/31
CPC分类号： H01L21/78 , H01L21/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67 , H01L21/67092 , H01L21/67144 , H01L21/683 , H01L21/6836 , H01L23/3107 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.
摘要翻译：根据本发明的实施例，通过在框架上配置多个半导体器件来制造半导体器件，所述半导体器件具有粘合箔。多个半导体器件附接到粘合箔。使用二氧化碳喷射和/或激光工艺，使用粘合剂箔从框架中移除多个半导体器件。

4. 发明申请

US20130084659A1 Testing Process for Semiconductor Devices 有权
标题翻译：半导体器件的测试过程
公开(公告)号：US20130084659A1
公开(公告)日：2013-04-04
申请号：US13312758
申请日：2011-12-06
申请人： Stefan Martens , Mathias Vaupel
发明人： Stefan Martens , Mathias Vaupel
IPC分类号： H01L21/66
CPC分类号： H01L21/78 , H01L22/14 , H01L2224/97 , H01L2224/03
摘要： In accordance with an embodiment of the present invention, a method of manufacturing a semiconductor device includes providing a wafer having a top surface and an opposite bottom surface. The top surface has a plurality of dicing channels. The wafer has a plurality of dies adjacent the top surface. Each die of the plurality of dies is separated by a dicing channel of the plurality of dicing channels from another die of the plurality of dies. Trenches are formed in the wafer from the top surface. The trenches are oriented along the plurality of dicing channels. After forming the trenches, the plurality of dies is tested to identify first dies to be separated from remaining dies of the plurality of dies. After testing the plurality of dies, the wafer is subjected to a grinding process from the back surface. The grinding process separates the wafer into the plurality of dies.
摘要翻译：根据本发明的实施例，制造半导体器件的方法包括提供具有顶表面和相对底表面的晶片。顶面具有多个切割通道。晶片具有与顶表面相邻的多个模具。多个管芯中的每个管芯由多个切割通道的切割通道与多个管芯中的另一管芯分开。沟槽从顶表面形成在晶片中。沟槽沿着多个切割通道定向。在形成沟槽之后，测试多个管芯以识别与多个管芯的剩余管芯分离的第一管芯。在测试多个模具之后，从背面对晶片进行研磨处理。研磨过程将晶片分离成多个模具。

5. 发明申请

US20120299170A1 Module and Method of Manufacturing a Module 有权
标题翻译：模块和模块的制造方法
公开(公告)号：US20120299170A1
公开(公告)日：2012-11-29
申请号：US13116285
申请日：2011-05-26
申请人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要翻译：公开了一种用于制造模块的模块和方法。模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，框架包括空腔，以及布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。

6. 发明授权

US08749056B2 Module and method of manufacturing a module 有权
标题翻译：模块和模块的制造方法
公开(公告)号：US08749056B2
公开(公告)日：2014-06-10
申请号：US13116285
申请日：2011-05-26
申请人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L23/34
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要翻译：公开了一种用于制造模块的模块和方法。模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，包括空腔的框架和布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。

7. 发明申请

US20120273935A1 Semiconductor Device and Method of Making a Semiconductor Device 审中-公开
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20120273935A1
公开(公告)日：2012-11-01
申请号：US13097851
申请日：2011-04-29
申请人： Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
发明人： Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
IPC分类号： H01L23/498 , H01L21/50 , H01L21/78
CPC分类号： H01L24/13 , H01L21/6836 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/11002 , H01L2224/11009 , H01L2224/11622 , H01L2224/13007 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13181 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/8182 , H01L2224/92125 , H01L2224/94 , H01L2924/07802 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/01047 , H01L2224/11 , H01L2924/00
摘要： A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
摘要翻译：公开了半导体器件和制造半导体器件的方法。一个实施例包括在模具上形成凸块，凸块具有焊料顶部，通过将焊料顶部直接压在支撑衬底的接触焊盘上并在模具和支撑衬底之间形成接触来熔化焊料顶部。

8. 发明申请

US20120091363A1 PROCESSING SYSTEM 有权
标题翻译：加工系统
公开(公告)号：US20120091363A1
公开(公告)日：2012-04-19
申请号：US13336155
申请日：2011-12-23
申请人： Holger Doemer , Stefan Martens , Walter Mack
发明人： Holger Doemer , Stefan Martens , Walter Mack
IPC分类号： G21K5/08
CPC分类号： G21K5/04 , B23K26/032 , B23K26/082 , B23K26/083 , B23K26/1224 , B23K26/705 , G21K5/00 , H01J37/20 , H01J37/3056 , H01J37/3178 , H01J2237/20221 , H01J2237/3151 , H01J2237/31732 , H01J2237/3174 , H01J2237/31744
摘要： A processing system includes a particle beam column for generating a particle beam directed to a first processing location; a laser system for generating a laser beam directed to a second processing location located at a distance from the first processing location; and a protector including an actuator and a plate connected to the actuator. The actuator is configured to move the plate between a first position in which it protects a component of the particle beam column from particles released from the object by the laser beam and a second position in which the component of the particle beam column is not protected from particles released from the object by the laser beam.
摘要翻译：处理系统包括用于产生指向第一处理位置的粒子束的粒子束列; 用于产生指向位于距离所述第一处理位置一定距离的第二处理位置的激光束的激光系统; 以及包括致动器和连接到致动器的板的保护器。所述致动器构造成使所述板在第一位置和第二位置之间移动，所述第一位置在所述第一位置和所述第二位置之间移动，所述第一位置通过所述激光束来保护所述粒子束柱的部件与从所述物体释放的粒子之间，通过激光束从物体释放的颗粒。

9. 发明授权

US08535983B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08535983B2
公开(公告)日：2013-09-17
申请号：US13152021
申请日：2011-06-02
申请人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L21/56
CPC分类号： H01L21/6836 , H01L21/568 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/68368 , H01L2221/68372 , H01L2224/03002 , H01L2224/03003 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16245 , H01L2224/94 , H01L2224/96 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2224/81815 , H01L2924/00014 , H01L2224/81203 , H01L2224/11 , H01L2924/00
摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要翻译：在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。

10. 发明授权

US09099547B2 Testing process for semiconductor devices 有权
标题翻译：半导体器件的测试过程
公开(公告)号：US09099547B2
公开(公告)日：2015-08-04
申请号：US13312758
申请日：2011-12-06
申请人： Stefan Martens , Mathias Vaupel
发明人： Stefan Martens , Mathias Vaupel
IPC分类号： H01L21/00 , H01L21/78 , H01L21/66
CPC分类号： H01L21/78 , H01L22/14 , H01L2224/97 , H01L2224/03
摘要： In accordance with an embodiment of the present invention, a method of manufacturing a semiconductor device includes providing a wafer having a top surface and an opposite bottom surface. The top surface has a plurality of dicing channels. The wafer has a plurality of dies adjacent the top surface. Each die of the plurality of dies is separated by a dicing channel of the plurality of dicing channels from another die of the plurality of dies. Trenches are formed in the wafer from the top surface. The trenches are oriented along the plurality of dicing channels. After forming the trenches, the plurality of dies is tested to identify first dies to be separated from remaining dies of the plurality of dies. After testing the plurality of dies, the wafer is subjected to a grinding process from the back surface. The grinding process separates the wafer into the plurality of dies.
摘要翻译：根据本发明的实施例，制造半导体器件的方法包括提供具有顶表面和相对底表面的晶片。顶面具有多个切割通道。晶片具有与顶表面相邻的多个模具。多个管芯中的每个管芯由多个切割通道的切割通道与多个管芯中的另一管芯分开。沟槽从顶表面形成在晶片中。沟槽沿着多个切割通道定向。在形成沟槽之后，测试多个管芯以识别与多个管芯的剩余管芯分离的第一管芯。在测试多个模具之后，从背面对晶片进行研磨处理。研磨过程将晶片分离成多个模具。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式