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1. 发明授权

US07527996B2 Non-planar surface structures and process for microelectromechanical systems 失效
标题翻译：微机电系统的非平面表面结构和工艺
公开(公告)号：US07527996B2
公开(公告)日：2009-05-05
申请号：US11406981
申请日：2006-04-19
申请人： Qi Luo , Sriram Akella , Lior Kogut
发明人： Qi Luo , Sriram Akella , Lior Kogut
IPC分类号： H01L21/00
CPC分类号： B81B3/0008 , G02B26/001
摘要： Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Voids are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. The voids are formed to extend through less than the entire thickness of the layer where they are being formed. Other layers may be formed over the formed voids. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
摘要翻译：制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。在各层中的一个或多个中形成空隙，以在可移动和/或固定层上形成非平面表面。空隙形成为延伸穿过小于形成它们的层的整个厚度。可以在所形成的空隙上形成其它层。从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的可移动层和固定层之间的接触面积。减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。这些方法可用于制造释放和未释放的干涉式调制器。

2. 发明申请

US20090002804A1 ELECTROMECHANICAL DEVICE TREATMENT WITH WATER VAPOR 失效
标题翻译：具有水蒸气的电化学设备处理
公开(公告)号：US20090002804A1
公开(公告)日：2009-01-01
申请号：US12163660
申请日：2008-06-27
申请人： Bangalore R. Natarajan , Kasra Khazeni , David Heald , Rihui He , Sriram Akella , Evgeni Gousev
发明人： Bangalore R. Natarajan , Kasra Khazeni , David Heald , Rihui He , Sriram Akella , Evgeni Gousev
IPC分类号： G02B26/00 , H01L21/00
CPC分类号： B81C1/0092 , B81B3/0005 , B81B2201/047 , B81C2201/112 , G02B26/001
摘要： Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
摘要翻译：方法，装置和系统提供使用用水蒸汽处理的MEMS装置展现降低的静摩擦，降低的亲水性或某些电气特性的变化性中的至少一个的MEMS装置。认为处理在MEMS器件的内部和/或外部形成一个或多个钝化表面。相对温和的温度和压力条件确保在去除牺牲材料以释放MEMS器件之后，不改变表面化学性质而不过度吸水。

3. 发明授权

US07738158B2 Electromechanical device treatment with water vapor 失效
标题翻译：机电装置用水蒸气处理
公开(公告)号：US07738158B2
公开(公告)日：2010-06-15
申请号：US12163660
申请日：2008-06-27
申请人： Bangalore R. Natarajan , Kasra Khazeni , David Heald , Rihui He , Sriram Akella , Evgeni Gousev
发明人： Bangalore R. Natarajan , Kasra Khazeni , David Heald , Rihui He , Sriram Akella , Evgeni Gousev
IPC分类号： G02B26/00 , G02F1/03
CPC分类号： B81C1/0092 , B81B3/0005 , B81B2201/047 , B81C2201/112 , G02B26/001
摘要： Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
摘要翻译：方法，装置和系统提供使用用水蒸汽处理的MEMS装置展现降低的静摩擦，降低的亲水性或某些电气特性的变化性中的至少一个的MEMS装置。认为处理在MEMS器件的内部和/或外部形成一个或多个钝化表面。相对温和的温度和压力条件确保在去除牺牲材料以释放MEMS器件之后，不改变表面化学性质而不过度吸水。

4. 发明申请

US20070249081A1 Non-planar surface structures and process for microelectromechanical systems 失效
标题翻译：微机电系统的非平面表面结构和工艺
公开(公告)号：US20070249081A1
公开(公告)日：2007-10-25
申请号：US11406981
申请日：2006-04-19
申请人： Qi Luo , Sriram Akella , Lior Kogut
发明人： Qi Luo , Sriram Akella , Lior Kogut
IPC分类号： H01L21/00 , H01L29/84
CPC分类号： B81B3/0008 , G02B26/001
摘要： Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Voids are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. The voids are formed to extend through less than the entire thickness of the layer where they are being formed. Other layers may be formed over the formed voids. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
摘要翻译：制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。在各层中的一个或多个中形成空隙，以在可移动和/或固定层上形成非平面表面。空隙形成为延伸穿过小于形成它们的层的整个厚度。可以在所形成的空隙上形成其它层。从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的可移动层和固定层之间的接触面积。减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。这些方法可用于制造释放和未释放的干涉式调制器。

5. 发明申请

US20070249078A1 Non-planar surface structures and process for microelectromechanical systems 审中-公开
标题翻译：微机电系统的非平面表面结构和工艺
公开(公告)号：US20070249078A1
公开(公告)日：2007-10-25
申请号：US11406776
申请日：2006-04-19
申请人： Ming-Hau Tung , Sriram Akella , William Cummings , Lior Kogut
发明人： Ming-Hau Tung , Sriram Akella , William Cummings , Lior Kogut
IPC分类号： H01L21/00
CPC分类号： B81B3/0008 , G02B26/001
摘要： Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Apertures are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. Other layers may be formed over the formed apertures. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area and/or a larger surface separation between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
摘要翻译：制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。在一个或多个不同层中形成孔径，以便在可移动和/或固定层上形成非平面表面。可以在所形成的孔上形成其它层。从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的接触面积和/或可移动层和固定层之间较大的表面间隔。减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。这些方法可用于制造释放和未释放的干涉式调制器。

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