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1. 发明授权

US07180006B2 Tape substrate and method for fabricating the same 失效
标题翻译：胶带基材及其制造方法
公开(公告)号：US07180006B2
公开(公告)日：2007-02-20
申请号：US10724219
申请日：2003-12-01
申请人： Soon Bog Kwon , Sang Hun Lee , Yang Sik Moon , Ki Pyo Hong , Yoon Kuen Cho
发明人： Soon Bog Kwon , Sang Hun Lee , Yang Sik Moon , Ki Pyo Hong , Yoon Kuen Cho
IPC分类号： B32B3/00 , H05K1/09
CPC分类号： H05K3/244 , H01L23/49572 , H01L23/49582 , H01L2924/0002 , H05K1/0393 , H05K3/28 , H05K2201/0397 , H05K2203/1105 , Y10S428/901 , Y10T29/49155 , Y10T29/4916 , Y10T428/24917 , Y10T428/325 , H01L2924/00
摘要： A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores. The barrier layer makes it possible to obtain an improved plating efficiency and to reduce the thickness of the alloy layer. In addition, the barrier layer serves to reduce internal stress generated at the interface between the tin layer and the copper foil pattern, thereby suppressing formation of voids. Accordingly, there is an effect of preventing a short circuit caused by the growth of whiskers.
摘要翻译：一种带状基板，包括绝缘膜，在绝缘膜的一侧上的绝缘膜上形成的铜箔图案，并且设置有要安装电子元件的连接区域，镀在铜箔图案上的阻挡层连接区域，并且形成有多个孔，以及镀在阻挡层上的锡层，并且与对应于连接区域的铜箔图案的一部分合金化。还公开了一种用于制造带基材的方法。根据本发明，可以减少铜箔图案与镀锡工艺中使用的化学镀锡溶液接触所花费的时间，从而防止铜箔图案的铜成分被洗脱。因此，没有由孔形成引起的开路故障。阻挡层可以获得提高的电镀效率并减小合金层的厚度。此外，阻挡层用于减少在锡层和铜箔图案之间的界面处产生的内应力，从而抑制空隙的形成。因此，存在防止晶须生长引起的短路的效果。

2. 发明授权

US07255802B2 Tape substrate and method for fabricating the same 失效
标题翻译：胶带基材及其制造方法
公开(公告)号：US07255802B2
公开(公告)日：2007-08-14
申请号：US11023162
申请日：2004-12-28
申请人： Soon Bog Kwon , Sang Hun Lee , Yang Sik Moon , Ki Pyo Hong , Yoon Kuen Cho
发明人： Soon Bog Kwon , Sang Hun Lee , Yang Sik Moon , Ki Pyo Hong , Yoon Kuen Cho
IPC分类号： H01B13/00 , H05K3/00
CPC分类号： H05K3/244 , H01L23/49572 , H01L23/49582 , H01L2924/0002 , H05K1/0393 , H05K3/28 , H05K2201/0397 , H05K2203/1105 , Y10S428/901 , Y10T29/49155 , Y10T29/4916 , Y10T428/24917 , Y10T428/325 , H01L2924/00
摘要： A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.
摘要翻译：一种带状基片的制造方法包括在绝缘膜上形成具有连接面积的铜箔图案; 在形成的铜箔图案上的除了连接区域以外的区域涂覆阻焊剂; 在涂覆阻焊剂之后的连接区域上在铜箔图案上镀覆阻挡层; 并在镀覆的阻挡层上镀锡，从而在阻挡层上形成锡层。制造带基片的另一种方法包括在绝缘膜上形成具有连接区域的铜箔图案; 在所形成的铜箔图案上镀覆阻挡层; 在阻挡层的镀覆之后，在阻挡层上电镀锡，从而在阻挡层上形成锡层; 在形成锡层之后，在除了连接区域之外的区域的锡层上涂覆阻焊剂。

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