会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Apparatus for forming film hole
    • 用于形成薄膜孔的装置
    • US07754623B2
    • 2010-07-13
    • US11309294
    • 2006-07-21
    • Chia-Shuo Hsu
    • Chia-Shuo Hsu
    • H01L21/00H01L21/306B08B3/04C23F1/00
    • H05K3/002H01L21/67086H05K1/0393H05K2203/1545
    • An exemplary film hole forming apparatus (400) includes a chemical etching system (410) and a driving system (420). The driving system includes a transmission belt, which passes through the chemical etching system. A material of the transmission belt is polytetrafluoroethylene, polytetrafluoroethylene-containing material, polyvinylidene fluoride, metal, or metal-sandwiched composite. An exemplary method for forming film holes includes the following steps: providing a flexible printed circuit board (300) to be etched, with copper holes (321) pre-formed thereat and the copper holes exposing a base film (310) at corresponding positions; and transporting the flexible printed circuit board into a chemical etching system by a transmission belt to form film holes in the base film.
    • 示例性的薄膜孔形成装置(400)包括化学蚀刻系统(410)和驱动系统(420)。 驱动系统包括通过化学蚀刻系统的传动带。 传动带的材料是聚四氟乙烯,含聚四氟乙烯的材料,聚偏二氟乙烯,金属或金属夹层复合材料。 用于形成薄膜孔的示例性方法包括以下步骤:提供待蚀刻的柔性印刷电路板(300),其中预先形成有铜孔(321),并且在相应位置暴露基膜(310)的铜孔; 并通过传动带将柔性印刷电路板输送到化学蚀刻系统中,以在基膜中形成薄膜孔。
    • 4. 发明申请
    • Transmission circuit for use in input/output interface
    • 用于输入/输出接口的传输电路
    • US20070069769A1
    • 2007-03-29
    • US11482731
    • 2006-07-10
    • Min KaoZee JenJen WuChing ChiuShuo Hsu
    • Min KaoZee JenJen WuChing ChiuShuo Hsu
    • H03B1/00
    • H03F1/34H03F3/45183H03F2200/36H03F2203/45318H03F2203/45366H03F2203/45566H03F2203/45684
    • A transmission circuit includes a first-stage circuit, a second-stage circuit, a negative active feedback circuit and a current buffer. The first-stage circuit includes at least an active MOS device for receiving an input voltage and issuing a first voltage signal. The active MOS device has an inductive feature during operation in a high frequency mode to compensate the first voltage signal. In response to the first voltage signal, the second-stage circuit outputs a first output voltage. The negative active feedback circuit may enhance the bandwidth of the first output voltage. The current buffer may enhance the gain value of the first output voltage. A second voltage signal is issued from the first-stage circuit and compensated by the first output voltage transmitted from the current buffer to enhance the bandwidth and the gain value thereof. In response to the compensated second voltage signal, the second-stage circuit outputs a second output voltage.
    • 传输电路包括第一级电路,第二级电路,负有源反馈电路和电流缓冲器。 第一级电路至少包括用于接收输入电压并发出第一电压信号的有源MOS器件。 有源MOS器件在高频模式下工作期间具有电感特性以补偿第一电压信号。 响应于第一电压信号,第二级电路输出第一输出电压。 负的有源反馈电路可以增强第一输出电压的带宽。 当前的缓冲器可以增强第一输出电压的增益值。 从第一级电路发出第二电压信号,并通过从当前缓冲器发送的第一输出电压补偿第二电压信号,以增强带宽及其增益值。 响应于补偿的第二电压信号,第二级电路输出第二输出电压。
    • 7. 发明申请
    • APPARATUS AND METHOD FOR FORMING FILM HOLE
    • 用于形成膜孔的装置和方法
    • US20070075386A1
    • 2007-04-05
    • US11309294
    • 2006-07-21
    • CHIA-SHUO HSU
    • CHIA-SHUO HSU
    • H01L29/82H01L27/14H01L29/84H01L21/00
    • H05K3/002H01L21/67086H05K1/0393H05K2203/1545
    • The present invention provides a film hole forming apparatus (400), which includes a chemical etching system (410) and a driving system (420). The driving system comprising a transmission belt, which pass through the chemical etching system. A material of the transmission belt being teflon, teflon-containing material, poly (vinylidene finoride), metal, or metal-sandwiched composite. The present invention also provides a method for forming film holes, which includes the following steps: providing a flexible printed circuit board to be etched, with copper holes pre-formed thereat and the copper holes expose base film (310) at corresponding positions; and transporting the flexible printed circuit boards into a chemical etching system by a transmission belt to form film holes in the base film.
    • 本发明提供一种薄膜孔形成装置,其包括化学蚀刻系统(410)和驱动系统(420)。 驱动系统包括通过化学蚀刻系统的传动带。 传输带的材料是聚四氟乙烯,含特氟隆的材料,聚(偏二氟乙烯),金属或金属夹层的复合材料。 本发明还提供一种形成薄膜孔的方法,包括以下步骤:提供待蚀刻的柔性印刷电路板,其中预先形成有铜孔,铜孔在相应位置暴露基膜(310); 并通过传动带将柔性印刷电路板输送到化学蚀刻系统中,以在基膜中形成薄膜孔。