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1. 发明申请

US20060252175A1 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
公开(公告)号：US20060252175A1
公开(公告)日：2006-11-09
申请号：US11404902
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L21/00
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

2. 发明授权

US06196484B1 Photographic 120-size film roll 失效
标题翻译：摄影120幅胶卷
公开(公告)号：US06196484B1
公开(公告)日：2001-03-06
申请号：US09422345
申请日：1999-10-21
申请人： Shunichi Hosaka , Masayoshi Nagata , Yukiyoshi Ishii
发明人： Shunichi Hosaka , Masayoshi Nagata , Yukiyoshi Ishii
IPC分类号： B65H1828
CPC分类号： G03B17/305
摘要： An improvement of a photographic film roll composed of a spool which has a spool core having a slit therein and a flange at both ends of the spool core and a photographic 120-size film which is placed and fixed on a continuous light-shielding backing paper in which one end of the backing paper is inserted into the slit of the spool and other portion of the backing paper is wound on the spool to form multiple convolutions, resides in that the backing paper has at the center in its longitudinal direction a width less than the distance between the two flanges measured at the position of ½ of height of the flanges and has two wide areas of at least 10 cm long one of which is within 50 cm area measured from its one end and another of which is within 50 cm area measured from its another end, the width of each wide area being larger than the distance between the two flanges measured at the tops of the flanges.
摘要翻译：改进由卷轴构成的照相胶片卷，该卷轴具有其中具有狭缝的卷轴芯和卷轴芯的两端的凸缘和照相120尺寸的胶片，其被放置和固定在连续的遮光背衬纸上其中背纸的一端插入卷轴的狭缝中，并且背纸的其他部分缠绕在卷轴上以形成多个卷绕，其特征在于，背纸在其纵向方向上的中心具有较小的宽度比在法兰高度的1/2的位置测量的两个凸缘之间的距离，并且具有至少10cm长的两个宽的区域，其中一个在其一端测量的50cm范围内，另一个在50cm以内从其另一端测量的面积，每个广域的宽度大于在凸缘的顶部处测量的两个凸缘之间的距离。

3. 发明授权

US07688382B2 Solid-state imaging device and method for manufacturing the same 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07688382B2
公开(公告)日：2010-03-30
申请号：US10895936
申请日：2004-07-22
申请人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Eiji Watanabe , Masatoshi Yasumatsu
发明人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Eiji Watanabe , Masatoshi Yasumatsu
IPC分类号： H04N5/225 , H01L21/00
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low α-ray glass.
摘要翻译：一种固态成像装置，包括：具有第一表面的半导体衬底; 所述固态成像元件包括光接收区域;固态成像元件，具有第二表面和第三表面的透光构件，所述第二表面与所述第三表面相对，其中所述光透射构件和所述半导体衬底的所述第一表面限定所述光透射的第二表面之间的间隙构件和光接收区域的外表面; 以及连接到所述固态成像元件的外部连接端子，其中所述光传输部件包括低α射线玻璃。

4. 发明申请

US20060284215A1 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
公开(公告)号：US20060284215A1
公开(公告)日：2006-12-21
申请号：US11404901
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L29/768 , H01L31/0203 , H01L31/062
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

5. 发明申请

US20050062871A1 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20050062871A1
公开(公告)日：2005-03-24
申请号：US10902885
申请日：2004-08-02
申请人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Masatoshi Yasumatsu , Eiji Watanabe
发明人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Masatoshi Yasumatsu , Eiji Watanabe
IPC分类号： H01L27/14 , H01L27/146 , H01L27/148 , H01L31/0232 , H01L31/10 , H04N5/225 , H04N5/335 , H04N5/369 , H04N5/372
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14685 , H01L31/0232 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.
摘要翻译：一种固态成像装置，包括：具有第一表面的半导体衬底; 所述固态成像元件在所述半导体衬底的所述第一表面中，所述固态成像元件包括光接收区域; 具有第二表面和第三表面的透光构件，所述第二表面与所述第三表面相对，其中所述光透射构件和所述半导体衬底的所述第一表面限定所述光透射的第二表面之间的间隙构件和光接收区域的外表面; 以及连接到所述固态成像元件的外部连接端子，其中所述光接收区域的外表面与所述光传输部件的所述第三表面之间的距离为0.5mm以上。

6. 发明授权

US07592200B2 Solid-state imaging device and method of manufacturing the same 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07592200B2
公开(公告)日：2009-09-22
申请号：US11165133
申请日：2005-06-24
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.
摘要翻译：提供了形成有固态成像器件的半导体衬底101和设置在半导体衬底的表面上的半透明构件201，使得提供与固态成像器件的光接收区域相对的空间，其中外部连接端子被配置在半导体衬底101的相对表面上，并与固态成像器件形成表面相连，外部连接端子通过设置在半导体衬底101中的通孔与固态成像器件连接。

7. 发明授权

US4668602A Instant film unit 失效
标题翻译：即时影片单位
公开(公告)号：US4668602A
公开(公告)日：1987-05-26
申请号：US766135
申请日：1985-08-15
申请人： Shunichi Hosaka , Hiroyuki Kurabayashi , Jun Inose
发明人： Shunichi Hosaka , Hiroyuki Kurabayashi , Jun Inose
IPC分类号： G03C8/52 , G03C5/54 , G03C3/00
CPC分类号： G03C8/52
摘要： A peel-apart type instant film unit comprising an image receiving sheet separably adhered in a heat sealing manner to a mask member which is peeled apart from the former after the development thereof. There is provided therebetween a weak sealing layer comprising an adhesive layer of a thermoplastic polymer having hydrophilic groups and a separating layer which is alkali resistant and has a good separation property relative to the adhesive layer. The weak sealing layer can provide an easy separation between the separating and adhesive layers so as perfectly to transfer the adhesive layer to the image receiving sheet to provide a fine appearance and a writeable image frame on the image receiving sheet. The mask member is made of any polyethylene compounded paper sheets and is provided with a processing liquid-resisting layer inside the weak sealing layer for the purpose of preventing the permeation of processing liquid thereto.
摘要翻译：一种剥离型即时胶片单元，其包括以热封方式可分离地粘附到在其显影之后从前者剥离的掩模构件的图像接收片。在其间设置有弱密封层，该密封层包括具有亲水基团的热塑性聚合物的粘合剂层和耐碱性并且相对于粘合剂层具有良好分离性能的分离层。弱密封层可以在分离层和粘合剂层之间提供容易的分离，从而完美地将粘合剂层转移到图像接收片材，以在图像接收片材上提供精细的外观和可写入的图像帧。掩模构件由任何聚乙烯复合纸制成，并且在弱密封层内设置有防止加工液渗透的处理液层。

8. 发明授权

US07692720B2 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07692720B2
公开(公告)日：2010-04-06
申请号：US10902885
申请日：2004-08-02
申请人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Masatoshi Yasumatsu , Eiji Watanabe
发明人： Kazuhiro Nishida , Hiroshi Maeda , Yoshihisa Negishi , Shunichi Hosaka , Masatoshi Yasumatsu , Eiji Watanabe
IPC分类号： H04N5/225 , H01L21/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14685 , H01L31/0232 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.
摘要翻译：一种固态成像装置，包括：具有第一表面的半导体衬底; 所述固态成像元件在所述半导体衬底的所述第一表面中，所述固态成像元件包括光接收区域; 具有第二表面和第三表面的透光构件，所述第二表面与所述第三表面相对，其中所述光透射构件和所述半导体衬底的所述第一表面限定所述光透射的第二表面之间的间隙构件和光接收区域的外表面; 以及连接到所述固态成像元件的外部连接端子，其中所述光接收区域的外表面与所述光传输部件的所述第三表面之间的距离为0.5mm以上。

9. 发明授权

US07659136B2 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
标题翻译：固态成像装置以及制造所述固态成像装置的方法
公开(公告)号：US07659136B2
公开(公告)日：2010-02-09
申请号：US11404897
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L21/00
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
摘要翻译：本发明的目的是提供一种易于制造并且具有高可靠性的固态成像装置，以及制造固态成像装置的方法。在本发明中，一种制造方法包括以下步骤：在半导体衬底的表面上形成多个IT-CCD，将半透明构件粘接到半导体衬底的表面，以便与每个光接收区域相对的间隙的IT-CCD，并且分离在每个IT-CCD的接合步骤获得的接合部件。

10. 发明申请

US20060252174A1 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
公开(公告)号：US20060252174A1
公开(公告)日：2006-11-09
申请号：US11404897
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L21/00
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

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