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    • 3. 发明申请
    • IMAGE FORMING APPARATUS
    • 图像形成装置
    • US20090195644A1
    • 2009-08-06
    • US12362788
    • 2009-01-30
    • Shuichi WAKABAYASHINorio NAKAMURA
    • Shuichi WAKABAYASHINorio NAKAMURA
    • H04N13/04H04N9/31
    • G02B26/085G02B26/101G03B21/00G09G3/02G09G3/2003H04N9/3129H04N9/3179H04N9/3185H04N21/478
    • An image forming apparatus that can form an image composed of pixels on an image forming plane such that, by suppressing density of the pixels in each portion of the image to be formed on the image forming plane from becoming ununiformity, a natural image free from distortion or deflection is observed regardless of a shape of the image forming plane even in the case where the image forming plane is viewed at any position are provided. The image forming apparatus forms includes a light emitting unit that emits the light; a light scanning unit having at least one actuator in which a movable plate having a light reflector that reflects the light emitted from the light emitting unit is rotatably provided around one rotation axis or two rotation axes which are orthogonal to each other, the actuator irradiating and scanning the light reflected on the light reflector onto the image forming plane by rotation of the movable plate; a drive pattern generating unit that generates a drive pattern of the light emitting unit, the drive pattern by which the light emitting unit can emit the light with such timing and emission time that suppress density of the pixels in each portion of the image to be formed on the image forming plane from becoming ununiformity, wherein the ununiformity in the density of the pixels would be generated due to differences between incident angles of the light to be irradiated with respect to portions of the image forming plane corresponding to the respective pixels or differences between distances from the light emitting unit to the respective portions of the image forming plane; and a controlling unit that controls operation of the light emitting unit based on the drive pattern generated by the drive pattern generating unit.
    • 一种图像形成装置,其可以形成由图像形成平面上的像素构成的图像,使得通过抑制在图像形成平面上形成的图像的每个部分中的像素的浓度变得不均匀,自然图像没有失真 或者即使在设置了在任何位置观看图像形成平面的情况下也可以观察到偏转,而与图像形成平面的形状无关。 图像形成装置形成包括发光的发光单元; 具有至少一个致动器的光扫描单元,其中具有反射从发光单元发射的光的光反射器的可动板围绕彼此正交的一个旋转轴或两个旋转轴可旋转地设置,致动器照射和 通过可移动板的旋转将在光反射器上反射的光线扫描到图像形成平面上; 驱动图案生成单元,其生成发光单元的驱动图案,所述驱动图案,所述发光单元能够以抑制要形成的图像的每个部分中的像素的定时和发射时间发光; 在图像形成平面上变得不均匀,其中由于要照射的光的入射角相对于与各个像素相对应的图像形成平面的部分之间的差异,将产生像素密度的不均匀性,或者, 从发光单元到图像形成平面的各个部分的距离; 以及控制单元,其基于由驱动模式生成单元生成的驱动模式来控制发光单元的动作。
    • 4. 发明授权
    • Method of forming thin film structure with tensile and compressed polysilicon layers
    • 用拉伸和压缩多晶硅层形成薄膜结构的方法
    • US07569413B2
    • 2009-08-04
    • US11703444
    • 2007-02-07
    • Takashi KasaiShuichi Wakabayashi
    • Takashi KasaiShuichi Wakabayashi
    • H01L21/00H01L21/425
    • B81B3/0072B81C2201/0167C23C16/24C23C16/56
    • A method for forming a thin film structure, which has small tensile stress due to controlled mechanical stress, and is made to be conductive, is provided. A lower film including polysilicon thin film is formed on a substrate such as Si substrate, then an impurity such as P is doped into the lower film and thermally diffused, thereby the lower film is made conductive. Then, an upper film is deposited on the lower film, the upper film including a polysilicon thin film that is simply deposited and not made to be conductive. The upper film has a tensile stress in an approximately the same level as compressive stress of the lower film, and a thin film structure as a whole, the structure including the lower film and the upper film, is adjusted to have small tensile stress.
    • 提供一种形成薄膜结构的方法,该薄膜结构由于受到机械应力的控制而具有较小的拉伸应力并且被制成导电性。 在诸如Si衬底的衬底上形成包括多晶硅薄膜的下部膜,然后将诸如P的杂质掺杂到下部膜中并进行热扩散,从而使下部膜导电。 然后,上膜被沉积在下膜上,上膜包括简单沉积并不导电的多晶硅薄膜。 上部膜具有与下部膜的压缩应力大致相同的拉伸应力,整体上由薄膜结构体构成,包括下部膜和上部膜的结构被调整为具有较小的拉伸应力。
    • 9. 发明授权
    • Vibration sensor and method for manufacturing the vibration sensor
    • 振动传感器及制造振动传感器的方法
    • US07943413B2
    • 2011-05-17
    • US12440127
    • 2007-07-20
    • Takashi KasaiYasuhiro HorimotoFumihito KatoMasaki MunechikaShuichi WakabayashiToshiyuki TakahashiMasayuki Inuga
    • Takashi KasaiYasuhiro HorimotoFumihito KatoMasaki MunechikaShuichi WakabayashiToshiyuki TakahashiMasayuki Inuga
    • H01L29/84H01L21/28
    • B81C1/00182B81B2201/0257B81B2201/0285B81B2203/0127B81B2203/0353H04R19/005H04R19/04
    • A method for manufacturing a vibration sensor including forming a sacrifice layer at one part of a front surface of a semiconductor substrate of monocrystalline silicon with a material isotropically etched by an etchant for etching the semiconductor substrate, forming a thin film protective film with a material having resistance to the etchant on the sacrifice layer and the front surface of the semiconductor substrate at a periphery of the sacrifice layer, forming a thin film of monocrystalline silicon, polycrystalline silicon, or amorphous silicon on an upper side of the sacrifice layer, opening a backside etching window in a back surface protective film having resistance to the etchant for etching the semiconductor substrate formed on a back surface of the semiconductor substrate, forming a through-hole in the semiconductor substrate by etching the semiconductor substrate anisotropically by using crystal-oriented etching by applying the etchant from the back surface window, then etching the sacrifice layer isotropically by the etchant after the etchant reaches the front surface of the semiconductor substrate, and then etching the semiconductor substrate anisotropically by using crystal-oriented etching from a front side by the etchant spread to a space formed after the sacrifice layer is removed, and forming a holder for supporting the thin film on an upper surface of the semiconductor substrate by removing the thin film protective film partially.
    • 一种制造振动传感器的方法,包括在单晶硅的半导体衬底的前表面的一个部分处形成牺牲层,所述材料用蚀刻剂蚀刻半导体衬底的各向同性蚀刻材料,形成具有材料的薄膜保护膜 在牺牲层周围的牺牲层和半导体衬底的前表面上的蚀刻剂的耐受性,在牺牲层的上侧形成单晶硅,多晶硅或非晶硅的薄膜,打开背面 在形成在半导体衬底的背面上的用于蚀刻半导体衬底的蚀刻剂的表面保护膜的蚀刻窗口中,通过使用晶体取向的蚀刻通过蚀刻半导体衬底各向异性地在半导体衬底中形成通孔 应用来自后表面窗口的蚀刻剂,然后蚀刻 在蚀刻剂到达半导体衬底的前表面之后,通过蚀刻剂各向同性地施加牺牲层,然后通过使用晶体取向的蚀刻从蚀刻剂扩散到牺牲层之后形成的空间来各向异性蚀刻半导体衬底 并且通过部分去除薄膜保护膜来形成用于在半导体衬底的上表面上支撑薄膜的保持器。