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1. 发明授权

US08314482B2 Semiconductor package device 有权
标题翻译：半导体封装器件
公开(公告)号：US08314482B2
公开(公告)日：2012-11-20
申请号：US11905869
申请日：2007-10-05
申请人： Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Chih-Ming Tzeng , Jyh-Rong Lin , Shan-Pu Yu
发明人： Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Chih-Ming Tzeng , Jyh-Rong Lin , Shan-Pu Yu
IPC分类号： H01L23/02
CPC分类号： H01L23/5384 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/3128 , H01L23/34 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2224/24146 , H01L2224/24226 , H01L2224/32145 , H01L2224/73267 , H01L2224/82039 , H01L2224/94 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01072 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/82
摘要： This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
摘要翻译：本发明涉及一种晶片级芯片封装方法，包括以下步骤：提供晶片; 将至少一个第一芯片附接到晶片; 在晶片上形成第一绝缘层; 形成穿过所述第一绝缘层的多个第一导电通孔，其中所述第一导电通孔的部分与所述第一芯片电连接; 在所述第一绝缘层的表面上形成导电图案层，其中所述导电图案层与所述第一导电通孔电连接; 形成穿过晶片的多个通孔; 在通孔中填充第二绝缘层; 以及在所述第二绝缘层中形成多个第二导电通孔，其中所述第二导电通孔与所述第一导电通孔电连接。

2. 发明授权

US07766533B2 Illumination module, and a display and general lighting apparatus using the same 有权
标题翻译：照明模块，以及使用其的显示器和通用照明装置
公开(公告)号：US07766533B2
公开(公告)日：2010-08-03
申请号：US12290340
申请日：2008-10-28
申请人： Ying Liu , Pak-Hong Ng , Shou-Lung Chen
发明人： Ying Liu , Pak-Hong Ng , Shou-Lung Chen
IPC分类号： F21V7/04
CPC分类号： G02F1/133604 , G02F1/133605 , G02F1/133611
摘要： The present invention provides an illumination module, and a display and a general lighting apparatus using the same. Said illumination module includes a plurality of light guiding strips arranged in juxtaposition with a predefined distance; a plurality of light sources, disposed on at least one end of said light guiding strips respectively for providing the light into said light guiding strips; and a plurality of light reflecting units, disposed between said light guiding strips for reflecting the light from said light guiding strips. The light reflecting units according to the present invention can guide the light from the sides of light guiding strips or other light not toward the right side of the illumination module back to the right side of the illumination module, and thus improving the light output efficiency and uniformity.
摘要翻译：本发明提供了一种照明模块，以及使用其的显示器和一般照明装置。所述照明模块包括以预定距离并列布置的多个导光条; 多个光源，分别设置在所述导光条的至少一端，用于将光提供到所述导光条中; 以及多个光反射单元，设置在所述导光条之间，用于反射来自所述导光条的光。根据本发明的光反射单元可以将来自导光条或其他光的侧面的光引导到照明模块的右侧，直到照明模块的右侧，从而提高光输出效率，均匀性

3. 发明授权

US07607792B2 Light-emitting devices and lens therefor 有权
标题翻译：发光装置及其透镜
公开(公告)号：US07607792B2
公开(公告)日：2009-10-27
申请号：US11643877
申请日：2006-12-22
申请人： Ying Liu , Danding Huang , Shou Lung Chen , Chen-Jung Tsai
发明人： Ying Liu , Danding Huang , Shou Lung Chen , Chen-Jung Tsai
IPC分类号： G09F13/04
CPC分类号： G02B6/003 , G02B6/0068 , G02B19/0014 , G02B19/0028 , G02B19/0061 , G02B19/0066 , G02B19/0071 , H01L33/58
摘要： A light-emitting assembly for conditioning the light output of at least one light-emitting source for light guide coupling, comprising a lens and at least one light-emitting source, the light-emitting source having an optical output axis and the lens comprising a beam diverging portion for diverging or spreading light about the output axis, wherein the beam diverging portion of the lens is along the optical output axis and forward of the light-emitting source, and at least one beam converging portion for converging or compressing light away from the optical axis is adjacent the beam diverging portion.
摘要翻译：一种用于调节用于光导耦合的至少一个发光源的光输出的发光组件，包括透镜和至少一个发光源，所述发光源具有光学输出轴，并且所述透镜包括光束发散部分，用于围绕输出轴线发散或散射光，其中透镜的光束发散部分沿着光学输出轴线和发光源的前方，以及用于会聚或压缩光的至少一个光束会聚部分光轴与光束发散部分相邻。

4. 发明申请

US20090179347A1 Structure of embedded active components and manufacturing method thereof 有权
标题翻译：嵌入式有源元件的结构及其制造方法
公开(公告)号：US20090179347A1
公开(公告)日：2009-07-16
申请号：US12382526
申请日：2009-03-18
申请人： Shou-Lung Chen , Cheng-Ta Ko
发明人： Shou-Lung Chen , Cheng-Ta Ko
IPC分类号： H01L21/64
CPC分类号： H01L21/561 , H01L21/568 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/8203 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/82 , H01L2924/00
摘要： A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.
摘要翻译：提供嵌入式有源元件的结构及其制造方法。制造步骤包括提供模制板，并且首先在模制板上设置若干活性组分。电介质层覆盖模制板以盖住活性组分。在电介质层上形成与有源元件接触的电路。最后，嵌入式有源元件的结构从成型板上释放出来。

5. 发明申请

US20090156001A1 Structure for reducing stress for vias and fabricating method thereof 失效
公开(公告)号：US20090156001A1
公开(公告)日：2009-06-18
申请号：US12379223
申请日：2009-02-17
申请人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
发明人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
IPC分类号： H01L21/768
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L23/562 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H05K1/0271 , H05K3/4644 , H05K2201/068 , H05K2201/09509 , H05K2201/09563 , H05K2201/09781 , H05K2201/09909 , H01L2924/00
摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

6. 发明申请

US20090155954A1 THERMAL ENHANCED LOW PROFILE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：热增强低剖面包装结构及其制造方法
公开(公告)号：US20090155954A1
公开(公告)日：2009-06-18
申请号：US12388191
申请日：2009-02-18
申请人： ENBOA WU , SHOU-LUNG CHEN
发明人： ENBOA WU , SHOU-LUNG CHEN
IPC分类号： H01L21/58
CPC分类号： H01L24/97 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49568 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/32188 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2224/83
摘要： A thermal enhanced low profile package structure and a method for fabricating the same are provided. The package structure typically includes a metallization layer with an electronic component thereon which is between two provided dielectric layers. The metallization layer as well as the electronic component is embedded and packaged while the substrates are laminated via a lamination process. The fabricated package structure performs not only a superior electric performance, but also an excellent enhancement in thermal dissipation.
摘要翻译：提供了一种热增强薄型封装结构及其制造方法。封装结构通常包括其上具有电子部件的金属化层，其位于两个提供的介电层之间。金属化层以及电子部件被嵌入和封装，同时通过层压工艺层压基板。制造的封装结构不仅具有优异的电性能，而且还具有优异的散热增强。

7. 发明授权

US07545039B2 Structure for reducing stress for vias and fabricating method thereof 失效
标题翻译：用于减小通孔应力的结构及其制造方法
公开(公告)号：US07545039B2
公开(公告)日：2009-06-09
申请号：US11410986
申请日：2006-04-26
申请人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-Cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuah Cheng
发明人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-Cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuah Cheng
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L23/562 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H05K1/0271 , H05K3/4644 , H05K2201/068 , H05K2201/09509 , H05K2201/09563 , H05K2201/09781 , H05K2201/09909 , H01L2924/00
摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.
摘要翻译：提供一种用于减小通孔应力的结构及其制造方法。使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。

8. 发明授权

US07511365B2 Thermal enhanced low profile package structure 有权
标题翻译：热增强薄型封装结构
公开(公告)号：US07511365B2
公开(公告)日：2009-03-31
申请号：US11301903
申请日：2005-12-13
申请人： Enboa Wu , Shou-Lung Chen
发明人： Enboa Wu , Shou-Lung Chen
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H05K1/16
CPC分类号： H01L24/97 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49568 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/32188 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2224/83
摘要： A thermal enhanced low profile package structure and a method for fabricating the same are provided. The package structure typically includes a metallization layer with an electronic component thereon which is between two provided dielectric layers. The metallization layer as well as the electronic component is embedded and packaged while the substrates are laminated via a lamination process. The fabricated package structure performs not only a superior electric performance, but also an excellent enhancement in thermal dissipation.
摘要翻译：提供了一种热增强薄型封装结构及其制造方法。封装结构通常包括其上具有电子部件的金属化层，其位于两个提供的介电层之间。金属化层以及电子部件被嵌入和封装，同时通过层压工艺层压基板。制造的封装结构不仅具有优异的电性能，而且还具有优异的散热增强。

9. 发明申请

US20090073720A1 LIGHT GUIDING STRIP AND DOUBLE-SIDED PLANAR LIGHT APPARATUS 有权
标题翻译：轻指导条和双面平面光装置
公开(公告)号：US20090073720A1
公开(公告)日：2009-03-19
申请号：US12238020
申请日：2008-09-25
申请人： Yaojun Feng , Danding Huang , Kwan Wah Ng , Ying Liu , Shou-Lung Chen , Cheng Jung Tsai
发明人： Yaojun Feng , Danding Huang , Kwan Wah Ng , Ying Liu , Shou-Lung Chen , Cheng Jung Tsai
IPC分类号： F21V7/04
CPC分类号： G02B6/001
摘要： A light guiding strip and a double-sided planar light apparatus are provided. According to one embodiment of the present invention, the double-sided planar light apparatus includes a plurality of light guiding strips, wherein the plurality of light guiding strips are positioned in a planar arrangement, each of the plurality of light guiding strips including a first plurality of light emitting surfaces disposed toward a first direction and a second plurality of light emitting surfaces disposed toward a second direction, each of the plurality of light guiding strips further including a first end and a second end configured to receive light, wherein the plurality of light guiding strips emit light from the first and second plurality of light emitting surfaces. Reflectors and light diffusion patterns on the light guiding strips provide control and independence over the two sides of the planar light apparatus.
摘要翻译：提供导光条和双面平面光装置。根据本发明的一个实施例，双面平面光装置包括多个导光条，其中多个导光条位于平面布置中，多个导光条中的每一个包括第一多个导光条的朝向第一方向设置的发光表面和朝向第二方向设置的第二多个发光表面，所述多个导光条中的每一个还包括构造成接收光的第一端和第二端，其中所述多个光引导条从第一和第二多个发光表面发射光。导光条上的反射器和光扩散图案在平面光装置的两侧提供了控制和独立性。

10. 发明申请

US20080266903A1 EAVE LIGHT GUIDING DEVICE AND BACKLIGHT DEVICE USING THE SAME 审中-公开
标题翻译： EAVE指导装置和使用其的背光装置
公开(公告)号：US20080266903A1
公开(公告)日：2008-10-30
申请号：US12107893
申请日：2008-04-23
申请人： Ying LIU , Danding Huang , Shou Lung Chen
发明人： Ying LIU , Danding Huang , Shou Lung Chen
IPC分类号： F21V8/00
CPC分类号： G02F1/133615 , G02B6/002 , G02B6/0031 , G02B6/0073 , G02B6/0078 , G02B6/008
摘要： The present invention provides a multi-block backlight device having light guiding to solve the problems met in the current backlight devices with high cost, difficult matching with the panels, and inefficient lighting area. The multi-block backlight device comprises a plurality of light guiding devices, the light guiding device comprises at least one incident portion, the incident portion comprises at least one light source and an incident area; at least one eave, and a diffusion portion with uniform thickness. The eave can increase effective lighting area of the multi-block backlight device, and the diffusion portion can make the multi-block backlight device easier to couple, therefore achieving cost decreasing and effective usage.
摘要翻译：本发明提供了一种多块背光装置，其具有导光性，以高成本，与面板难匹配以及效率低的照明区域来解决当前背光装置中遇到的问题。所述多块背光装置包括多个导光装置，所述导光装置包括至少一个入射部分，所述入射部分包括至少一个光源和入射区域; 至少一个檐口和具有均匀厚度的扩散部分。屋檐可以增加多块背光装置的有效照明面积，并且扩散部分可以使多块背光装置更容易耦合，从而实现成本降低和有效的使用。

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