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1. 发明授权

US07436676B2 Portable electronic apparatus and BGA package protective device 失效
标题翻译：便携式电子仪器和BGA封装保护装置
公开(公告)号：US07436676B2
公开(公告)日：2008-10-14
申请号：US10489498
申请日：2002-06-07
申请人： Toshihiro Higuchi , Shotaro Nagaike , Taku Yamada , Yoji Inomata
发明人： Toshihiro Higuchi , Shotaro Nagaike , Taku Yamada , Yoji Inomata
IPC分类号： H05K5/00
CPC分类号： H05K9/0037 , H01H2239/01 , H04B1/3833 , H04M1/23 , H04M1/72544
摘要： A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall (22) for surrounding the BGA packages (14), (15) and (16) is mounted on the printed circuit board (13), a first protrusion portion (18b) for holding down the shield wall (22) on the printed circuit board (13) is protruded from a case (18) of the portable electronic device (10), and second protrusion portion (18c) for holding down surfaces of the BGA packages (14); (15) and (16) on the printed circuit board (13) is protruded from the case (18) of the portable electronic device (10). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (13). Further, even when the push buttons are frequently depressed in playing a game, the soldering parts of the BGA packages mounted on the back side of the operation button can be maintained in good conditions.
摘要翻译：一种便携式电子设备，其中由操作按钮（11）控制的微动开关（12）安装在印刷电路板（13）的一侧上，并且容纳在BGA封装（14），（15）和（16）中的电路元件是焊接在印刷电路板的另一面。在便携式电子设备中，用于围绕BGA封装（14），（15）和（16）的屏蔽壁（22）安装在印刷电路板（13）上，第一突起部分（18b）用于保持印刷电路板（13）上的屏蔽壁（22）从便携式电子设备（10）的壳体（18）突出，并且用于保持BGA封装（14）的表面的第二突出部分（18c） ; 印刷电路板（13）上的（15）和（16）从便携式电子设备（10）的壳体（18）突出。通过这样的结构，可以防止BGA封装从印刷电路板（13）剥离。此外，即使在游戏中经常按下按钮时，安装在操作按钮背面的BGA封装的焊接部件也能够保持良好的状态。

2. 发明授权

US08154876B2 Circuit board module and electronic apparatus 失效
标题翻译：电路板模块和电子设备
公开(公告)号：US08154876B2
公开(公告)日：2012-04-10
申请号：US12863179
申请日：2008-10-16
申请人： Shotaro Nagaike
发明人： Shotaro Nagaike
IPC分类号： H05K1/00
CPC分类号： H05K1/181 , G02F1/13452 , H01L23/04 , H01L23/24 , H01L2924/0002 , H05K1/0218 , H05K3/284 , H05K2201/0382 , H05K2201/10128 , H05K2201/10371 , H05K2201/10515 , H05K2201/2018 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.
摘要翻译：电路板模块包括：具有安装表面的板; 安装在安装表面上的电子部件; 框架，其安装在安装表面上以包围电子部件; 树脂部分，设置在框架内部并紧密接触电子部件，安装表面和框架; 以及覆盖电子部件并与框架连接的盖部。盖部包括平坦部，该平坦部设置在包含与未被树脂部覆盖的电子部件相对应的区域的区域，并且比其他区域向外突出。

3. 发明申请

US20110013368A1 CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE 审中-公开
标题翻译：电路板模块和电子设备
公开(公告)号：US20110013368A1
公开(公告)日：2011-01-20
申请号：US12863175
申请日：2008-03-03
申请人： Shotaro Nagaike
发明人： Shotaro Nagaike
IPC分类号： H05K7/00
CPC分类号： H05K9/0032 , H05K1/181 , H05K3/284 , H05K2201/09972 , H05K2201/10371 , H05K2201/2018
摘要： There are provided a circuit board module that can ease adverse effect due to radiation developing between a fragile circuit vulnerable to unwanted radiation and other circuits and that can diminish overall radiation to the outside of the module and an electronic device having the circuit board module.The circuit board module includes a board 1 having a mount surface; a first electronic component and a second electronic component 3 respectively mounted on the mount surface; a first frame element 4 that surrounds the first electronic component 2 and the second electronic component 3, that is mounted on the mount surface, and that exhibits conductivity; a second frame element 5 that surrounds the second electronic component 3, that is mounted on an inside of the first frame element 4 and on the mount surface, and that exhibits conductivity; a first resin portion 6 that is situated between the first frame element 4 and the second frame element 5 and that closely contacts the first electronic component, the mount surface, the first frame element 4, and the second frame element 5; a second resin portion 7 that is situated on an inside of the second frame element 5 and that closely contacts the mount surface of the second electronic component 3 and the second frame element 5; a first cover portion 8 that covers the first electronic component, the second electronic component 3, and the second frame element 5, that exhibits conductivity, and that is connected to the first frame element 4; and a second cover portion 9 that is connected by means of contact points of the second frame element 5 and that covers the second frame element 5.
摘要翻译：提供了一种电路板模块，其可以减轻由于易受不想要的辐射的脆弱的电路之间的辐射的不利影响和其他电路，并且可以减少到模块的外部的整体辐射以及具有电路板模块的电子设备。电路板模块包括具有安装表面的板1; 分别安装在安装表面上的第一电子部件和第二电子部件3; 围绕安装在安装表面上并且显示导电性的第一电子部件2和第二电子部件3的第一框架元件4; 围绕第二电子部件3的第二框架元件5，其安装在第一框架元件4的内部和安装表面上并且显示导电性; 第一树脂部分6，其位于第一框架元件4和第二框架元件5之间，并且紧密接触第一电子部件，安装表面，第一框架元件4和第二框架元件5; 第二树脂部分7，其位于第二框架元件5的内侧并且紧密接触第二电子部件3和第二框架元件5的安装表面; 覆盖第一电子部件的第一盖部8，显示导电性的第二电子部件3和第二框架元件5，并且连接到第一框架元件4; 以及通过第二框架元件5的接触点连接并覆盖第二框架元件5的第二盖部分9。

4. 发明申请

US20100328903A1 CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS 失效
标题翻译：电路板模块和电子设备
公开(公告)号：US20100328903A1
公开(公告)日：2010-12-30
申请号：US12863179
申请日：2008-10-16
申请人： Shotaro Nagaike
发明人： Shotaro Nagaike
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , G02F1/13452 , H01L23/04 , H01L23/24 , H01L2924/0002 , H05K1/0218 , H05K3/284 , H05K2201/0382 , H05K2201/10128 , H05K2201/10371 , H05K2201/10515 , H05K2201/2018 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.
摘要翻译：电路板模块包括：具有安装表面的板; 安装在安装表面上的电子部件; 框架，其安装在安装表面上以包围电子部件; 树脂部分，设置在框架内部并紧密接触电子部件，安装表面和框架; 以及覆盖电子部件并与框架连接的盖部。盖部包括平坦部，该平坦部设置在包含与未被树脂部覆盖的电子部件相对应的区域的区域，并且比其他区域向外突出。

5. 发明申请

US20100309639A1 CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS 审中-公开
标题翻译：电路板模块和电子设备
公开(公告)号：US20100309639A1
公开(公告)日：2010-12-09
申请号：US12863172
申请日：2008-10-23
申请人： Shotaro Nagaike
发明人： Shotaro Nagaike
IPC分类号： H05K7/00
CPC分类号： H04M1/0277 , H04M1/0266
摘要： A circuit board module includes: a board having a mounting surface; a frame member which is mounted on the mounting surface; an electronic component which is mounted on the mounting surface and which is provided inside the frame member; a resin portion which is embedded in the frame member; and a display device disposed on an opposite surface opposite to the mounting surface of the board. The display device is substantially equal in size to the frame member, and disposed at a position of the opposite surface which substantially corresponds to the frame member.
摘要翻译：电路板模块包括：具有安装表面的板; 安装在安装面上的框架部件; 电子部件，其安装在所述安装面上并且设置在所述框架部件的内部; 嵌入框架构件中的树脂部分; 以及设置在与所述板的安装表面相对的相对表面上的显示装置。显示装置的尺寸基本上与框架构件相同，并且设置在与框架构件基本对应的相对表面的位置处。

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