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1. 发明授权

US5570725A Weaving method and reed used with 1/F fluctuations 失效
标题翻译：织造方法和芦苇使用1 / F波动
公开(公告)号：US5570725A
公开(公告)日：1996-11-05
申请号：US413861
申请日：1995-03-29
申请人： Toshimitsu Musha , Yuichi Yanai , Shoji Takagi , Yuki Niwa
发明人： Toshimitsu Musha , Yuichi Yanai , Shoji Takagi , Yuki Niwa
IPC分类号： D03D13/00 , D03D49/62
CPC分类号： D03D49/62
摘要： A weaving method and reed where the method is practiced with the reed having spacings between dents of 1/f fluctuations resulting in a woven fabric which has a warp density of 1/f fluctuations. The spacings are established by winding yarn having a 1/f fluctuation around the dent support bars with the dents positioned between the coils of wrapped yarn.
摘要翻译：一种织造方法和芦苇，其中该方法在芦苇中具有1 / f波动的凹痕之间的间隔，从而导致经丝密度为1 / f波动的织造织物。这些间距是通过在凹陷支撑杆周围缠绕具有1 / f波动的纱线，其中凹痕位于缠绕纱线的线圈之间来建立的。

2. 发明授权

US5326990A Composite lead frame with connected inner and outer leads 失效
标题翻译：复合引线框架，内部和外部引线连接
公开(公告)号：US5326990A
公开(公告)日：1994-07-05
申请号：US942656
申请日：1992-09-09
申请人： Mamoru Mita , Tomio Murakami , Shoji Takagi , Hiroki Tanaka , Kenji Yamaguchi
发明人： Mamoru Mita , Tomio Murakami , Shoji Takagi , Hiroki Tanaka , Kenji Yamaguchi
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L23/49582 , H01L23/49531 , H01L23/49541 , H01L24/48 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49109 , H01L2224/49171 , H01L2224/85444 , H01L24/45 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , Y10T29/49121
摘要： An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au-Sn alloy layer. The Au-Sn alloy layer contains Au of 10 to 40 weight %.An inner lead of a metal lead frame is connected to a patterned lead of a flexible lead-patterned substrate by a heating tool. The inner lead is coated on bottom and side surfaces of its tip portion. The bottom surface faces the patterned lead.
摘要翻译：金属引线框架的外引线经由Au-Sn合金层与柔性引线图案化基板的内引线连接。 Au-Sn合金层含有10〜40重量％的Au。金属引线框架的内引线通过加热工具连接到柔性引线图案化基板的图案引线。内部引线涂覆在其顶端部分的底部和侧面上。底表面面向图案化引线。

3. 发明授权

US4236540A Pliable and restorable hairsetter 失效
标题翻译：柔软和可恢复的发夹
公开(公告)号：US4236540A
公开(公告)日：1980-12-02
申请号：US31965
申请日：1979-04-20
申请人： Shoji Takagi , Nobuo Ito
发明人： Shoji Takagi , Nobuo Ito
IPC分类号： A45D4/14 , A45D2/24 , A45D2/36 , A45D4/16 , A45D2/00
CPC分类号： A45D2/2435 , A45D2/362 , A45D4/16
摘要： A home hair-setter whose body is a cylindrical heat-resistant elastic member and wherein the outer peripheral surface of the body of the hair-setter is used to curl hair; the hair-curling section of the body is enclosed in a cylindrical envelope; and the body of the hair-setter has at least one of its both ends left open.
摘要翻译：一种家用发型器，其主体是圆柱形耐热弹性构件，并且其中使用该发型器主体的外周表面卷曲头发; 身体的卷发部分封闭在一个圆柱形的信封中; 并且发型器的主体的至少一个的两端保持打开。

4. 发明授权

US6083604A Bonded assembly, method of jointing for preparation thereof and rivet 失效
标题翻译：粘接组件，其制备方法和铆钉
公开(公告)号：US6083604A
公开(公告)日：2000-07-04
申请号：US545276
申请日：1995-10-19
申请人： Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
发明人： Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
IPC分类号： F16B5/00 , F16B5/04 , F16B11/00 , F16B17/00 , F16B19/06 , F16B19/10 , H02B1/30 , F16B1/48 , B32B3/26
CPC分类号： F16B19/1045 , F16B11/006 , F16B17/008 , F16B19/06 , F16B5/00 , F16B5/04 , Y10T403/7073 , Y10T403/7094 , Y10T428/24281 , Y10T428/24289 , Y10T428/24339 , Y10T428/24347 , Y10T428/24521 , Y10T428/24529
摘要： The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.
摘要翻译：本发明涉及一种接合组件，其特征在于，在其接合表面上具有凸起部分的板和在其接合表面上具有与凸起部分接合的凹部或通孔的基板与粘合剂。另外，本发明涉及一种接合组件，其特征在于，在所述板的凸部以外的部分涂布粘接剂，使得所述涂布厚度小于所述凸部的高度，然后将所述基板接合到在板对准之后具有凹部或通孔的另一板。此外，本发明涉及一种铆钉，其具有用于装配并临时固定到插入通孔的装置，以及一种连接板的方法，包括用于将具有临时固定装置的铆钉插入，装配和临时固定的步骤，插入板上的通孔。本发明可以提供高可靠性的接合组件，其连接板的方法和用于便于连接板的铆钉，这确保板的容易和精确的对准，确保所需的粘合剂涂层厚度，防止粘合剂粘附到不必要的部分并增加作为粘结组件的强度。

5. 发明授权

US5428889A Method for manufacturing composite lead frame 失效
标题翻译：复合引线框架的制造方法
公开(公告)号：US5428889A
公开(公告)日：1995-07-04
申请号：US998917
申请日：1992-12-30
申请人： Mamoru Mita , Tomio Murakami , Shoji Takagi , Hiroki Tanaka , Kenji Yamaguchi
发明人： Mamoru Mita , Tomio Murakami , Shoji Takagi , Hiroki Tanaka , Kenji Yamaguchi
IPC分类号： H01L23/495 , H01R43/00
CPC分类号： H01L23/49582 , H01L23/49531 , H01L23/49541 , H01L24/48 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49109 , H01L2224/49171 , H01L2224/85444 , H01L24/45 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , Y10T29/49121
摘要： An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au--Sn alloy layer. The Au--Sn alloy layer contains Au of 10 to 40 weight %. An inner lead of a metal lead frame is connected to a patterned lead of a flexible lead-patterned substrate by a heating tool. The inner lead is coated on bottom and side surfaces of its tip portion. The bottom surface faces the patterned lead.
摘要翻译：金属引线框架的外引线经由Au-Sn合金层与柔性引线图案化基板的内引线连接。 Au-Sn合金层含有10〜40重量％的Au。金属引线框架的内引线通过加热工具连接到柔性引线图案化基板的图案引线。内部引线涂覆在其顶端部分的底部和侧面上。底表面面向图案化引线。

6. 发明授权

US4447663A Process for continuous fluorination of carbon 失效
标题翻译：连续氟化碳的方法
公开(公告)号：US4447663A
公开(公告)日：1984-05-08
申请号：US353221
申请日：1982-03-01
申请人： Toru Akiyama , Tsutomu Kamihigoshi , Shoji Takagi , Tadayuki Maeda
发明人： Toru Akiyama , Tsutomu Kamihigoshi , Shoji Takagi , Tadayuki Maeda
IPC分类号： B01J15/00 , B01J19/28 , C01B9/08 , C01B31/00 , C07C17/00
CPC分类号： B01J15/00 , B01J19/285 , C01B31/005 , C01B9/08
摘要： Continuous fluorination of carbon is carried out by employing an apparatus for contact reaction of solid powder and reactive gas which comprises a horizontal reactor having a trough provided with weirs (e.g. height: 1 to 6 mm., interval: 5 to 30 cm.) and a vibrating means for vibrating the trough, and in which carbon particles supplied continuously are transported on the trough in a form of thin layer by the vibration of the trough while continuing the reaction by contacting efficiently the carbon particles with a fluorine gas. The contact reaction is efficiently conducted without accumulating the reaction heat to produce the fluorinated carbon in high yields, and the process is useful for the mass production. The apparatus is also useful for various contact reaction of a solid powder and a reactive gas.
摘要翻译：碳的连续氟化是通过采用固体粉末和反应性气体接触反应的装置进行的，该装置包括具有设置有堰的槽的水平反应器（例如，高度为1至6mm，间隔为5至30cm），和用于振动槽的振动装置，其中连续供应的碳颗粒通过槽的振动以薄层的形式在槽上输送，同时通过有效地使碳颗粒与氟气接触来继续反应。有效地进行接触反应而不积累反应热，以高产率生成氟化碳，该方法对于批量生产是有用的。该装置还可用于固体粉末和反应性气体的各种接触反应。

7. 发明授权

US4196658A Coffee-pot and coffee-mill combination 失效
标题翻译：咖啡壶和咖啡磨组合
公开(公告)号：US4196658A
公开(公告)日：1980-04-08
申请号：US963139
申请日：1978-11-22
申请人： Shoji Takagi , Yoshiyuki Miwa
发明人： Shoji Takagi , Yoshiyuki Miwa
IPC分类号： A47J31/42
CPC分类号： A47J31/42
摘要： In a coffee-pot and coffee-mill combination, a cup accommodating section is provided in adjacent to an electric motor for driving grinder adapted to grind coffee-beans, and a case accommodating section and a water storing tank are provided above the motor and the cup accommodating section, respectively. The grinder and a filter are provided in the case. The water in the water storing tank is heated by a heating section, and the hot water is supplied into the case to extract a coffee liquid.
摘要翻译：在咖啡壶和咖啡磨组合中，在用于驱动磨碎咖啡豆的研磨机的电动马达附近设置杯容纳部，并且在马达上方设置有容纳部和储水箱，杯容纳部分。在这种情况下提供研磨机和过滤器。贮水箱内的水由加热部进行加热，将热水供给到壳体内以提取咖啡液。

8. 发明授权

US5589668A Multi-metal layer wiring tab tape carrier and process for fabricating the same 失效
标题翻译：多金属层接线片带载体及其制造方法
公开(公告)号：US5589668A
公开(公告)日：1996-12-31
申请号：US149795
申请日：1993-11-10
申请人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
发明人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
IPC分类号： H01L23/498 , H05K3/40 , H05K1/14
CPC分类号： H01L23/4985 , H05K3/4076 , H01L2924/0002 , H01L2924/3011
摘要： A multi-metal layer wiring TAB tape carrier capable of forming a fine pattern without affecting the thicknesses of conductive metal layers, and a process for fabricating the multi-metal layer wiring TAB tape carrier. This TAB tape carrier is constructed such that respective dielectric film layers are interposed between adjacent ones of plurality of conductive metal layers having a predetermined wiring pattern, such that the dielectric film layer is formed with interfacial connection holes, and such that a conductive via layer is formed in the interfacial connection holes to electrically connect adjacent conductive metal layers. The conductive via layer is formed by a vapor deposition method such as evaporation, ion plating or sputtering. Alternatively, a portion of the conductive metal layers and the conductive via layer are simultaneously formed. Especially according to the latter method of forming a portion of the conductive metal layers and the conductive via layer simultaneously, the conductive via layer need not be formed after the conductive metal layers so that the fabrication steps are simplified. Moreover, the thicknesses of the conductive metal layers are not adversely affected later, and the conductive metal layers and the conductive via layer can be positioned highly precisely to form a fine wiring pattern.
摘要翻译：能够形成精细图案而不影响导电金属层的厚度的多金属层布线TAB带载体，以及制造多金属层布线TAB带载体的工艺。该TAB带载体被构造成使得各个电介质膜层插入具有预定布线图案的多个导电金属层的相邻的导电金属层之间，使得电介质膜层形成有界面连接孔，并且导电通孔层为形成在界面连接孔中以电连接相邻的导电金属层。导电通孔层通过蒸发，离子镀或溅射等气相沉积法形成。或者，同时形成一部分导电金属层和导电通孔层。特别地，根据后一种形成导电金属层和导电通路层的一部分的方法，导电通孔层不需要在导电金属层之后形成，从而简化制造步骤。此外，导电性金属层的厚度以后不会受到不利影响，并且可以高精度地定位导电金属层和导电通孔层以形成精细的布线图案。

9. 发明授权

US3989766A Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US3989766A
公开(公告)日：1976-11-02
申请号：US445582
申请日：1974-02-25
申请人： Shunichiro Nishizaki , Hiroshi Teratani , Shoji Takagi
发明人： Shunichiro Nishizaki , Hiroshi Teratani , Shoji Takagi
IPC分类号： C08G59/00 , C08G59/22 , C08G59/38 , C08L63/00 , H01B3/40 , C08G45/00
CPC分类号： C08G59/226 , C08G59/38 , H01B3/40
摘要： An epoxy resin composition which comprises an epoxy resin derived from an ester of an alkadienealcohol; an epoxy resin prepared by reacting an epichlorohydrin and a bisphenol and an acid anhydride curing agent. The cured product has very high mechanical strength and cracking resistance and is useful as an electrical insulating material.
摘要翻译：一种环氧树脂组合物，其包含衍生自二烯烃的酯的环氧树脂; 通过表氯醇与双酚和酸酐固化剂反应制备的环氧树脂。固化产物具有非常高的机械强度和抗裂性，并且可用作电绝缘材料。

10. 发明授权

US5776584A Bonded assembly, method of jointing for preparation thereof and rivet 失效
公开(公告)号：US5776584A
公开(公告)日：1998-07-07
申请号：US545276
申请日：1995-10-19
申请人： Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
发明人： Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
IPC分类号： F16B5/00 , F16B5/04 , F16B11/00 , F16B17/00 , F16B19/06 , F16B19/10 , H02B1/30 , F16B1/48 , B32B3/26
CPC分类号： F16B19/1045 , F16B5/00 , F16B5/04 , F16B11/006 , F16B17/008 , F16B19/06 , F16B2200/30 , Y10T403/7073 , Y10T428/24281 , Y10T428/24289 , Y10T428/24339 , Y10T428/24347 , Y10T428/24521 , Y10T428/24529
摘要： The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.

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