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1. 发明授权

US06924540B2 Integrated circuit device installed structure and installation method 有权
标题翻译：集成电路装置安装结构及安装方法
公开(公告)号：US06924540B2
公开(公告)日：2005-08-02
申请号：US10388617
申请日：2003-03-17
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： G11B7/13 , G11B7/24 , H01L21/50 , H01L21/56 , H01L23/02 , H01L23/28 , H01L23/50 , H01L27/14 , H01L31/02 , H01L31/0203 , H01L47/00
CPC分类号： G11B7/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。具有光检测部分的集成电路器件，引线和用于连接的引线被封装在封装部分中。在光检测部分上方的封装部分的光入射表面上形成凹部，以使光检测部分的表面上的封装部分变薄，从而降低由封装部分吸收的光的能量。

2. 发明申请

US20050151217A1 Integrated circuit device packaging structure and packaging method 有权
标题翻译：集成电路器件封装结构及封装方法
公开(公告)号：US20050151217A1
公开(公告)日：2005-07-14
申请号：US11073724
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L31/02 , G11B7/24 , G11B7/26 , H01L21/00 , H01L23/02 , H01L23/28 , H01L25/16 , H01L27/14 , H01L27/15 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。引线安装基板被放置在具有光检测部分的集成电路装置的光接收表面的一侧。引线通过电极与集成电路器件电连接。集成电路器件和衬底用封装部分封装。基板在光检测部分上方的位置具有开口。

3. 发明授权

US07250664B2 Integrated circuit device packaging structure and packaging method 有权
标题翻译：集成电路器件封装结构及封装方法
公开(公告)号：US07250664B2
公开(公告)日：2007-07-31
申请号：US11073724
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L31/00
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。引线安装基板被放置在具有光检测部分的集成电路装置的光接收表面的一侧。引线通过电极与集成电路器件电连接。集成电路器件和衬底用封装部分封装。基板在光检测部分上方的位置具有开口。

4. 发明申请

US20050147011A1 Optical integrated device 审中-公开
标题翻译：光学集成设备
公开(公告)号：US20050147011A1
公开(公告)日：2005-07-07
申请号：US11022816
申请日：2004-12-28
申请人： Shinya Esaki , Masaki Taniguchi
发明人： Shinya Esaki , Masaki Taniguchi
IPC分类号： G11B7/13 , G11B7/00 , G11B7/125 , G11B19/06 , H01S5/026
CPC分类号： G11B19/06
摘要： An optical integrated device includes a light source, a light-receiving element, a signal processing section, and a sleep control circuit. The light source irradiates a light beam onto an optical recording medium. The light-receiving element receives a reflected light of the light beam from the optical recording medium and outputs an electrical signal according to the reflected light. The signal processing section performs predetermined processing on the electrical signal outputted from the light-receiving element. The sleep control circuit is connected to a terminal which outputs a signal indicating the operation voltage of the light source, and controls whether to put the signal processing section in an operation state or a low power consumption state based on the voltage at the terminal.
摘要翻译：光学集成装置包括光源，光接收元件，信号处理部分和睡眠控制电路。光源将光束照射到光记录介质上。光接收元件从光记录介质接收光束的反射光，并根据反射光输出电信号。信号处理部对从光接收元件输出的电信号进行预定处理。睡眠控制电路连接到输出指示光源的操作电压的信号的端子，并且基于端子处的电压来控制是否将信号处理部分置于操作状态或低功耗状态。

5. 发明授权

US07663200B2 Integrated circuit device packaging structure and packaging method 失效
标题翻译：集成电路器件封装结构及封装方法
公开(公告)号：US07663200B2
公开(公告)日：2010-02-16
申请号：US11073726
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L21/02
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
摘要翻译：提供了适用于接收短波长激光的集成电路器件的封装结构。引线安装基板被放置在具有光检测部分的集成电路装置的光接收表面的一侧。引线通过电极与集成电路器件电连接。集成电路器件和衬底用封装部分封装。基板在光检测部分上方的位置具有开口。

6. 发明申请

US20050151216A1 Integrated circuit device packaging structure and packaging method 失效
公开(公告)号：US20050151216A1
公开(公告)日：2005-07-14
申请号：US11073726
申请日：2005-03-08
申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
发明人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
IPC分类号： H01L31/02 , G11B7/24 , G11B7/26 , H01L21/00 , H01L23/02 , H01L23/28 , H01L25/16 , H01L27/14 , H01L27/15 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , G11B7/13 , H01L25/167 , H01L31/02325 , H01L2224/16 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

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