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1. 发明专利

JP2003279300A Dimple bb bullet 审中-公开
标题翻译： DIMPLE BB BULLET
公开(公告)号：JP2003279300A
公开(公告)日：2003-10-02
申请号：JP2002077691
申请日：2002-03-20
申请人： Abe Yoshiki , Shinji Murase , 村瀬真次 , 阿部誉紀
发明人： MURASE SHINJI , YOSHIDA KENTARO
IPC分类号： F42B8/12
CPC分类号： F42B6/10 , F42B10/38
摘要： PROBLEM TO BE SOLVED: To reduce polishing time, and to enhance a distance and hit accuracy by determining a shallow water glass-like recess arrangeable even on a BB bullet having a diameter of 6 mm, that is, the number of dimples, an arranging position, and a shape, and improving straightness of a trajectory by increasing a specific gravity, while maintaining sphericity.
SOLUTION: A dimple arranging toy BB bullet is characterized in that a large number of dimples are arranged in a position for equalizing surface arranging density in a three-dimensional symmetrical position to the spherical center on a sphere surface. In the dimple BB bullet, the three-dimensional symmetrical and arranging density equal position is a position of the respective apexes of a regular polyhedron inscribed in a sphere, for example, a position of the respective apexes of an inscribed regular icosahedron.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了减少抛光时间，并且通过确定即使在直径为6mm的BB弹头上也可布置的浅水玻璃状凹部，即凹坑的数量来增加距离和打击精度，布置位置和形状，并且通过增加比重来提高轨迹的平直度，同时保持球形度。解决方案：一种凹坑布置玩具BB子弹的特征在于，将大量凹坑布置在使得三维对称位置中的表面排列密度与球体表面上的球形中心相等的位置。在凹坑BB子弹中，三维对称和排列密度相等的位置是刻在球体中的正多面体的各个顶点的位置，例如内接的正二值体积的各个顶点的位置。版权所有（C）2004，JPO

2. 发明申请

US20090322468A1 Chip Resistor and Manufacturing Method Thereof 审中-公开
标题翻译：芯片电阻及其制造方法
公开(公告)号：US20090322468A1
公开(公告)日：2009-12-31
申请号：US11916625
申请日：2006-06-01
申请人： Toshihiro Hanaoka , Shinji Murase
发明人： Toshihiro Hanaoka , Shinji Murase
IPC分类号： H01C1/012 , H01C17/00
CPC分类号： H01C17/006 , H01C1/01 , H01C1/144 , H01C1/148 , H01C7/003 , Y10T29/49082
摘要： [Problem] To provide a chip resistor and a method for manufacturing thereof, the chip resistor keeping easily soldering strength even if mounted in a horizontal position, and never projects from a holding recess of a positioning jig in a mounting process, and further does not hinder miniaturization thereof from being promoted, while keeping a good appearance thereof.[Means of Solution] In manufacturing a chip resistor 10, front-face electrodes 12 and resisters 13 are formed on the front face 20a of a large size substrate 20, and rear-face electrodes 16 are formed on the rear face 20b of the large size substrate 20. When the rear-face electrodes are formed, the rear-face electrodes 16 are extended to inclined faces of V-shaped grooves of second dividing grooves 22 on the rear face 20b and these extended parts are made to be side-face electrodes 16a. Then, the large size substrate 20 is divided along first dividing grooves 21 into strip substrates, and, after end-face electrodes 17 are formed on divided faces thereof by sputtering, the strip substrates 24 are divided along the second dividing grooves 22 and subjected to a plating process to provide an approximately square-prism shaped chip resistor 10 with electrodes exposed on each side face thereof.
摘要翻译：为了提供一种片式电阻器及其制造方法，芯片电阻器即使安装在水平位置也能够保持容易的焊接强度，并且在安装过程中不会从定位夹具的保持凹部突出，并且还不妨碍其小型化，同时保持其良好的外观。解决方案在制造片状电阻器10时，在大尺寸基板20的前表面20a上形成有正面电极12和电阻13，并且在大尺寸基板20的后表面20b上形成背面电极16 当背面电极形成时，背面电极16延伸到背面20b上的第二分割槽22的V形槽的倾斜面，并且这些延伸部分被制成侧面电极16a。然后，将大尺寸基板20沿着第一分割槽21分割成带状基板，并且在通过溅射在其分割面上形成端面电极17之后，沿着第二分割槽22分割带状基板24，电镀工艺提供一个近似方形棱柱形的片状电阻器10，其电极在其每个侧面上露出。

3. 发明授权

US09862158B2 Tire manufacturing method 有权
公开(公告)号：US09862158B2
公开(公告)日：2018-01-09
申请号：US13982282
申请日：2012-01-30
申请人： Shinji Murase
发明人： Shinji Murase
IPC分类号： B29D30/56 , B29D30/00 , B29D30/54 , B29D30/16 , B29D30/30
CPC分类号： B29D30/0061 , B29D30/1607 , B29D30/54 , B29D30/56 , B29D2030/3078 , B29D2030/544 , B29D2030/546
摘要： A tire manufacturing method to obtain a base tire superior in uniformity when the base tire has a cushion gum applied thereon. In this process of tire manufacture, the thickness from a belt, which is located in the outermost layer of the base tire having an application surface for the cushion gum, to the application surface is measured along the circumference of the base tire so as to detect a maximum thickness position. Then the circumferential winding of the cushion gum extruded from an extrusion molding unit is started from the maximum thickness position.

4. 发明授权

US4995437A Heavy duty pneumatic radial tires including a bent groove in the side face of the tread 失效
标题翻译：重型充气子午线轮胎在胎面的侧面包括弯曲的槽
公开(公告)号：US4995437A
公开(公告)日：1991-02-26
申请号：US275999
申请日：1988-11-25
申请人： Yasutaka Enoki , Shigeo Makino , Shinji Murase
发明人： Yasutaka Enoki , Shigeo Makino , Shinji Murase
IPC分类号： B60C9/08 , B60C11/00 , B60C11/01 , B60C11/04 , B60C11/13
CPC分类号： B60C11/01 , B60C11/1346
摘要： The uneven wear produced in the tread side rib in the heavy duty pneumatic radial tire is prevented by arranging a peripheral fine groove on a particular region of the side face of the tread portion in a particular form.

5. 发明申请

US20140020813A1 TIRE MANUFACTURING METHOD 有权
标题翻译：轮胎制造方法
公开(公告)号：US20140020813A1
公开(公告)日：2014-01-23
申请号：US13982282
申请日：2012-01-30
申请人： Shinji Murase
发明人： Shinji Murase
IPC分类号： B29D30/00
CPC分类号： B29D30/0061 , B29D30/1607 , B29D30/54 , B29D30/56 , B29D2030/3078 , B29D2030/544 , B29D2030/546
摘要： A tire manufacturing method to obtain a base tire superior in uniformity when the base tire has a cushion gum applied thereon. In this process of tire manufacture, the thickness from a belt, which is located in the outermost layer of the base tire having an application surface for the cushion gum, to the application surface is measured along the circumference of the base tire so as to detect a maximum thickness position. Then the circumferential winding of the cushion gum extruded from an extrusion molding unit is started from the maximum thickness position.
摘要翻译：一种轮胎制造方法，用于当基础轮胎上具有缓冲胶时获得均匀性优异的基础轮胎。在该轮胎制造过程中，沿着基础轮胎的圆周测量从位于具有缓冲胶的涂布面的基础轮胎的最外层到使用面的带的厚度，以便检测最大厚度位置。然后从最大厚度位置开始从挤压成型单元挤出的缓冲胶的周向卷绕。

6. 外观设计

USD326438S Automobile tire 失效
公开(公告)号：USD326438S
公开(公告)日：1992-05-26
申请号：US253289
申请日：1988-10-04
申请人： Tetsuhito Tsukagoshi , Naomichi Funato , Shinji Murase
设计人： Tetsuhito Tsukagoshi , Naomichi Funato , Shinji Murase

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