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1. 发明申请

US20090206001A1 SUBSTRATE CONTAINER 有权
标题翻译：基座容器
公开(公告)号：US20090206001A1
公开(公告)日：2009-08-20
申请号：US12301123
申请日：2007-05-21
申请人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
发明人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
IPC分类号： B65D85/90 , H01L21/673
CPC分类号： H01L21/67376
摘要： A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.
摘要翻译：容器包括：用于存储半导体晶片的衬底的容器主体; 门元件，其可拆卸地装配到所述容器主体的敞开的前部; 以及用于在容器主体和门元件之间密封的可压缩变形的垫圈。虽然用于垫圈的密封表面形成在容器主体的敞开的前部的内周上，使得平坦度的最大和最小之间的差小于0.50mm，但是垫圈的嵌合部分形成在框架形状。垫圈由安装在装配部上的底座形成; 柔性密封部件，从基部向密封面延伸; 以及在密封部的前端弯曲地形成并与密封面压接的接触部。

2. 发明授权

US06581264B2 Transportation container and method for opening and closing lid thereof 失效
公开(公告)号：US06581264B2
公开(公告)日：2003-06-24
申请号：US10199896
申请日：2002-07-19
申请人： Shinichi Ohori , Hideaki Aoki
发明人： Shinichi Ohori , Hideaki Aoki
IPC分类号： B23P1900
CPC分类号： H01L21/67369 , H01L21/67373 , H01L21/67379 , H01L21/67386 , H01L21/67772 , H01L21/67775 , Y10S414/14 , Y10T29/49815 , Y10T29/49822 , Y10T29/49876
摘要： A transportation container comprises: a container body for housing a plurality of semiconductor wafers; a detachable lid adapted to engage in and cover an open front face of the container body via a seal gasket; and a locking mechanism adapted to fix the lid engaged into the open front face of the container body. The locking mechanism has a pair of protrusions formed at the opposing sides of a rim of the open end face of the container body. The locking mechanism also has a pair of clamp plates which are pivotally supported on the opposing sides of the lid to clamp the protrusions. Each protrusion has, on the back thereof, a groove with a semi-circular cross-section to be clamped. Each clamp plate has attachment shafts for the lid formed in one end of the clamp plate. The clamp plate also has operated parts for automatized operation formed in the other end of the clamp plate. The operated part has a Y-shape in cross-section. Each clamp plate being provided with a U-shaped groove holes to be fitted with the protrusion. A clamping piece is allowed to be inserted and fitted in the clamping groove, so that it is adapted to be bent in the thickness direction of the clamp plate.

3. 发明授权

US06446806B1 Transportation container and method for opening and closing lid thereof 失效
标题翻译：运输集装箱及其开闭盖的方法
公开(公告)号：US06446806B1
公开(公告)日：2002-09-10
申请号：US09563637
申请日：2000-05-02
申请人： Shinichi Ohori , Hideaki Aoki
发明人： Shinichi Ohori , Hideaki Aoki
IPC分类号： B65D8548
CPC分类号： H01L21/67373 , H01L21/67376 , H01L21/67379 , H01L21/67386 , H01L21/67772 , H01L21/67775
摘要： A transportation container comprises: a container body for housing a plurality of semiconductor wafers; a detachable lid adapted to engage in and cover an open front face of the container body via a seal gasket; and a locking mechanism adapted to fix the lid engaged into the open front face of the container body. The locking mechanism has a pair of protrusions formed at the opposing sides of a rim of the open end face of the container body. The locking mechanism also has a pair of clamp plates which are pivotally supported on the opposing sides of the lid to clamp the protrusions. Each protrusion has, on the back thereof, a groove with a semi-circular cross-section to be clamped. Each clamp plate has attachment shafts for the lid formed in one end of the clamp plate. The clamp plate also has operated parts for automatized operation formed in the other end of the clamp plate. The operated part has a Y-shape in cross-section. Each clamp plate being provided with a U-shaped groove holes to be fitted with the protrusion. A clamping piece is allowed to be inserted and fitted in the clamping groove, so that it is adapted to be bent in the thickness direction of the clamp plate.
摘要翻译：运输容器包括：用于容纳多个半导体晶片的容器主体; 可拆卸的盖子，适于通过密封垫片接合并覆盖容器主体的敞开的前表面; 以及适于将接合到所述容器主体的敞开的前表面上的盖固定的锁定机构。锁定机构具有形成在容器主体的开口端面的边缘的相对侧上的一对突起。锁定机构还具有一对夹板，其被枢转地支撑在盖的相对侧上以夹紧突起。每个突起在其后面具有待夹紧的具有半圆形横截面的凹槽。每个夹板具有用于形成在夹板的一端中的盖的附接轴。夹板还具有在夹板的另一端形成的用于自动操作的操作部件。操作部分的横截面为Y形。每个夹板设置有与凸起配合的U形凹槽。允许夹持件插入并装配在夹紧槽中，使其适于在夹紧板的厚度方向上弯曲。

4. 发明授权

US5950843A Device for preventing contacting of wafers in wafer cassette 失效
标题翻译：用于防止晶片盒中的晶片接触的装置
公开(公告)号：US5950843A
公开(公告)日：1999-09-14
申请号：US55963
申请日：1998-04-07
申请人： Shinichi Ohori
发明人： Shinichi Ohori
IPC分类号： B65G49/07 , B65D85/86 , H01L21/673 , A47F7/00
CPC分类号： H01L21/67369 , H01L21/67383
摘要： A device for preventing wafer materials, such as semiconductor silicon wafers, held on a wafer cassette by inserting the wafers into respective wafer alignment grooves from contacting with adjacent wafers due to the larger width of the grooves than the thickness of the wafers to allow tilting thereof. The device is a rectangular frame mountable on the wafer cassette and provided on each of two oppositely facing sides with a wafer holding member in the form of a comb having comb teeth with the same regular pitch as that of the alignment grooves, the slit between adjacent comb teeth, into which the periphery of the wafer is inserted, having a width somewhat larger than the thickness of the wafer but smaller than the width of the wafer alignment groove to decrease the shaky condition of the wafer material.
摘要翻译：一种用于防止晶片材料（例如半导体硅晶片）通过将晶片插入相应的晶片对准槽中而与相邻的晶片接触而防止晶片材料（例如半导体硅晶片）的装置，这是由于沟槽的宽度大于晶片的厚度而允许其倾斜。该装置是可安装在晶片盒上的矩形框架，并且设置在两个相对侧面的每一侧上，其中具有梳齿形式的晶片保持构件具有与对准槽相同的规则间距的梳齿，相邻的狭缝梳齿，其中晶片的周边插入其中，具有稍大于晶片的厚度的宽度，但小于晶片对准槽的宽度，以减小晶片材料的抖动状态。

5. 发明申请

US20120325708A1 SUBSTRATE STORAGE CONTAINER 审中-公开
标题翻译：基板存储容器
公开(公告)号：US20120325708A1
公开(公告)日：2012-12-27
申请号：US13603497
申请日：2012-09-05
申请人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
发明人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
IPC分类号： H01L21/673 , B65D85/30
CPC分类号： H01L21/67376
摘要： A substrate storage container includes: a container body molded of molding material in a front open box type for storing substrates; a door element fitted to an opening at the front of the container body; and a compressively deformable gasket for sealing between the container body and the door element. The opening of the container body is projected sidewards and outwards forming a rim portion. A sealing surface for the gasket is formed on an inner surface of the rim portion. The container body is formed with a reinforcing rib directed toward the rim portion. An opposing portion of the reinforcing rib that opposes the rim portion of the container body is reduced in thickness so as to prevent a depression from forming in the sealing surface of the rim portion during molding the container body.
摘要翻译：基板存储容器包括：容器主体，其以用于存储基板的前开箱形式的成型材料模制; 安装在容器主体前部开口处的门元件; 以及用于在容器主体和门元件之间密封的可压缩变形的垫圈。容器主体的开口向外侧向外侧突出形成边缘部。用于垫圈的密封表面形成在边缘部分的内表面上。容器主体形成有朝向边缘部分的加强肋。加强肋的与容器主体的边缘部分相对的相对部分的厚度减小，以防止在模制容器主体期间在边缘部分的密封表面中形成凹陷。

6. 发明授权

US5782362A Wafer cassette in wafer carrier 失效
标题翻译：晶圆托架中的晶圆盒
公开(公告)号：US5782362A
公开(公告)日：1998-07-21
申请号：US729978
申请日：1996-10-11
申请人： Shinichi Ohori
发明人： Shinichi Ohori
IPC分类号： B65D85/86 , B65D25/10 , H01L21/673 , B65D85/46
CPC分类号： H01L21/67369 , B65D25/107 , H01L21/67326 , H01L21/67383
摘要： A wafer cassette of a wafer carrier holds a plurality of wafer materials such as semiconductor single crystal silicon wafers. The wafer cassette is contained in a box body having a covering for transportation and storage of the silicon wafers with safety from contamination and mechanical damage. The wafer cassette is a casing have an opening in the upper and lower surfaces and having a pair of opposite side walls each of which is provided on the inner surface thereof with a plurality of alignment grooves for receiving wafer materials in parallel with each other. The wafer cassette is provided with wafer presser plates each covering the upper or lower surface in a freely demountable fashion each of which having a pair of engageable parts on two opposite sides thereof. A plurality of elastic plates are provided at the center of the plates, between the pair of the engageable parts, in alignment in the direction of the wafer materials held on the cassette. A protrusion extends from each of the elastic plates and the surface of the protrusions are engraved to form a groove having a V-shaped cross section to receive a wafer material.
摘要翻译：晶片载体的晶片盒保持多个晶片材料，例如半导体单晶硅晶片。晶片盒装在具有覆盖物的盒体中，用于在不影响污染和机械损伤的情况下运输和储存硅晶片。晶片盒是具有在上表面和下表面上的开口的壳体，并且具有一对相对的侧壁，每个相对的侧壁在其内表面上设置有用于彼此平行地接收晶片材料的多个对准槽。晶片盒设置有晶片压板，每个晶片压板以可自由拆卸的方式覆盖上表面或下表面，其中每一个在其两个相对侧上具有一对可接合部分。多个弹性板在板的中心处设置在一对可接合部分之间，沿着保持在盒上的晶片材料的方向对准。突起从每个弹性板延伸，并且突起的表面被雕刻以形成具有V形横截面的凹槽以接收晶片材料。

7. 发明授权

US08292081B2 Substrate storage container 有权
标题翻译：基材储存容器
公开(公告)号：US08292081B2
公开(公告)日：2012-10-23
申请号：US12301123
申请日：2007-05-21
申请人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
发明人： Shigenobu Sasaki , Shinichi Ohori , Hiroki Yamagishi
IPC分类号： B65D85/90
CPC分类号： H01L21/67376
摘要： A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.
摘要翻译：容器包括：用于存储半导体晶片的衬底的容器主体; 门元件，其可拆卸地装配到所述容器主体的敞开的前部; 以及用于在容器主体和门元件之间密封的可压缩变形的垫圈。虽然用于垫圈的密封表面形成在容器主体的敞开的前部的内周上，使得平坦度的最大和最小之间的差小于0.50mm，但是垫圈的嵌合部分形成在框架形状。垫圈由安装在装配部上的底座形成; 柔性密封部件，从基部向密封面延伸; 以及在密封部的前端弯曲地形成并与密封面压接的接触部。

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