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1. 发明授权

US06853205B1 Probe card assembly 有权
标题翻译：探头卡组合
公开(公告)号：US06853205B1
公开(公告)日：2005-02-08
申请号：US10620448
申请日：2003-07-17
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： G01R1/073 , G01R1/18 , G01R31/28 , G01R31/02
CPC分类号： G01R1/07342 , G01R1/06733 , G01R1/18 , G01R31/2889
摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.
摘要翻译：公开了一种探针卡组件。探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。在探针头托架的中心处形成一个凹陷。然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

2. 发明授权

US06812720B1 Modularized probe card with coaxial transmitters 失效
标题翻译：带同轴发射器的模块化探头卡
公开(公告)号：US06812720B1
公开(公告)日：2004-11-02
申请号：US10417263
申请日：2003-04-17
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： G01R3102
CPC分类号： G01R31/2889
摘要： A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly connecting two ends of each coaxial cable of the coaxial transmitter for electrically connecting corresponding in location to first printed circuit board and second printed circuit board. A probe head is bonded on second printed circuit board. The second connector of the coaxial transmitter is connected with the second printed circuit board in a plug-in and pull-away type.
摘要翻译：公开了一种具有同轴发射机的模块化探头卡。至少一个同轴发射器被模块化并安装在第一印刷电路板和第二印刷电路板之间。同轴发射机具有第一连接器和第二连接器，其相应地连接同轴发射器的每个同轴电缆的两端，用于将相应的位置电连接到第一印刷电路板和第二印刷电路板。探头位于第二印刷电路板上。同轴发射机的第二连接器以插拔式连接第二印刷电路板。

3. 发明授权

US06781392B1 Modularized probe card with compressible electrical connection device 有权
标题翻译：带可压缩电气连接装置的模块化探头卡
公开(公告)号：US06781392B1
公开(公告)日：2004-08-24
申请号：US10435560
申请日：2003-05-12
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： G01R3102
CPC分类号： G01R1/07378
摘要： A modularized probe card comprising an interface board, a probe head and at least a compressible electrical connection device is disclosed. The compressible electrical connection device comprises an insulation layer with a plurality of circuits on one of its surface. Two ends of each circuit connect respectively to the first contacting pad and the second contacting pad which combine with elastic contact members. Each elastic contact member has a supporter combining with a conductive layer for electrical connections by pushing and compressing. While a probe head is modularized installed on an interface board, the elastic contact members of the compressible electrical connection device is elastically contacted and compressed the probe head and the interface board to acquire modularized electrical connection of the probe card.
摘要翻译：公开了一种包括接口板，探头和至少可压缩电连接装置的模块化探针卡。可压缩电连接装置包括在其表面之一上具有多个电路的绝缘层。每个电路的两端分别连接到与弹性接触构件组合的第一接触垫和第二接触垫。每个弹性接触构件具有通过推压和压缩与电连接的导电层组合的支撑件。当探头头被模块化安装在接口板上时，可压缩电连接装置的弹性接触件弹性接触并压缩探针头和接口板，以获得探针卡的模块化电连接。

4. 发明授权

US07140101B2 Method for fabricating anisotropic conductive substrate 有权
标题翻译：制造各向异性导电基板的方法
公开(公告)号：US07140101B2
公开(公告)日：2006-11-28
申请号：US10671735
申请日：2003-09-29
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： H05K3/36 , B32B5/16
CPC分类号： H01R43/007 , Y10S428/901 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/4921 , Y10T428/24917
摘要： A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 μm and 250 μm. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.
摘要翻译：公开了一种用于制造各向异性导电衬底的方法。后盖在其表面上具有金属销。在后支架的表面上用金属销形成液体化合物。液体化合物被压制以使金属销变形成液体化合物中的电极。液体化合物的上表面和下表面之间的厚度在25μm和250μm之间。电极具有从液体化合物的上表面和下表面暴露的上端和下端，以提供各向异性导电的电接触。

5. 发明授权

US06946860B2 Modularized probe head 有权
标题翻译：模块化探头
公开(公告)号：US06946860B2
公开(公告)日：2005-09-20
申请号：US10680230
申请日：2003-10-08
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/28 , G01R31/02 , G01R31/26
CPC分类号： G01R31/2887
摘要： A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.
摘要翻译：用于模块化组装在探针卡上的模块化探头被配置用于探测被测半导体晶片。探头包括具有活性表面和相对背面的硅衬底。硅衬底的背面附着在支架上。硅衬底在其有源表面上具有多个外围接合焊盘和接触焊盘。至少探测芯片安装在硅衬底的有源表面上。探测芯片具有探测尖端和侧面电极。侧电极通过焊料与接触焊盘连接。硅衬底的周边接合焊盘与用于电连接到探针卡的多层印刷电路板的柔性印刷电路连接。

6. 发明申请

US20050012513A1 PROBE CARD ASSEMBLY 有权
标题翻译：探索卡大会
公开(公告)号：US20050012513A1
公开(公告)日：2005-01-20
申请号：US10620448
申请日：2003-07-17
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： G01R1/073 , G01R1/18 , G01R31/28 , G01R31/02
CPC分类号： G01R1/07342 , G01R1/06733 , G01R1/18 , G01R31/2889
摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.
摘要翻译：公开了一种探针卡组件。探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。在探针头托架的中心处形成一个凹陷。然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

7. 发明授权

US06621710B1 Modular probe card assembly 失效
标题翻译：模块化探头卡组合
公开(公告)号：US06621710B1
公开(公告)日：2003-09-16
申请号：US10198118
申请日：2002-07-19
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： H01R900
CPC分类号： H01R13/22 , H01R2201/20
摘要： A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.
摘要翻译：模块化探针卡组件包括具有模块地组装在主板上的探针的硅衬底。至少一个插座安装在硅衬底周围，并通过柔性印刷布线膜电连接到探针上。多个可拆卸的同轴线将插座与主板电连接以实现制造期间的连接路径的变化。因此，探针卡组件具有可调节的修正效果，适用于高速测试。

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