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1. 发明申请

US20070215820A1 Methods and systems for thermal-based laser processing a multi-material device 有权
公开(公告)号：US20070215820A1
公开(公告)日：2007-09-20
申请号：US11643023
申请日：2006-12-20
申请人： James Cordingley , Jonathan Ehrmann , David Filgas , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
发明人： James Cordingley , Jonathan Ehrmann , David Filgas , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
IPC分类号： G21K5/10
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

2. 发明申请

US20070052791A1 Methods and systems for thermal-based laser processing a multi-material device 有权
标题翻译：用于热基激光加工多材料装置的方法和系统
公开(公告)号：US20070052791A1
公开(公告)日：2007-03-08
申请号：US11593797
申请日：2006-11-07
申请人： James Cordingley , Jonathan Ehrmann , David Filgas , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
发明人： James Cordingley , Jonathan Ehrmann , David Filgas , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
IPC分类号： B41J2/47
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不希望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

3. 发明申请

US20060205121A1 Method and system for high-speed, precise micromachining an array of devices 失效
标题翻译：用于高速，精确微加工器件阵列的方法和系统
公开(公告)号：US20060205121A1
公开(公告)日：2006-09-14
申请号：US11415653
申请日：2006-05-02
申请人： Bruce Couch , Jonathan Ehrmann , Joseph Lento , Shepard Johnson
发明人： Bruce Couch , Jonathan Ehrmann , Joseph Lento , Shepard Johnson
IPC分类号： H01L21/82
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。使用非连续共线切割，使用斑点扇出平行切割和使用逆行扫描技术实现更快的共线切割，使用非测量切割来限制电阻测量的数量。非顺序切割也用于管理热效应，校准切割用于提高精度。控制测试电压以避免电阻损坏。

4. 发明申请

US20060192845A1 Methods and systems for thermal-based laser processing a multi-material device 有权
公开(公告)号：US20060192845A1
公开(公告)日：2006-08-31
申请号：US11415547
申请日：2006-05-02
申请人： James Cordingley , Jonathan Ehrmann , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
发明人： James Cordingley , Jonathan Ehrmann , Shepard Johnson , Joohan Lee , Donald Smart , Donald Svetkoff
IPC分类号： B41J2/47
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

5. 发明申请

US20060160332A1 Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby 有权
标题翻译：用于高速精密激光修整的方法和系统，用于其中的扫描透镜系统以及由此产生的电气装置
公开(公告)号：US20060160332A1
公开(公告)日：2006-07-20
申请号：US11245282
申请日：2005-10-06
申请人： Bo Gu , Joseph Lento , Jonathan Ehrmann , Bruce Couch , Yun Chu , Shepard Johnson
发明人： Bo Gu , Joseph Lento , Jonathan Ehrmann , Bruce Couch , Yun Chu , Shepard Johnson
IPC分类号： H01L21/78 , A61N5/00 , H01L21/301
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/082
摘要： A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
摘要翻译：提供了一种方法，系统和扫描透镜系统，用于高速，基于激光的，精确的激光修剪至少一个电气元件。该方法包括以重复率产生具有一个或多个激光脉冲的脉冲激光输出。每个激光脉冲具有脉冲能量，激光波长范围内的激光波长和脉冲持续时间。所述方法还包括选择性地照射所述至少一个电气元件，所述一个或多个激光脉冲聚焦在沿着方向具有不均匀强度分布的至少一个点和小至约6微米至约15微米的光点直径上以使所述一个或多个激光脉冲从所述至少一个元件中选择性地去除材料，并激光修整所述至少一个元件，同时避免所述至少一个元件内的实质微裂纹。波长足够短以产生小斑点尺寸，紧度公差和高吸收性能所需的短波长益处，但不会如此短，从而导致微裂纹。

6. 发明申请

US20080094640A1 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure 审中-公开
标题翻译：用于精确地相对定位脉冲激光束腰部的方法和系统以及用于控制输送到目标结构的能量的方法
公开(公告)号：US20080094640A1
公开(公告)日：2008-04-24
申请号：US11643746
申请日：2006-12-21
申请人： James Cordingley , Joseph Griffiths , Shepard Johnson , Donald Smart
发明人： James Cordingley , Joseph Griffiths , Shepard Johnson , Donald Smart
IPC分类号： G01B11/14 , B23K26/38 , B23K26/06
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

7. 发明申请

US20060191884A1 High-speed, precise, laser-based material processing method and system 审中-公开
标题翻译：高速精密激光材料加工方法和系统
公开(公告)号：US20060191884A1
公开(公告)日：2006-08-31
申请号：US11334118
申请日：2006-01-18
申请人： Shepard Johnson , Bo Gu , James Cordingley
发明人： Shepard Johnson , Bo Gu , James Cordingley
IPC分类号： B23K26/00
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0622 , B23K26/08 , B23K26/0853 , B23K2101/36 , H01L2924/0002 , H01S3/0085 , H01S3/1302 , H01S3/2308 , H01L2924/00
摘要： A high-speed, precise, laser-based material processing method and system are provided wherein relative movement of target material and a pulsed laser output used to process the material are synchronized. The laser-based system includes a pulsed laser source for generating a set of laser pulses, and a laser output control that controllably selects a subset of pulses from the set of laser pulses at a position beyond the laser source to obtain the pulsed laser output. The laser-based system further includes a mechanism for synchronizing the pulsed laser output with relative movement of the target material. A beam delivery and focusing subsystem delivers at least a portion of the synchronized pulsed laser output to the target material as a laser material processing output to process the target material. A positioning subsystem moves the target material relative to the pulsed laser output.
摘要翻译：提供了高速，精确的基于激光的材料处理方法和系统，其中用于处理材料的目标材料和脉冲激光输出的相对运动是同步的。基于激光的系统包括用于产生一组激光脉冲的脉冲激光源和激光输出控制器，该激光器输出控制器在超过激光源的位置处可控地选择来自该组激光脉冲的脉冲子集以获得脉冲激光输出。基于激光的系统还包括用于使脉冲激光输出与目标材料的相对运动同步的机构。光束传送和聚焦子系统将同步脉冲激光输出的至少一部分作为激光材料处理输出提供给目标材料，以处理目标材料。定位子系统相对于脉冲激光输出移动目标材料。

8. 发明申请

US20050150880A1 Laser-based method and system for memory link processing with picosecond lasers 审中-公开
公开(公告)号：US20050150880A1
公开(公告)日：2005-07-14
申请号：US11004773
申请日：2004-12-03
申请人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
发明人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H05K3/00
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.

9. 发明申请

US20050092720A1 Laser-based method and system for memory link processing with picosecond lasers 审中-公开
公开(公告)号：US20050092720A1
公开(公告)日：2005-05-05
申请号：US11003885
申请日：2004-12-03
申请人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
发明人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H05K3/00
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.

10. 发明申请

US20070199927A1 Laser-based method and system for removing one or more target link structures 有权
标题翻译：用于去除一个或多个目标链路结构的基于激光的方法和系统
公开(公告)号：US20070199927A1
公开(公告)日：2007-08-30
申请号：US11700386
申请日：2007-01-31
申请人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
发明人： Bo Gu , Donald Smart , James Cordingley , Joohan Lee , Donald Svetkoff , Shepard Johnson , Jonathan Ehrmann
IPC分类号： B23K26/38
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

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