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1. 发明申请

WO2018210884A2 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A2
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08
摘要： A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

2. 发明申请

WO2018178348A1 AUTOMATIC PICK-UP EQUIPMENT 审中-公开
公开(公告)号：WO2018178348A1
公开(公告)日：2018-10-04
申请号：PCT/EP2018/058321
申请日：2018-03-30
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： DAI, Zhiyong , HU, Lvhai , DENG, Yingcong , ZENG, Qinglong , KANG, Wei
IPC分类号： B25J15/00 , B25J15/02
摘要： An automatic pick-up equipment for picking up components with different shapes, comprises: a base (1) mounted on a manipulator of a robot; a first pick-up device (2) mounted on the base and comprising two first gripping mechanisms opposite to each other, which are configured to linearly reciprocate relative to each other to hold a first component (300); and a second pick-up device (3) mounted on the base. The second pick-up device comprises: two second gripping mechanisms (31) opposite to each other, which are configured to pivotally reciprocate relative to each other to grip a second component (400); and a rotation mechanism (32) configured to drive the two second gripping mechanisms to rotate relative to the baseto change a posture of the gripped second component. The automatic pick-up equipment is adapted to pick up components with different shapes and sizes by different gripping ways.

3. 发明申请

WO2014046922A1 SOLDERING MACHINE 审中-公开
标题翻译：焊接机
公开(公告)号：WO2014046922A1
公开(公告)日：2014-03-27
申请号：PCT/US2013/059126
申请日：2013-09-11
申请人： TYCO ELECTRONICS CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD.
发明人： LU, Roberto Francisco-YI , ZENG, Qinglong , FRY, Charles David , CHEN, Bicheng
IPC分类号： B23K1/00 , B23K3/08 , H01R43/02
CPC分类号： H05K13/06 , B23K1/0016 , B23K3/087 , B23K2201/42 , H01R43/0263
摘要： A soldering machine (100) includes a frame (110) and a fixture (106) held by the frame that supports a substrate (104) and a cable. A guidance system (160) is supported by the frame with a camera (102) viewing the fixture that is movable relative to the fixture. A positioning system is supported by the frame. The positioning system (120) has a camera positioner and a soldering mechanism positioner (130). A soldering mechanism (122) is coupled to the soldering mechanism positioner and is moved by the soldering mechanism positioner relative to the fixture. The soldering mechanism solders wires (103) to the substrate. A controller (170) communicates with the positioning system and the guidance system to operates the positing system to control positions of the camera and soldering mechanism relative to the fixture based on an image obtained by the camera.
摘要翻译：焊接机（100）包括框架（110）和由框架保持的固定件（106），支撑基板（104）和电缆。引导系统（160）由框架支撑，相机（102）观察可相对于固定装置移动的固定装置。定位系统由框架支撑。定位系统（120）具有相机定位器和焊接机构定位器（130）。焊接机构（122）耦合到焊接机构定位器，并且通过焊接机构定位器相对于固定装置移动。焊接机构将线（103）焊接到基板。控制器（170）与定位系统和引导系统进行通信，以基于由照相机获得的图像来操作定位系统以控制摄像机和焊接机构相对于固定装置的位置。

4. 发明申请

WO2018011718A1 CHIP SORTING AND PACKAGING PLATFORM 审中-公开
标题翻译：芯片分拣和包装平台
公开(公告)号：WO2018011718A1
公开(公告)日：2018-01-18
申请号：PCT/IB2017/054192
申请日：2017-07-12
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： ZHOU, Lei , ZHANG, Dandan , LU, Roberto Francisco-Yi , ZENG, Qinglong
IPC分类号： B07C5/344 , B07C5/36
摘要： The present disclosure discloses a chip sorting and packaging platform including: a feed module adapted to feed chips; a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module configured to package the qualified chips sorted by the sorting module. In the present disclosure, the sorting and packaging of the clips is automatically achieved by the chip sorting and packaging platform, which greatly improves efficiency of sorting and packaging of the clips. In addition, it is also possible to improve accuracy and reliability of sorting the clips.
摘要翻译：本公开公开了一种芯片分类和包装平台，包括：馈送模块，适于馈送芯片; 分拣模块，用于拾取由供给模块供给的芯片并检测拾取的芯片以确定拾取的芯片是否合格; 以及封装模块，其被配置为封装由分类模块分类的合格芯片。在本发明中，通过芯片分拣包装平台自动实现夹具的分拣和包装，大大提高了夹具分拣包装的效率。此外，还可以提高分类剪辑的准确性和可靠性。

5. 发明申请

WO2014046921A1 DISPENSING MACHINE AUTOMATICALLY DISPENSING FLUID TO PREDETERMINED LOCATIONS 审中-公开
标题翻译：分配机自动分配流体到预定位置
公开(公告)号：WO2014046921A1
公开(公告)日：2014-03-27
申请号：PCT/US2013/059111
申请日：2013-09-11
申请人： TYCO ELECTRONICS CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD.
发明人： LU, Roberto Francisco-Yi , ZENG, Qinglong , FRY, Charles David , CHEN, Bicheng
IPC分类号： B05B12/12 , H05K3/10
CPC分类号： B05C9/10 , B05B12/122 , B05C5/0216 , B05C11/1021 , B05D1/00 , H05K3/3484 , H05K13/0469 , H05K2203/0126 , H05K2203/163
摘要： A fluid dispensing machine (100) includes a frame (110) and a fixture (106) held by the frame. The fixture is configured to support a substrate (104). A positioning system (120) is supported by the frame. A guidance system (160) is supported by the positioning system. The guidance system has a camera (102) viewing the fixture that is movable relative to the fixture. A fluid dispenser (122) is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller (170) communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the fluid dispenser relative to the fixture based on an image obtained by the camera.
摘要翻译：流体分配机器（100）包括框架（110）和由框架保持的夹具（106）。夹具被构造成支撑衬底（104）。定位系统（120）由框架支撑。引导系统（160）由定位系统支撑。引导系统具有观察可相对于固定装置移动的固定装置的照相机（102）。流体分配器（122）由定位系统支撑并且被定位系统相对于固定装置移动。流体分配器构造成将流体分配到基底上。控制器（170）与定位系统和引导系统进行通信。控制器操作定位系统，以基于由照相机获得的图像来控制流体分配器相对于固定装置的位置。

6. 发明申请

WO2018172470A9 HEAT SHRINKABLE TUBE ASSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A9
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

7. 发明申请

WO2018210878A1 ASSEMBLY SYSTEM ADAPTED TO ASSEMBLE A HEAT SHRINKABLE TUBE ONTO AN ELECTRICAL WIRE 审中-公开
公开(公告)号：WO2018210878A1
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062616
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system includes: a feeding mechanism configured to feed a heat shrinkable tube; a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube fed by the feeding mechanism; a robot adapted to grip the segment of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product. The assembly system may realize the automatic assembly of the heat shrinkable tube, thereby improving the assembly efficiency and ensuring the assembly accuracy.

8. 发明申请

WO2018167232A1 FIXING SYSTEM AND METHOD OF SOLDERING WIRE 审中-公开
公开(公告)号：WO2018167232A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056585
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , MEASUREMENT SPECIALTIES (CHINA) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： DENG, Yingcong , ZHONG, Xiaojun , NING, Ke , LI, Xiaocong , TAN, Guiqin , LIU, Yun , ZHANG, Dandan , HU, Lvhai , ZENG, Qinglong
IPC分类号： B23K3/08 , B23K1/00 , H05K3/34
CPC分类号： B23K3/087 , B23K1/0016 , B23K3/00 , H05K3/3421 , H05K3/3494 , H05K2203/0278 , H05K2203/049
摘要： The present invention discloses a fixing system comprising a base (1) and at least one set of clamping devices (2) mounted on the base. Each set of clamping devices includes a first fixture (100), in which a first positioning groove (111), adapted to accommodate and position a circuit board (10) is formed. When the first fixture is mounted on the base, a first angle defined between a bottom surface (111a) of the first positioning groove and a horizontal surface of the base is more than 0 degree and less than 90 degrees, so that the circuit board positioned in the first positioning groove is inclined with respect to the horizontal surface of the base. Because the fixing system is adapted to hold the circuit board obliquely in a predetermined position, during soldering, the melted solder may flow downward automatically along the inclined circuit board, increasing the coverage rate of the solder and making the soldered surfaces smooth and flat.

9. 发明申请

WO2015028909A2 PROGRAM-CONTROLLED AUTOMATIC SOLDERING SYSTEM AND METHOD 审中-公开
标题翻译：程序控制自动焊接系统及方法
公开(公告)号：WO2015028909A2
公开(公告)日：2015-03-05
申请号：PCT/IB2014063732
申请日：2014-08-06
申请人： TYCO ELECTRONICS CORP , SHENZHEN AMI TECHNOLOGY CO LTD , TYCO ELECTRONICS LTD UK
发明人： CHEN BICHENG , ZENG QINGLONG , LU ROBERTO FRANCISCO-YI
IPC分类号： B23K1/00
CPC分类号： B23K1/0056 , B23K1/0016 , B23K26/03 , B23K26/04 , B25J9/1697 , G05B2219/45138
摘要： A program-controlled automatic soldering system, comprising: a laser source configured to emit a laser beam; a laser scan head configured to receive the laser beam from the laser source and focus the laser beam on a target position in a work area; a vision system; and a moving device configured to move products under a guidance of the vision system to a position where portions of the products to be soldered overlap the target position, so that the focused laser beam heats a solder material provided on the portions of the products to be soldered to solder the products together.
摘要翻译：一种程序控制的自动焊接系统，包括：被配置为发射激光束的激光源; 激光扫描头，被配置为从激光源接收激光束并将激光束聚焦在工作区域中的目标位置; 视觉系统; 以及移动装置，其被配置为在视觉系统的引导下将产品移动到待焊接的产品的一部分与目标位置重叠的位置，使得聚焦的激光束加热设置在产品的部分上的焊料材料焊接焊接产品在一起。

10. 发明申请

WO2018229122A1 WIRE FIXATION APPARATUS AND SOLDERING METHOD 审中-公开
公开(公告)号：WO2018229122A1
公开(公告)日：2018-12-20
申请号：PCT/EP2018/065650
申请日：2018-06-13
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , MEASUREMENT SPECIALTIES (CHINA) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： DENG, Yingcong , ROCHETTE, Jeffrey , CAI, Qiyu , ZHOU, Yang , LIAO, Wenzhao , LAN, Yumin , FU, Yanbing , LIU, Yun , ZHANG, Dandan , ZENG, Qinglong
IPC分类号： B23K1/00 , H05K3/34 , H05K3/32 , H05K3/30
摘要： A fixation apparatus includes a base, a wire fixing device and a pressing device. The wire fixing device includes a fixing frame fixedly mounted on the base, and a moving unit received in a receiving chamber of the fixing frame and movable between a clamping position and a release position. The receiving chamber of the fixing frame is formed with a first positioning groove in a first side wall thereof, and the moving unit is provided with a second positioning groove coupled with the first positioning groove. The wire is allowed to be inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position; and the wire inserted into the wire insertion hole is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position. Thus, it is possible to conveniently hold the wire within the insertion hole in the circuit board and ensure a center of the wire to be aligned with that of the wire insertion hole to improve soldering quality.

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